EP1K30QC208-3

The EP1K30QC208-3 is an ACEX-1K series field programmable gate array (FPGA) from Intel, offered in a 208-pin BFQFP surface-mount package. It combines a logic array with dedicated embedded memory blocks to support mid-density programmable logic designs for commercial applications such as communications, consumer electronics, and general embedded systems.

This device provides 1,728 logic elements, approximately 24,576 bits of on-chip RAM, and 147 user I/O pins, delivering a balance of integration and I/O capability for compact system designs. The device operates within a supply range of 2.375 V to 2.625 V and is specified for commercial temperature operation (0 °C to 70 °C).

Key Features

• Core Logic — 1,728 logic elements (LEs) enabling combinational and sequential logic implementation with a maximum system gates figure consistent with the EP1K30 family.
• Embedded Memory — Approximately 24,576 bits of on-chip RAM organized in embedded array blocks (EABs) for efficient storage and dual-port memory usage within designs.
• I/O and Interfaces — 147 user I/O pins supporting flexible connectivity for peripherals and external devices; individual tri-state control and programmable I/O options as provided by the ACEX-1K family architecture.
• Package and Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor suited to compact PCB layouts.
• Power — Voltage supply range of 2.375 V to 2.625 V with an internal 2.5-V core supply architecture noted for the ACEX-1K family.
• Temperature and Grade — Commercial grade operation from 0 °C to 70 °C for standard commercial product deployments.
• Standards and Test — Family-level features include built-in JTAG boundary-scan test (IEEE Std. 1149.1) for board-level test and in-circuit configuration support.
• RoHS Compliance — Device is RoHS-compliant for lead-free assembly processes.

Typical Applications

• Communications Equipment — Implement protocol processing, interface bridging, and peripheral timing functions using the device's logic resources and embedded RAM.
• Consumer Electronics — Integrate control logic, display drivers, and custom peripheral interfaces in compact product PCBs leveraging the 208-BFQFP footprint.
• Embedded Systems — Provide glue logic, finite-state machines, and small on-chip memory structures for embedded controllers and instrumentation.
• Prototyping and Low- to Mid-Volume Products — Use the device for iterative hardware development and cost-conscious production where commercial-grade temperature range and surface-mount packaging are appropriate.

Unique Advantages

• Balanced Integration: 1,728 logic elements combined with ~24.6k bits of embedded RAM provide capacity for moderate-complexity logic and local storage without external memory.
• Flexible I/O Count: 147 user I/O pins support a wide range of external interfaces while keeping board-level routing manageable in a PQFP package.
• Compact Surface-Mount Package: 208-BFQFP packaging offers a dense footprint suitable for space-constrained designs and standard SMT assembly.
• Testability and In-Circuit Configuration: Built-in JTAG boundary-scan and in-system configurability options simplify board test and iterative development workflows.
• Regulatory and Assembly Friendly: RoHS compliance and common commercial supply voltages support contemporary assembly and environmental requirements.

Why Choose EP1K30QC208-3?

The EP1K30QC208-3 positions itself as a practical FPGA choice for engineers needing moderate logic density, embedded memory, and substantial I/O in a compact surface-mount package. Its combination of 1,728 logic elements, 24,576 bits of on-chip RAM, and 147 I/O pins makes it suitable for designs that require integrated logic and memory without the complexity of larger FPGA families.

Designed for commercial temperature operation and RoHS-compliant assembly, this device fits development and production environments where reliability, board-level testability, and in-system configurability are important. Its ACEX-1K family features—such as embedded array blocks, JTAG boundary-scan, and flexible I/O options—support streamlined integration and iterative product development.

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