EP1K10TI100-2

IC FPGA 66 I/O 100TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

Quantity 215 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case100-TQFPNumber of I/O66Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates56000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EP1K10TI100-2 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 66 12288 576 100-TQFP

The EP1K10TI100-2 is an ACEX-1K series field programmable gate array (FPGA) in a 100-TQFP (14×14) surface-mount package. It provides a medium-density programmable logic solution featuring 576 logic elements, approximately 12.3 Kbits of embedded RAM, and 66 user I/O pins for flexible system integration.

Designed for industrial-grade operation with a –40 °C to 85 °C temperature range and a 2.375 V to 2.625 V supply window, this device targets system-on-programmable-chip integration, communications interfaces, and embedded control applications that require reconfigurability and compact packaging.

Key Features

  • Logic Capacity  576 logic elements and a device gate count of 56,000 enable medium-density logic implementations and custom digital functions.
  • Embedded Memory  Total on-chip RAM of 12,288 bits supports storage for FIFOs, small buffers, and state machines.
  • I/O and Package  66 user I/O pins in a 100-TQFP (14×14) surface-mount package provide board-level accessibility while keeping a compact footprint.
  • Voltage and Power  Operates with an internal 2.5 V supply range; specified supply window is 2.375 V to 2.625 V to match system requirements.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 85 °C, suitable for industrial environments.
  • Built-in Test and Configuration  Includes JTAG boundary-scan test (IEEE 1149.1) and supports in-circuit reconfigurability via external configuration devices or JTAG.
  • Flexible Interconnect and Arithmetic Support  Series architecture provides dedicated carry and cascade chains and a continuous routing structure for predictable interconnect delays.
  • Clocking and System Control  Supports multiple global clocks and clock management features for reduced clock delay and skew.
  • RoHS Compliant  Manufactured in accordance with RoHS requirements.

Typical Applications

  • Communications Interfaces  Implement protocol bridging, interface logic, and bus adaptation functions where reconfigurable logic and embedded RAM are required.
  • Embedded Control  Use for control logic, state machines, and peripheral glue logic in industrial systems operating across a wide temperature range.
  • System Integration / SOPC  Integrate multiple discrete functions into a single programmable device to reduce board complexity and bill of materials.
  • Memory and Buffering  Leverage the on-chip RAM blocks for small FIFOs, lookup tables, and dual-port memory needs in compact designs.

Unique Advantages

  • Compact, Surface-Mount Footprint: The 100-TQFP (14×14) package enables high-density board layouts while preserving access to 66 I/Os.
  • Industrial Temperature Range: –40 °C to 85 °C rating supports deployment in industrial environments without additional thermal qualification.
  • On-Device RAM: Approximately 12.3 Kbits of embedded memory reduces external component count for small buffers and state storage.
  • In-System Reconfigurability: JTAG and external configuration support allow design updates and iterative development without hardware changes.
  • Deterministic Interconnect: Dedicated carry and cascade chains with a continuous routing structure simplify implementation of arithmetic and high-fan-in logic.
  • RoHS Compliance: Meets environmental requirements for modern electronics manufacturing.

Why Choose EP1K10TI100-2?

The EP1K10TI100-2 ACEX-1K FPGA balances medium logic capacity with embedded memory and a compact 100-TQFP package, making it well suited for industrial and communications-focused designs that require reconfigurability and reliable operation across a wide temperature range. Its combination of 576 logic elements, 12,288 bits of on-chip RAM, and 66 I/O pins enables consolidation of discrete logic and buffering into a single programmable device, reducing board complexity and part count.

For engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with built-in testability and flexible configuration options, the EP1K10TI100-2 offers a pragmatic, scalable choice backed by the ACEX-1K device family architecture.

Request a quote or submit an inquiry to receive pricing and availability for the EP1K10TI100-2.

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