EP1K30FI256-2

The EP1K30FI256-2 is an ACEX-1K family programmable logic device from Intel, delivering mid-density FPGA capability in a compact 256-pin FineLine BGA package. It pairs a logic array and embedded array blocks (EABs) to support system-on-a-programmable-chip (SOPC) integration, memory-intensive functions and general-purpose logic in communications and industrial designs.

With 1,728 logic elements, approximately 24,576 bits of embedded RAM, and 171 user I/O pins, this industrial-grade device targets applications that require moderate logic density, on-chip dual-port memory and broad I/O flexibility while operating across an extended temperature range.

Key Features

• Logic Capacity  1,728 logic elements providing programmable logic for control, glue logic and moderate-complexity functions.
• Embedded Memory (EABs)  Approximately 24,576 total RAM bits implemented via embedded array blocks to support efficient on-chip storage and dual-port memory operation.
• Gate Density  Support for up to 119,000 system gates for designs needing a mix of logic and memory resources.
• Rich I/O  171 user I/O pins to connect peripherals, buses and external devices; I/O behavior supports multiple signaling options described in the ACEX-1K family data.
• Package and Mounting  256-pin FineLine BGA (256-FBGA, 17×17) in a surface-mount package for compact board integration.
• Voltage and Power  Device supply range of 2.375 V to 2.625 V with an internal 2.5 V core supply as specified for the ACEX-1K family.
• Industrial Temperature  Rated for operation from −40°C to 85°C for use in industrial environments.
• Design & Test Support  JTAG boundary-scan (IEEE 1149.1) support for in-system test and configuration; family tools and design flows are provided for synthesis, place-and-route and simulation as described in the ACEX-1K documentation.
• Flexible Architecture  Features from the ACEX-1K series such as dedicated carry and cascade chains, low-skew clock distribution and continuous routing (FastTrack interconnect) to support arithmetic and high-fan-in logic implementations.

Typical Applications

• Communications Equipment  Packet buffering, protocol processing and interface bridging where embedded dual-port memory and flexible I/O are needed.
• System-on-a-Programmable-Chip (SOPC)  Integration of custom logic, on-chip memory and peripheral interfaces for compact system designs.
• Industrial Control  Control logic, sensor interfacing and I/O aggregation in industrial systems benefitting from the device’s extended temperature rating.
• Embedded Memory-Intensive Functions  Lookup tables, small FIFOs and specialized memory-backed megafunctions implemented using the EABs and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory: 1,728 logic elements combined with approximately 24,576 bits of embedded RAM enable designs that require both programmable logic and on-chip storage without external memory for many use cases.
• High I/O Count in a Compact Package: 171 user I/Os in a 256-FBGA (17×17) package lets you implement wide interfaces while maintaining a small PCB footprint.
• Industrial Temperature Range: Qualified for −40°C to 85°C operation, suitable for a broad range of industrial applications.
• In-System Test and Configuration: JTAG boundary-scan support simplifies production test and field reconfiguration workflows.
• Efficient Arithmetic and Routing: Dedicated carry and cascade chains plus FastTrack interconnect support common arithmetic and high-fan-in functions with predictable routing performance.
• Vendor Ecosystem: Part of the ACEX-1K family with documented design flows and tool support for synthesis, place-and-route and simulation.

Why Choose EP1K30FI256-2?

The EP1K30FI256-2 positions itself as a mid-density, industrial-grade FPGA that consolidates logic, embedded memory and flexible I/O into a compact 256-FBGA package. It is a practical choice for engineers building communications equipment, SOPC solutions, and industrial control systems that require on-chip dual-port memory, a substantial I/O budget and reliable operation across an extended temperature range.

By leveraging the ACEX-1K family architecture—embedded array blocks, dedicated arithmetic chains and proven interconnect—designers can reduce external components, streamline board layout and accelerate time to market using established design tools and documentation.

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