EP20K100EBC356-1
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA |
|---|---|
| Quantity | 1,118 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 246 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EBC356-1 – APEX-20KE Field Programmable Gate Array (FPGA), 356-LBGA
The EP20K100EBC356-1 is an APEX-20KE family FPGA from Intel, featuring a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for on-chip memory and combinatorial functions. With 4,160 logic elements, approximately 53.2 Kbits of embedded memory, and 246 user I/Os in a 356-ball LBGA package, it is designed for designs that require compact, reconfigurable logic with flexible I/O and clock management.
On-chip features such as multiple PLLs, MultiVolt I/O support, and a dedicated FastTrack interconnect structure enable use in applications that need integrated memory, interface bridging, and controlled clocking while operating within a commercial temperature range.
Key Features
- Core Architecture APEX MultiCore architecture that integrates LUT logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive and memory functions.
- Logic Resources 4,160 logic elements providing up to 263,000 maximum system gates for implementing custom digital logic and control functions.
- Embedded Memory Approximately 53,248 bits of on-chip RAM (embedded system blocks) suitable for FIFOs, dual-port RAM and CAM implementations.
- I/O Capacity & Flexibility 246 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V) and programmable output features for interfacing with a wide range of peripherals and memory devices.
- Clock Management Flexible clock circuitry with support for up to four phase-locked loops (PLLs), low-skew clock tree and features for clock phase/delay control.
- Low-Power Design Designed for low-power operation with an internal supply around 1.8 V (specified 1.71 V to 1.89 V) and ESB power-saving modes.
- Package & Mounting 356-ball BGA (35 × 35 mm) package, surface-mount mounting for compact board-level integration.
- Commercial Grade & Compliance Commercial-grade operating range (0 °C to 85 °C) and RoHS-compliant.
Typical Applications
- Memory Interface Controllers Implement DDR SDRAM or ZBT SRAM interface logic and on-chip buffering using the ESBs and high I/O pin count for external memory control.
- Custom Logic & Prototyping Rapidly develop and iterate custom digital logic, control state machines, and glue logic with 4,160 logic elements and embedded RAM resources.
- High‑Speed I/O Bridging Bridge and adapt peripheral buses and differential interfaces using MultiVolt I/O support and programmable I/O features.
- Clocked Systems & Timing Control Use integrated PLLs and the low-skew clock tree for synchronized multi-clock designs and timing-critical applications.
Unique Advantages
- Integrated Memory and Logic: Embedded system blocks provide approximately 53.2 Kbits of RAM alongside LUT-based logic to reduce external memory needs and simplify board design.
- High I/O Count with Voltage Flexibility: 246 user I/Os and MultiVolt support (1.8 V–5.0 V) enable direct interfacing to a broad range of peripherals and legacy interfaces.
- Compact, Surface‑Mount Package: 356-BGA (35 × 35 mm) packaging delivers a high-density solution for space-constrained PCBs.
- Clocking and Timing Control: Multiple PLLs and clock-management features allow precise control of clock distribution and phase for complex synchronous designs.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant for mainstream commercial applications.
Why Choose EP20K100EBC356-1?
The EP20K100EBC356-1 combines APEX-20KE MultiCore architecture, a meaningful complement of logic elements (4,160), and embedded RAM (approximately 53.2 Kbits) with 246 I/Os in a compact 356-LBGA package. This balance of on-chip memory, configurable logic and flexible I/O makes it well suited for designers who need integrated controller functions, memory interfaces, and timing control while minimizing external components.
Backed by Intel’s APEX-20K family architecture and a set of on-chip clocking and I/O features, the device supports scalable development across a range of commercial embedded systems where reconfigurability, interface flexibility and compact form factor are priorities.
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