EP1K10TI100-2N

IC FPGA 66 I/O 100TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

Quantity 1,129 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case100-TQFPNumber of I/O66Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10TI100-2N – ACEX-1K Field Programmable Gate Array (FPGA) IC, 66 I/O, 12,288‑bit RAM, 576 Logic Elements, 100‑TQFP

The EP1K10TI100-2N is an ACEX-1K family field programmable gate array (FPGA) device from Intel, delivering mid-density programmable logic and embedded memory in a compact 100‑TQFP package. It combines on-chip embedded array memory and general logic fabric to implement system-on-programmable-chip (SOPC) functions such as memory macros, specialized logic, and glue logic for industrial designs.

Designed for industrial-grade applications, the device offers 576 logic elements, approximately 12,288 bits of embedded RAM, and 66 user I/O pins, with a specified operating range of −40 °C to 85 °C and a 2.375 V to 2.625 V supply window for the internal core.

Key Features

  • Core Logic  576 logic elements provide configurable combinational and sequential resources for implementing custom logic and state machines.
  • Embedded Memory  Approximately 12,288 bits of on-chip RAM supporting dual-port configurations for efficient buffering and small data-storage functions.
  • I/O Capability  66 user I/O pins with multi-volt I/O architecture in the ACEX-1K family—support for interfacing a range of external voltage domains is a defined family feature.
  • Performance Density  Device silicon supports up to 56,000 system gates (product data lists 56,000 gates), enabling mid-range logic integration within a compact package.
  • Package and Mounting  100‑TQFP (14×14) surface-mount package simplifies PCB routing while keeping a small board footprint.
  • Industrial Temperature Grade  Qualified for operation from −40 °C to 85 °C for deployment in industrial environments.
  • Power and Supply  Core supply specified at 2.375 V to 2.625 V; device operates with a 2.5‑V internal supply as part of the ACEX-1K family architecture.
  • Design & Test Features  Family-level features include IEEE 1149.1 JTAG boundary-scan support and in-circuit reconfigurability (ICR) options, enabling board-level test and runtime reconfiguration.
  • Clock and Interconnect  ACEX-1K family includes built-in low-skew clock distribution and dedicated carry/cascade chains for efficient arithmetic and high-fan-in logic implementations.
  • RoHS Compliant  Device is RoHS compliant for environmentally conscious designs.

Typical Applications

  • Industrial Control  Implement control logic, protocol translation, and glue logic in factory automation and process-control modules operating in industrial temperature ranges.
  • Communications Equipment  Use embedded RAM and dual-port memory capabilities for buffering, packet processing, and interface bridging in mid-density communications designs.
  • Embedded Systems  Integrate peripheral control, custom interfaces, and small-scale SOPC functions where compact package and reconfigurability are required.
  • Prototyping and Low-to-Mid Density FPGA Designs  Rapidly validate logic functions and custom IP using the device’s logic elements, embedded memory, and supported design toolflows referenced for the ACEX-1K family.

Unique Advantages

  • Compact, Mid‑Density Integration:  576 logic elements with embedded RAM deliver the right balance of logic and memory for compact system designs without excess board-level components.
  • Industrial Operating Range:  Specified −40 °C to 85 °C operation enables deployment in industrial environments where temperature resilience matters.
  • Flexible I/O and Interfacing:  Family-level multi-volt I/O support and 66 user I/O pins allow straightforward interfacing to varied external logic levels and peripherals.
  • Testability and In‑Circuit Reconfiguration:  Built-in JTAG boundary-scan and in-circuit reconfigurability options simplify board bring-up, manufacturing test, and field updates.
  • Small Footprint Package:  100‑TQFP (14×14) surface-mount package minimizes PCB area while keeping routing manageable for density-constrained designs.
  • Standards‑Oriented Design Flow:  ACEX-1K family design support includes common EDA interfaces and tools, facilitating integration into existing development flows.

Why Choose EP1K10TI100-2N?

The EP1K10TI100-2N positions itself as a practical mid-density FPGA choice for industrial and embedded applications that require on-chip RAM, flexible I/O, and reconfigurable logic in a compact 100‑TQFP package. Its combination of 576 logic elements and approximately 12,288 bits of embedded memory supports system-on-programmable-chip use cases such as interface bridging, buffering, and control logic integration.

Backed by the ACEX-1K family feature set—including JTAG boundary-scan, in-circuit reconfigurability, dedicated arithmetic chains, and family-level tool support—this device is suitable for engineers seeking a balanced, industrial-grade FPGA solution with clear, verifiable specifications for production and fielded systems.

Request a quote or submit a procurement inquiry to evaluate EP1K10TI100-2N for your next industrial or embedded FPGA design project.

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