EP1K30FC256-1

The EP1K30FC256-1 is an ACEX-1K family Field Programmable Gate Array (FPGA) designed for system-on-a-programmable-chip (SOPC) integration. It combines a logic array with embedded array blocks (EABs) to implement general logic and memory-intensive megafunctions in a single, surface-mount 256-BGA package.

Targeted at commercial applications such as communications and compact embedded systems, this device delivers a balance of integration, on-chip RAM, and flexible I/O for designers seeking programmable logic with moderate density and low-power operation.

Key Features

• Logic Capacity  Contains 1,728 logic elements and a maximum of 119,000 system gates, providing a mid-range programmable fabric for control, glue logic, and custom processing functions.
• Embedded Memory (EABs)  Provides approximately 24,576 bits of on-chip RAM across embedded array blocks (EABs), supporting dual-port configurations and megafunction implementations up to 16-bit widths per EAB.
• Flexible I/O  171 user I/O pins with MultiVolt capability; I/O pins can interface with 2.5‑V, 3.3‑V, or 5.0‑V devices and include individual tri-state control and programmable slew-rate options.
• Power and Supply  Operates with a 2.5‑V internal supply and a device voltage supply range of 2.375 V to 2.625 V for core operation, enabling conventional low-voltage FPGA use.
• Configuration and Test  Supports in-circuit reconfigurability (ICR) and includes JTAG boundary-scan test (BST) compliant with IEEE Std. 1149.1-1990 for board-level test and configuration without consuming additional device logic.
• Package and Mounting  256-ball FineLine BGA (256-FBGA, 17×17) surface-mount package for compact PCB footprint and fine-pitch board designs; RoHS compliant.
• Operating Range  Commercial-grade device with an operating temperature range of 0 °C to 70 °C suitable for a wide range of standard embedded applications.

Typical Applications

• System-on-a-Programmable-Chip (SOPC)  Integrate control logic and embedded memory for compact system designs requiring programmable customization in a single device.
• Communications Equipment  Implement protocol glue logic, buffering, and memory-intensive functions where moderate logic density and on-chip RAM improve board-level integration.
• PCI and Bus Interface Designs  Support for PCI Local Bus configurations at 3.3‑V operation (33 MHz or 66 MHz) and -1 speed-grade device compliance for 5.0‑V operation per device documentation makes it suitable for legacy bus interfacing scenarios.
• Reconfigurable Embedded Systems  Use in designs that require in-circuit reconfiguration and boundary-scan access for flexible field updates and production testability.

Unique Advantages

• Balanced Integration: Combines 1,728 logic elements with approximately 24,576 bits of embedded RAM to reduce the need for external memory and discrete glue logic.
• Dual-Port Embedded Memory: EABs with dual-port capability (up to 16-bit width per EAB) simplify implementation of concurrent data paths and buffer structures.
• Multi-Voltage I/O: I/O pins that can drive or be driven by 2.5‑V, 3.3‑V, or 5.0‑V devices enable straightforward interfacing to a wide range of legacy and modern peripherals.
• Testability and Reconfigurability: Built-in JTAG boundary-scan and in-circuit reconfigurability streamline board-level test and field updates without consuming core logic resources.
• Compact, RoHS-Compliant Packaging: 256-FBGA (17×17) surface-mount package offers a small footprint for dense PCB layouts while meeting RoHS requirements.

Why Choose EP1K30FC256-1?

The EP1K30FC256-1 positions itself as a commercially graded, mid-density FPGA that blends logic elements, on-chip RAM, and flexible I/O to address embedded and communications-focused designs. Its mix of programmable logic and embedded array blocks supports both general-purpose logic and memory-intensive megafunctions in a single device.

This device is well suited for engineering teams designing compact, reconfigurable systems that require JTAG testability, MultiVolt I/O interfacing, and the ability to implement dual-port memory architectures without large external component counts. Its RoHS-compliant 256-FBGA package and standard commercial temperature rating make it a practical choice for production deployments in mainstream embedded applications.

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