EP1K30FI256-2N

The EP1K30FI256-2N is an Intel ACEX-1K family FPGA providing a programmable logic fabric with embedded memory and flexible I/O in a 256-ball fine-pitch BGA package. Built for industrial applications, this device delivers 1,728 logic elements, 24,576 bits of on-chip RAM and up to 171 user I/O pins for system-on-a-programmable-chip integration and moderate-density logic designs.

Its architecture includes embedded array blocks for efficient memory and specialized logic, on-chip clock distribution and dedicated arithmetic/cascade chains—features that suit communications, embedded control, and system integration use cases that require reconfigurability and compact implementation.

Key Features

• Logic Capacity — 1,728 logic elements (LEs) supporting up to 119,000 gates for moderate-density programmable logic implementations.
• Embedded Memory — 24,576 total RAM bits implemented with embedded array blocks (EABs), including dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and memory-intensive megafunctions.
• I/O and Voltage — Up to 171 user I/O pins with MultiVolt I/O support described by the ACEX-1K family; device operates with an internal 2.5-V supply and specified supply range of 2.375 V to 2.625 V.
• Package & Mounting — 256-ball FineLine BGA (256-FBGA, 17×17) in a surface-mount package suitable for compact board designs.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 85 °C for deployment in industrial environments.
• Clocking & Performance — Built-in low-skew clock distribution trees with options such as ClockLock and ClockBoost to reduce clock delay and skew; up to six global clock signals and four global clear signals on the family.
• Dedicated Arithmetic & Routing — Dedicated carry and cascade chains for efficient implementation of adders, counters and high-fan-in logic; FastTrack continuous routing for predictable interconnect delays.
• Testability & Reconfiguration — JTAG boundary-scan (IEEE 1149.1) for in-system test and in-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG.
• Power & I/O Control — Programmable output slew-rate control, open-drain option, clamp-to-VCCIO selection and per-pin tri-state enable for optimized signal integrity and interface flexibility.

Typical Applications

• Communications Equipment — Implement protocol logic, packet buffering and specialized functions that benefit from embedded memory and moderate gate density.
• Embedded Control & Motor Drive — Use on-chip logic and dedicated arithmetic chains for control algorithms, counters and deterministic timing in industrial controllers.
• System Integration / SOPC — Consolidate multiple functions into a single programmable device using embedded RAM and logic to reduce board-level BOM and simplify integration.
• Interface & I/O Bridging — Leverage flexible I/O and voltage-domain support to bridge different logic families and manage mixed-voltage interfaces.

Unique Advantages

• Balanced Logic and Memory: Combines 1,728 logic elements with 24,576 bits of embedded RAM to implement both combinational logic and on-chip storage without excessive external memory.
• Flexible I/O Management: Up to 171 user I/O pins with per-pin control of slew rate, tri-state and clamp options for robust interfacing to diverse peripherals and bus standards.
• Industrial Temperature Range: Specified for −40 °C to 85 °C operation, making the device suitable for many industrial deployments.
• Efficient Arithmetic and High-Fan-In Logic: Dedicated carry and cascade chains accelerate adders, counters and complex logic structures while simplifying synthesis and place-and-route.
• In-System Test and Reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability options support convenient board-level test and field updates.
• Compact, Board-Friendly Package: 256-FBGA (17×17) surface-mount package enables compact PCB designs and same-frame pin migration across FineLine BGA options.

Why Choose EP1K30FI256-2N?

The EP1K30FI256-2N is positioned for engineers who need a compact, industrial-grade FPGA with a balanced mix of logic, embedded memory and flexible I/O in a fine-pitch BGA package. Its combination of 1,728 logic elements, 24,576 bits of RAM and 171 I/O pins delivers a practical platform for communications, embedded control and system integration tasks that require on-chip memory and deterministic logic structures.

With industry-oriented temperature rating, built-in JTAG testability, dedicated arithmetic chains and clocking options, this device provides a reliable, reconfigurable building block for medium-density designs that benefit from a single-chip programmable solution.

Request a quote or submit a quotation request to obtain pricing, availability and ordering information for EP1K30FI256-2N. Our team can provide lead-time details and support for integrating this ACEX-1K device into your designs.