EP1K30FC256-1N
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA |
|---|---|
| Quantity | 565 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 171 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 216 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 119000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EP1K30FC256-1N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 171 24576 1728 256-BGA
The EP1K30FC256-1N is an ACEX-1K family programmable logic device that combines reprogrammable FPGA fabric with embedded memory and flexible I/O. It targets system integration and communications-focused designs where a compact, surface-mount FPGA with moderate logic density and on-chip RAM is required.
With 1,728 logic elements, 24,576 bits of embedded RAM, and 171 user I/O pins in a 256-pin BGA package, this device delivers a balance of logic capacity, I/O density, and compact packaging for commercial-temperature applications.
Key Features
- Logic Capacity — 1,728 logic elements and approximately 119,000 system gates provide moderate combinational and sequential logic resources for glue logic, protocol handling, and control functions.
- Embedded Memory — 24,576 bits of on-chip RAM across embedded array blocks (EABs) for dual-port memory configurations and efficient implementation of buffers, FIFOs, and small data stores.
- I/O and Bus Support — 171 user I/O pins with MultiVolt I/O capability to interface with 2.5 V, 3.3 V, or 5.0 V devices; features for bidirectional I/O and programmable output slew-rate control are included at the family level.
- Power and Supply — Operates with an internal 2.5 V supply and a recommended supply range of 2.375 V to 2.625 V for core operation.
- Package and Mounting — 256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount format optimized for compact board designs.
- Reliability and Test — Built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990 for board-level test access without consuming user logic.
- Clock and Interconnect Options — Family-level features include dedicated carry and cascade chains, FastTrack interconnect architecture, and options such as ClockLock and ClockBoost for improved clock performance.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Communications Interfaces — Implement protocol bridging, packet parsing, or buffering using embedded RAM and dedicated arithmetic/cascade resources.
- System Integration / SOPC — Consolidate glue logic, bus adapters, and peripheral control into a single programmable device to reduce BOM and PCB area.
- Memory and Buffering Functions — Use the dual-port-capable embedded arrays for FIFOs, small frame buffers, or temporary data storage in data-path designs.
- PCI and Legacy Bus Support — Series-level documentation notes compliance with PCI Local Bus Specification for supported speed grades, enabling bus-interface functions where applicable.
Unique Advantages
- Balanced Logic and Memory — The combination of 1,728 logic elements and 24,576 bits of RAM supports mixed control and data storage needs without external memory for smaller designs.
- Flexible I/O Voltage Options — MultiVolt I/O capability simplifies interfacing to a range of board-level peripherals and legacy devices.
- Compact, Surface-Mount Package — 256-FBGA (17×17) enables high I/O density in compact form factors for space-constrained boards.
- On-board Testability — IEEE-1149.1 compliant JTAG boundary-scan provides a standardized path for in-circuit test and configuration without consuming logic resources.
- Design and Timing Features — Dedicated carry/cascade chains and FastTrack interconnect support efficient implementation of arithmetic and high-fan-in logic for deterministic timing.
Why Choose EP1K30FC256-1N?
The EP1K30FC256-1N is positioned for designers seeking a commercially graded, mid-density FPGA that integrates modest logic capacity, embedded RAM, and a high count of I/O in a compact BGA package. It is well suited to communications subsystems, system glue logic, protocol adapters, and designs that benefit from on-chip dual-port memory and boundary-scan testability.
Choosing this ACEX-1K device provides a balance of integration and board-level simplicity while leveraging family-level architecture features such as dedicated arithmetic chains, FastTrack interconnect, and configurable I/O voltages for flexible interfacing and predictable timing behavior.
Request a quote or submit a sales inquiry to get pricing and availability for the EP1K30FC256-1N.

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