EP20K100EBC356-1

IC FPGA 246 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA

Quantity 1,118 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O246Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EBC356-1 – APEX-20KE Field Programmable Gate Array (FPGA), 356-LBGA

The EP20K100EBC356-1 is an APEX-20KE family FPGA from Intel, featuring a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for on-chip memory and combinatorial functions. With 4,160 logic elements, approximately 53.2 Kbits of embedded memory, and 246 user I/Os in a 356-ball LBGA package, it is designed for designs that require compact, reconfigurable logic with flexible I/O and clock management.

On-chip features such as multiple PLLs, MultiVolt I/O support, and a dedicated FastTrack interconnect structure enable use in applications that need integrated memory, interface bridging, and controlled clocking while operating within a commercial temperature range.

Key Features

  • Core Architecture  APEX MultiCore architecture that integrates LUT logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive and memory functions.
  • Logic Resources  4,160 logic elements providing up to 263,000 maximum system gates for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 53,248 bits of on-chip RAM (embedded system blocks) suitable for FIFOs, dual-port RAM and CAM implementations.
  • I/O Capacity & Flexibility  246 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V) and programmable output features for interfacing with a wide range of peripherals and memory devices.
  • Clock Management  Flexible clock circuitry with support for up to four phase-locked loops (PLLs), low-skew clock tree and features for clock phase/delay control.
  • Low-Power Design  Designed for low-power operation with an internal supply around 1.8 V (specified 1.71 V to 1.89 V) and ESB power-saving modes.
  • Package & Mounting  356-ball BGA (35 × 35 mm) package, surface-mount mounting for compact board-level integration.
  • Commercial Grade & Compliance  Commercial-grade operating range (0 °C to 85 °C) and RoHS-compliant.

Typical Applications

  • Memory Interface Controllers  Implement DDR SDRAM or ZBT SRAM interface logic and on-chip buffering using the ESBs and high I/O pin count for external memory control.
  • Custom Logic & Prototyping  Rapidly develop and iterate custom digital logic, control state machines, and glue logic with 4,160 logic elements and embedded RAM resources.
  • High‑Speed I/O Bridging  Bridge and adapt peripheral buses and differential interfaces using MultiVolt I/O support and programmable I/O features.
  • Clocked Systems & Timing Control  Use integrated PLLs and the low-skew clock tree for synchronized multi-clock designs and timing-critical applications.

Unique Advantages

  • Integrated Memory and Logic:  Embedded system blocks provide approximately 53.2 Kbits of RAM alongside LUT-based logic to reduce external memory needs and simplify board design.
  • High I/O Count with Voltage Flexibility:  246 user I/Os and MultiVolt support (1.8 V–5.0 V) enable direct interfacing to a broad range of peripherals and legacy interfaces.
  • Compact, Surface‑Mount Package:  356-BGA (35 × 35 mm) packaging delivers a high-density solution for space-constrained PCBs.
  • Clocking and Timing Control:  Multiple PLLs and clock-management features allow precise control of clock distribution and phase for complex synchronous designs.
  • Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS-compliant for mainstream commercial applications.

Why Choose EP20K100EBC356-1?

The EP20K100EBC356-1 combines APEX-20KE MultiCore architecture, a meaningful complement of logic elements (4,160), and embedded RAM (approximately 53.2 Kbits) with 246 I/Os in a compact 356-LBGA package. This balance of on-chip memory, configurable logic and flexible I/O makes it well suited for designers who need integrated controller functions, memory interfaces, and timing control while minimizing external components.

Backed by Intel’s APEX-20K family architecture and a set of on-chip clocking and I/O features, the device supports scalable development across a range of commercial embedded systems where reconfigurability, interface flexibility and compact form factor are priorities.

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