EP1K30FC256-3NAA
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA |
|---|---|
| Quantity | 1,136 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 171 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EP1K30FC256-3NAA – ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA
The EP1K30FC256-3NAA is an ACEX-1K family FPGA from Intel, designed for low-cost system-on-a-programmable-chip (SOPC) integration. It combines a logic array with embedded memory blocks to implement megafunctions such as efficient memory, buffering, and specialized logic on a single surface-mount device.
Targeted for communications and high-volume embedded designs, this device delivers a compact package, multi-volt I/O flexibility, and in-circuit reconfigurability to simplify board-level integration and accelerate time-to-market.
Key Features
- Core Logic 1,728 logic elements providing programmable combinational and sequential logic capacity; approximately 119,000 maximum system gates.
- Embedded Memory Total on-chip RAM of 24,576 bits and six embedded array blocks (EABs) for implementing dual-port memory and storage-intensive megafunctions.
- I/O and Signalling 171 user I/O pins with MultiVolt capability to interface with 2.5 V, 3.3 V, or 5.0 V devices as supported by the ACEX-1K family; bidirectional I/O performance up to 250 MHz (family characteristic).
- Package and Mounting 256-ball FineLine BGA (256-FBGA, 17 × 17) surface-mount package for high-density board designs.
- Power and Supply Operates with an internal 2.5 V supply; device I/O supply range shown as 2.375 V to 2.625 V in product data.
- Temperature and Grade Commercial grade operation from 0 °C to 70 °C.
- Configuration and Test In-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (BST) circuitry (family feature).
- Clocking and Performance Options Features in-family options such as ClockLock and ClockBoost, low-skew clock distribution trees, and dedicated carry/cascade chains for arithmetic and high-fan-in logic implementations (series-level features).
- Compliance and Environmental RoHS compliant; family-level PCI Local Bus Specification support for 3.3 V operation (family characteristic).
Typical Applications
- Communications Equipment Implement protocol handling, buffering, and interface logic using the device’s embedded RAM and logic elements to support high-throughput data paths.
- SOPC and System Integration Combine logic, dual-port embedded memory, and dedicated carry/cascade chains to build megafunctions and consolidate discrete components on a single programmable device.
- Embedded Control and Peripherals Use the programmable I/O and reconfigurability to implement custom peripheral interfaces, glue logic, and low-latency control functions.
- High-Volume Consumer and Industrial Designs Cost-optimized architecture and compact FBGA packaging suit designs where board area and BOM reduction are priorities.
Unique Advantages
- Highly integrated FPGA: Combines 1,728 logic elements with six EABs and 24,576 bits of on-chip RAM to implement memory-rich and logic-dense functions on a single device.
- Flexible I/O voltage support: MultiVolt I/O capability enables direct interfacing with multiple logic families, reducing level-shifter requirements on mixed-voltage boards.
- Compact, board-friendly package: 256-FBGA (17 × 17) surface-mount package enables high-density PCB layouts while keeping signal routing predictable.
- Reconfigurable in circuit: Supports in-circuit reconfigurability and JTAG boundary-scan for easy updates and testability during development and production.
- Family-level tool and design support: Supported by ACEX-1K family design tools and megafunction libraries for automated place-and-route and rapid design entry.
- Regulatory and environmental readiness: RoHS compliance simplifies integration into modern manufacturing and regulatory environments.
Why Choose EP1K30FC256-3NAA?
The EP1K30FC256-3NAA positions itself as a compact, cost-conscious FPGA for designers needing embedded memory and flexible I/O in a single, surface-mount package. Its combination of logic elements, embedded array blocks, and MultiVolt I/O support makes it suitable for communications interfaces, SOPC implementations, and dense embedded control tasks where board space and BOM simplification matter.
Backed by ACEX-1K family design resources, in-circuit reconfigurability, and RoHS compliance, this device is appropriate for teams building high-volume or integration-focused products that require reliable, field-updatable programmable logic within a defined commercial temperature range.
Request a quote or submit an inquiry to the sales team to check current availability, pricing, and lead times for the EP1K30FC256-3NAA.

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