EP1K10TI100-2
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP |
|---|---|
| Quantity | 215 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 66 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 56000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EP1K10TI100-2 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP
The EP1K10TI100-2 is an ACEX-1K series field programmable gate array (FPGA) in a 100-TQFP (14×14) surface-mount package. It provides a medium-density programmable logic solution featuring 576 logic elements, approximately 12.3 Kbits of embedded RAM, and 66 user I/O pins for flexible system integration.
Designed for industrial-grade operation with a –40 °C to 85 °C temperature range and a 2.375 V to 2.625 V supply window, this device targets system-on-programmable-chip integration, communications interfaces, and embedded control applications that require reconfigurability and compact packaging.
Key Features
- Logic Capacity 576 logic elements and a device gate count of 56,000 enable medium-density logic implementations and custom digital functions.
- Embedded Memory Total on-chip RAM of 12,288 bits supports storage for FIFOs, small buffers, and state machines.
- I/O and Package 66 user I/O pins in a 100-TQFP (14×14) surface-mount package provide board-level accessibility while keeping a compact footprint.
- Voltage and Power Operates with an internal 2.5 V supply range; specified supply window is 2.375 V to 2.625 V to match system requirements.
- Industrial Temperature Grade Rated for operation from –40 °C to 85 °C, suitable for industrial environments.
- Built-in Test and Configuration Includes JTAG boundary-scan test (IEEE 1149.1) and supports in-circuit reconfigurability via external configuration devices or JTAG.
- Flexible Interconnect and Arithmetic Support Series architecture provides dedicated carry and cascade chains and a continuous routing structure for predictable interconnect delays.
- Clocking and System Control Supports multiple global clocks and clock management features for reduced clock delay and skew.
- RoHS Compliant Manufactured in accordance with RoHS requirements.
Typical Applications
- Communications Interfaces Implement protocol bridging, interface logic, and bus adaptation functions where reconfigurable logic and embedded RAM are required.
- Embedded Control Use for control logic, state machines, and peripheral glue logic in industrial systems operating across a wide temperature range.
- System Integration / SOPC Integrate multiple discrete functions into a single programmable device to reduce board complexity and bill of materials.
- Memory and Buffering Leverage the on-chip RAM blocks for small FIFOs, lookup tables, and dual-port memory needs in compact designs.
Unique Advantages
- Compact, Surface-Mount Footprint: The 100-TQFP (14×14) package enables high-density board layouts while preserving access to 66 I/Os.
- Industrial Temperature Range: –40 °C to 85 °C rating supports deployment in industrial environments without additional thermal qualification.
- On-Device RAM: Approximately 12.3 Kbits of embedded memory reduces external component count for small buffers and state storage.
- In-System Reconfigurability: JTAG and external configuration support allow design updates and iterative development without hardware changes.
- Deterministic Interconnect: Dedicated carry and cascade chains with a continuous routing structure simplify implementation of arithmetic and high-fan-in logic.
- RoHS Compliance: Meets environmental requirements for modern electronics manufacturing.
Why Choose EP1K10TI100-2?
The EP1K10TI100-2 ACEX-1K FPGA balances medium logic capacity with embedded memory and a compact 100-TQFP package, making it well suited for industrial and communications-focused designs that require reconfigurability and reliable operation across a wide temperature range. Its combination of 576 logic elements, 12,288 bits of on-chip RAM, and 66 I/O pins enables consolidation of discrete logic and buffering into a single programmable device, reducing board complexity and part count.
For engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with built-in testability and flexible configuration options, the EP1K10TI100-2 offers a pragmatic, scalable choice backed by the ACEX-1K device family architecture.
Request a quote or submit an inquiry to receive pricing and availability for the EP1K10TI100-2.

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