EP1K30FC256-2N

IC FPGA 171 I/O 256FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA

Quantity 677 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O171Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP1K30FC256-2N – ACEX-1K Field Programmable Gate Array (FPGA) IC, 1,728 LEs, 24,576-bit RAM, 256-BGA

The EP1K30FC256-2N is an ACEX-1K programmable logic device offering mid-range logic capacity in a compact 256-ball FineLine BGA package. Built around the ACEX 1K architecture, it combines a dedicated logic array with embedded array blocks (EABs) to deliver efficient on-chip memory and specialized logic for system-on-a-programmable-chip (SOPC) integration.

With 1,728 logic elements, approximately 24,576 bits of embedded RAM, and 171 user I/O pins, this device targets communications equipment, embedded control, and mid-density logic applications that require flexible I/O, in-circuit reconfigurability, and compact board-level integration.

Key Features

  • Logic Capacity 1,728 logic elements and support for up to 119,000 system gates provide mid-range programmable logic resources for control, glue-logic, and custom processing functions.
  • Embedded Memory (EABs) Six embedded array blocks delivering a total of 24,576 bits of RAM (approximately 0.025 Mbits) with dual-port capability for efficient on-chip data buffering and memory-mapped functions.
  • I/O and Package 171 user I/O pins in a 256-FBGA (17×17) surface-mount package enable dense board-level connectivity while minimizing PCB footprint.
  • Power and Supply Operates with an internal 2.5 V core and a supply range listed at 2.375 V to 2.625 V for the device core; MultiVolt I/O options allow interfacing with 2.5 V, 3.3 V, or 5.0 V signaling environments as part of the ACEX 1K family features.
  • System Features Built-in JTAG boundary-scan (IEEE 1149.1) for board-level test and in-circuit reconfigurability via external configuration devices or the JTAG port.
  • Clocking and Performance Low-skew clock distribution with options such as ClockLock and ClockBoost, plus support for multiple global clocks and global clears to simplify synchronous design.
  • Interconnect and Arithmetic Support FastTrack continuous routing structure with dedicated carry and cascade chains to implement high-speed adders, counters, and wide fan-in logic efficiently.
  • Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 70 °C, suitable for general-purpose and commercial embedded applications.
  • RoHS Compliant Device meets RoHS environmental requirements.

Typical Applications

  • Communications Equipment Use the EP1K30FC256-2N for protocol bridging, packet buffering, and control-plane logic where on-chip RAM and flexible I/O improve integration and reduce external components.
  • Embedded System Integration (SOPC) Implement custom peripherals, glue logic, and memory-mapped functions to consolidate multiple discrete components into a single programmable device.
  • Interface and I/O Expansion Leverage 171 I/O pins and MultiVolt I/O capability to interface with a variety of voltage domains and peripherals in mid-density system designs.
  • Control and Timing Logic Use built-in clock distribution and dedicated arithmetic chains for precise timing, counters, and deterministic control logic in industrial and consumer systems.

Unique Advantages

  • Highly integrated mid-range logic: 1,728 logic elements with embedded RAM and dedicated chains reduce external component count for many control and buffering tasks.
  • Flexible I/O interfacing: Family-level MultiVolt I/O support enables direct interfacing to 2.5 V, 3.3 V, or 5.0 V devices, simplifying mixed-voltage board designs.
  • Compact board footprint: 256-FBGA (17×17) surface-mount package delivers a dense pinout for high I/O count in space-constrained layouts.
  • Design and test support: JTAG boundary-scan and in-circuit reconfigurability streamline production test, debugging, and field updates.
  • Efficient memory and arithmetic: Dual-port EABs and dedicated carry/cascade chains support high-throughput data paths and arithmetic operations without occupying general logic.
  • Commercial-grade reliability: Designed for commercial temperature ranges (0 °C to 70 °C) and RoHS compliance for standard embedded product lines.

Why Choose EP1K30FC256-2N?

The EP1K30FC256-2N positions itself as a practical, mid-density FPGA option for engineers who need a balance of logic elements, embedded memory, and high I/O count in a compact package. Its ACEX 1K family features—such as dedicated arithmetic chains, EABs, and flexible clocking—make it suitable for communications, embedded control, and SOPC consolidation where efficient on-chip memory and predictable routing are valuable.

Designers benefit from a device that supports in-circuit reconfiguration, JTAG-based testing, and family-level multi-voltage I/O capabilities, along with documented development tool support for synthesis and place-and-route workflows—helping reduce time-to-market and simplify board-level design decisions.

Request a quote or submit an inquiry to our sales team to check current availability, lead times, and pricing for the EP1K30FC256-2N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up