EP1K30FC256-2

The EP1K30FC256-2 is an ACEX-1K programmable logic device (PLD) that delivers a balanced combination of logic capacity, embedded memory, and flexible I/O for system-on-a-programmable-chip (SOPC) integration. It targets designers who need reconfigurable logic with embedded array blocks and economy for volume applications.

Built for cost-efficient integration, the device supports multi-voltage I/O, in-circuit reconfigurability and family-level features that simplify migration and board-level compatibility. Typical use cases include communications and other high-volume applications where embedded memory and moderate logic density are required.

Key Features

• Core Logic  Approximately 1,728 logic elements providing up to 119,000 system gates for implementing control, glue logic, and mid-density digital functions.
• Embedded Memory  Approximately 24,576 bits of on-chip RAM delivered through dedicated embedded array blocks (EABs) for efficient implementation of FIFOs, dual-port buffers, and other megafunctions.
• I/O and Voltage  171 user I/O pins with MultiVolt I/O capability across the ACEX-1K family, enabling interfacing with 2.5‑V, 3.3‑V, or 5.0‑V devices; device supply range specified at 2.375 V to 2.625 V.
• Configuration & Test  Supports in-circuit reconfigurability (ICR) and JTAG boundary-scan (IEEE 1149.1) for convenient programming and board-level test without consuming device logic.
• Interconnect & Arithmetic  Dedicated carry and cascade chains and a continuous routing structure for predictable interconnect delays and efficient implementation of adders, counters, and high-fan-in logic.
• Clocking Options  Built-in low-skew clock distribution trees and family options such as ClockLock and ClockBoost to reduce clock delay and skew where needed.
• Package & Mounting  Surface-mount 256-ball BGA (256-FBGA, 17×17) package for compact board footprint and reliable solder connections.
• Commercial Grade & Environmental  Commercial operating temperature range of 0 °C to 70 °C and RoHS-compliant device construction.

Typical Applications

• Communications Equipment  Implements protocol bridging, buffering, and custom packet-processing logic using embedded RAM blocks and reconfigurable logic.
• System-on-a-Programmable-Chip (SOPC)  Integrates control logic, on-chip memory, and custom interfaces to reduce component count in medium-complexity embedded systems.
• High-Volume Consumer and Industrial Electronics  Cost-optimized architecture and compact 256-BGA packaging suit volume designs that require moderate logic density and flexible I/O interfacing.

Unique Advantages

• Highly integrated solution: Combines 1,728 logic elements and embedded array memory to reduce external components and simplify board design.
• Flexible I/O interfacing: Family MultiVolt I/O capability and 171 user I/O pins enable direct interfacing to a range of peripheral voltages and devices.
• In-circuit reconfigurability and test: ICR and JTAG boundary-scan support accelerate development cycles, simplify updates, and enable board-level testing without consuming logic resources.
• Predictable arithmetic and routing: Dedicated carry and cascade chains plus a continuous routing architecture help achieve efficient adders, counters, and high-fan-in functions.
• Compact, production-ready packaging: 256-FBGA (17×17) surface-mount package balances board density and thermal/reliability considerations for volume production.
• Design ecosystem support: The ACEX-1K family includes software design tools and automatic place-and-route support to streamline implementation and reduce time-to-market.

Why Choose EP1K30FC256-2?

The EP1K30FC256-2 positions itself as a commercial-grade, mid-density FPGA suitable for designs that require embedded memory, flexible I/O, and in-field reconfigurability. Its combination of logic elements, dedicated memory blocks, and family-level features makes it an effective choice for SOPC integration and communications-focused designs where cost and board-level integration matter.

Family features such as pin-compatible FineLine BGA options and supported design tools simplify device migration and development across product variants, helping teams scale designs while retaining a predictable development flow.

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