EP1K30FC256-3NAA

IC FPGA 171 I/O 256FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA

Quantity 1,136 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O171Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EP1K30FC256-3NAA – ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA

The EP1K30FC256-3NAA is an ACEX-1K family FPGA from Intel, designed for low-cost system-on-a-programmable-chip (SOPC) integration. It combines a logic array with embedded memory blocks to implement megafunctions such as efficient memory, buffering, and specialized logic on a single surface-mount device.

Targeted for communications and high-volume embedded designs, this device delivers a compact package, multi-volt I/O flexibility, and in-circuit reconfigurability to simplify board-level integration and accelerate time-to-market.

Key Features

  • Core Logic  1,728 logic elements providing programmable combinational and sequential logic capacity; approximately 119,000 maximum system gates.
  • Embedded Memory  Total on-chip RAM of 24,576 bits and six embedded array blocks (EABs) for implementing dual-port memory and storage-intensive megafunctions.
  • I/O and Signalling  171 user I/O pins with MultiVolt capability to interface with 2.5 V, 3.3 V, or 5.0 V devices as supported by the ACEX-1K family; bidirectional I/O performance up to 250 MHz (family characteristic).
  • Package and Mounting  256-ball FineLine BGA (256-FBGA, 17 × 17) surface-mount package for high-density board designs.
  • Power and Supply  Operates with an internal 2.5 V supply; device I/O supply range shown as 2.375 V to 2.625 V in product data.
  • Temperature and Grade  Commercial grade operation from 0 °C to 70 °C.
  • Configuration and Test  In-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (BST) circuitry (family feature).
  • Clocking and Performance Options  Features in-family options such as ClockLock and ClockBoost, low-skew clock distribution trees, and dedicated carry/cascade chains for arithmetic and high-fan-in logic implementations (series-level features).
  • Compliance and Environmental  RoHS compliant; family-level PCI Local Bus Specification support for 3.3 V operation (family characteristic).

Typical Applications

  • Communications Equipment  Implement protocol handling, buffering, and interface logic using the device’s embedded RAM and logic elements to support high-throughput data paths.
  • SOPC and System Integration  Combine logic, dual-port embedded memory, and dedicated carry/cascade chains to build megafunctions and consolidate discrete components on a single programmable device.
  • Embedded Control and Peripherals  Use the programmable I/O and reconfigurability to implement custom peripheral interfaces, glue logic, and low-latency control functions.
  • High-Volume Consumer and Industrial Designs  Cost-optimized architecture and compact FBGA packaging suit designs where board area and BOM reduction are priorities.

Unique Advantages

  • Highly integrated FPGA: Combines 1,728 logic elements with six EABs and 24,576 bits of on-chip RAM to implement memory-rich and logic-dense functions on a single device.
  • Flexible I/O voltage support: MultiVolt I/O capability enables direct interfacing with multiple logic families, reducing level-shifter requirements on mixed-voltage boards.
  • Compact, board-friendly package: 256-FBGA (17 × 17) surface-mount package enables high-density PCB layouts while keeping signal routing predictable.
  • Reconfigurable in circuit: Supports in-circuit reconfigurability and JTAG boundary-scan for easy updates and testability during development and production.
  • Family-level tool and design support: Supported by ACEX-1K family design tools and megafunction libraries for automated place-and-route and rapid design entry.
  • Regulatory and environmental readiness: RoHS compliance simplifies integration into modern manufacturing and regulatory environments.

Why Choose EP1K30FC256-3NAA?

The EP1K30FC256-3NAA positions itself as a compact, cost-conscious FPGA for designers needing embedded memory and flexible I/O in a single, surface-mount package. Its combination of logic elements, embedded array blocks, and MultiVolt I/O support makes it suitable for communications interfaces, SOPC implementations, and dense embedded control tasks where board space and BOM simplification matter.

Backed by ACEX-1K family design resources, in-circuit reconfigurability, and RoHS compliance, this device is appropriate for teams building high-volume or integration-focused products that require reliable, field-updatable programmable logic within a defined commercial temperature range.

Request a quote or submit an inquiry to the sales team to check current availability, pricing, and lead times for the EP1K30FC256-3NAA.

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