EP1K30QC208-3N

The EP1K30QC208-3N is an ACEX-1K family FPGA IC in a 208-BFQFP (28×28) surface-mount package, offering 1,728 logic elements, 24,576 bits of embedded RAM, and 147 user I/O pins. It is a commercial-grade, reconfigurable logic device designed for system-on-a-programmable-chip (SOPC) integration, communications interfaces, and general-purpose embedded logic functions.

Built on the ACEX-1K architecture, this device combines an embedded array for memory-intensive megafunctions with a general logic array and dedicated arithmetic/cascade chains to accelerate common logic operations while retaining in-system programmability and boundary-scan testability.

Key Features

• Core Logic  Provides 1,728 logic elements supporting complex combinational and sequential logic implementations and up to 119,000 gates for system-level logic consolidation.
• Embedded Memory (EABs)  Approximately 24,576 bits of on-chip RAM implemented via embedded array blocks; dual-port capability enables concurrent access and efficient buffering for data-path functions.
• I/O and Voltage Support  147 user I/O pins with MultiVolt I/O capability to interface with 2.5 V, 3.3 V, and 5.0 V devices. Device requires a supply voltage in the range 2.375 V to 2.625 V and operates with a 2.5 V internal supply.
• Programmability & Test  In-circuit reconfigurability via external configuration devices or JTAG port and built-in JTAG boundary-scan test (IEEE 1149.1) for board-level debug and manufacturing test.
• Clocking & Timing  Built-in low-skew clock distribution with optional ClockLock and ClockBoost features to reduce clock delay and skew; dedicated carry and cascade chains accelerate arithmetic and high-fan-in logic.
• Package & Environmental  208-BFQFP (28×28) surface-mount package, commercial grade with an operating temperature range of 0 °C to 70 °C, and RoHS compliant.
• Flexible Interconnect  FastTrack continuous routing structure for predictable interconnect delays and support for internal tri-state emulation for bus implementations.

Typical Applications

• Communications Interfaces  Use the device’s embedded RAM and flexible I/O to implement protocol bridging, packet buffering, or interface glue logic in communication equipment.
• System Integration / SOPC  Combine on-chip logic and memory to consolidate multiple discrete functions into a single programmable device for compact embedded systems.
• Peripheral and Sensor Interfaces  Leverage 147 I/O pins and MultiVolt support to interface with mixed-voltage peripherals, sensors, and legacy logic devices.
• Data Buffering and Local Memory  Dual-port embedded arrays provide efficient on-chip buffering for small FIFOs, look-up tables, and temporary storage in real-time data paths.

Unique Advantages

• Highly integrated programmable logic: Consolidate multiple discrete components by combining 1,728 logic elements and on-chip RAM to reduce board complexity and BOM count.
• Flexible voltage interfacing: MultiVolt I/O enables direct interfacing with 2.5 V, 3.3 V, and 5.0 V devices, simplifying mixed-voltage system design.
• On-chip dual-port memory: Approximately 24,576 bits of embedded RAM with dual-port capability supports concurrent access patterns useful for buffering and shared data structures.
• Designed for in-system debug and reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability streamline development, testing, and field updates.
• Predictable timing and arithmetic acceleration: Dedicated carry and cascade chains plus low-skew clock networks help implement high-speed adders, counters, and wide logic functions efficiently.
• RoHS-compliant commercial solution: Surface-mount 208-BFQFP package rated for 0 °C to 70 °C, suitable for mainstream commercial embedded applications.

Why Choose EP1K30QC208-3N?

The EP1K30QC208-3N positions itself as a compact, cost-conscious FPGA option within the ACEX-1K family, providing a balance of logic density, embedded memory, and flexible I/O in a 208-BFQFP package. Its combination of 1,728 logic elements, 24,576 bits of RAM, and 147 I/O pins makes it well suited for designers who need on-chip memory and broad interfacing capability without moving to larger, more complex devices.

Scalable within the ACEX-1K family, this device supports migration paths where pin-compatible packages and family features allow designers to trade off density and I/O while retaining board-level compatibility. It is a practical choice for embedded system designers, equipment OEMs, and integrators targeting commercial-temperature applications that benefit from in-system programmability and boundary-scan testability.

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