EP1K30FC256-3

The EP1K30FC256-3 is an ACEX 1K family programmable logic device from Intel, delivering 1,728 logic elements, 24,576 bits of embedded RAM and up to 171 user I/O pins in a 256-ball FineLine BGA (17×17) surface-mount package. It targets designs that require moderate logic density combined with embedded memory and flexible I/O for system-level integration.

Built for commercial-grade applications, the device supports in-circuit reconfigurability and family-level features for memory-intensive and communications-focused designs, while operating from a 2.375 V to 2.625 V supply and across a 0 °C to 70 °C temperature range.

Key Features

• Programmable Logic Core — 1,728 logic elements and a maximum device gate count of 119,000 provide configurable logic capacity for a wide range of functions.
• Embedded Memory — 24,576 total RAM bits across embedded array blocks (EABs) enable efficient implementation of on-chip buffers, FIFOs and small memory structures.
• I/O and Voltage Flexibility — Up to 171 user I/O pins with MultiVolt I/O capability (family-level feature) to interface with 2.5 V, 3.3 V or 5.0 V devices.
• Package and Mounting — 256-FBGA (17×17) surface-mount package delivers a compact footprint for board-level implementations.
• Configuration and Test — Supports in-circuit reconfigurability and JTAG boundary-scan (BST) for programming and board-level test without consuming core logic resources.
• Power and Timing — Operates from a 2.375 V to 2.625 V supply; family documentation highlights low power consumption and built-in clock distribution features for predictable timing.
• Commercial Grade and Compliance — Specified for 0 °C to 70 °C operation and RoHS-compliant.

Typical Applications

• Communications Equipment — Implement protocol processing, buffering and custom packet-handling logic using the device's embedded RAM and logic resources.
• System-on-a-Programmable-Chip (SOPC) — Integrate specialized logic functions and memory on a single device to reduce board-level complexity.
• Interface Bridging and I/O Expansion — Use the MultiVolt-capable I/O and 171 pins for level translation, bus interfacing and peripheral bridging.
• Memory and Buffering — Leverage dual-port-capable EABs for small on-chip buffers, FIFOs and shared memory structures.

Unique Advantages

• High integration in a compact package: 1,728 logic elements and 24,576 RAM bits in a 256-FBGA reduce BOM and board space compared with discrete solutions.
• Flexible I/O support: Up to 171 user I/O pins and MultiVolt I/O enable direct interfacing to multiple bus voltages without external level shifters.
• Designed for system integration: Embedded array blocks with dual-port capability simplify implementation of memory-heavy functions and megafunctions.
• Production and testability: Family-level JTAG boundary-scan and 100% functional testing in manufacturing aid board-level bring-up and diagnostics.
• Commercial-grade reliability: Specified operating range of 0 °C to 70 °C and RoHS compliance make the part suitable for standard commercial applications.
• Path for migration: ACEX 1K family package options and documented pin-compatibility support device migration within the family.

Why Choose EP1K30FC256-3?

The EP1K30FC256-3 combines a balanced mix of logic capacity, embedded memory and flexible I/O in a compact 256-FBGA package, making it well suited for communications, SOPC integration and board-level interface tasks in commercial applications. Its family-level features—such as in-circuit reconfigurability, JTAG boundary-scan, and embedded array blocks—help streamline development and reduce system complexity.

Designers benefit from documented tool support and automatic place-and-route workflows provided for the ACEX 1K family, along with tested manufacturing quality and RoHS compliance. The part is a practical choice for teams needing a moderately dense, memory-capable programmable device with commercial operating specifications.

Request a quote or submit an RFQ to obtain pricing and availability for the EP1K30FC256-3.