EP20K100EBC356-3

IC FPGA 246 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA

Quantity 1,400 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O246Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EBC356-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA

The EP20K100EBC356-3 is an APEX-20KE family field programmable gate array (FPGA) in a 356-ball LBGA package designed for commercial applications. It integrates a MultiCore architecture combining look-up table (LUT) logic and embedded system blocks (ESBs) to implement logic and on-chip memory functions.

This device targets designs that need a mid-range FPGA resource set—including 4,160 logic elements, 246 user I/Os, and 53,248 bits of on-chip RAM—while providing flexible I/O options and clock management for system-level integration and mixed-voltage interfacing.

Key Features

  • Core Architecture  MultiCore architecture with LUT logic and embedded system blocks (ESBs) for register‑intensive and memory-related functions.
  • Logic Resources  4,160 logic elements and a maximum gate count listed as 263,000, providing capacity for mid-range programmable logic implementations.
  • Embedded Memory  53,248 total RAM bits on-chip for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations.
  • I/O and Standards Support  246 user I/O pins with MultiVolt I/O interface support; programmable clamps and slew-rate control plus individual tri-state enable for flexible signal interfacing.
  • Clock Management  Flexible clock resources including up to four phase-locked loops (PLLs), built-in low-skew clock tree, up to eight global clocks, and programmable clock phase/delay features.
  • High-Speed Interfaces  Architectural support for high-speed external memories such as DDR SDRAM and ZBT SRAM, PCI-compliant 3.3‑V operation, and differential signaling like LVDS.
  • Power and Supply  Internal voltage supply range of 1.71 V to 1.89 V and MultiVolt I/O levels to interface with a range of external devices.
  • Package & Thermal  356-LBGA (35 × 35 mm BGA) surface-mount package rated for commercial operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Communications & Networking  Implement protocol bridging, packet processing, or memory interface logic using the device’s flexible I/O and embedded RAM capabilities.
  • Memory Controllers & Interfaces  Use the on-chip RAM and high-speed interface support for DDR SDRAM or ZBT SRAM control and buffering.
  • Embedded System Integration  Leverage ESBs for FIFOs, dual-port RAM and CAM to build compact system-on-programmable-chip (SOPC) designs.
  • High-Speed I/O Designs  Deploy LVDS and high-frequency bidirectional I/O paths for data acquisition, SERDES front-ends, or high-throughput signaling.

Unique Advantages

  • MultiCore Integration:  Combines LUT-based logic and embedded system blocks to implement both register-intensive and memory-intensive functions within a single device.
  • Balanced Resource Set:  4,160 logic elements with 53,248 bits of embedded RAM and 246 I/Os provide a practical mid-range resource mix for many system designs.
  • Flexible Clocking:  Multiple PLLs, global clock signals and programmable phase/delay features enable precise clock domain management for complex designs.
  • Mixed-Voltage Interfacing:  MultiVolt I/O support and programmable I/O features allow direct interfacing to a variety of external voltage domains.
  • Compact, Surface-Mount Package:  356-LBGA (35 × 35 mm) package supports high-density PCB layouts while maintaining a commercial temperature range for general-purpose applications.

Why Choose EP20K100EBC356-3?

The EP20K100EBC356-3 offers a practical combination of logic, embedded memory, and I/O flexibility within the APEX-20K family architecture. Its MultiCore design and ESB support make it suitable for designs that require integrated memory functions alongside LUT-based logic.

This device is well suited to engineers and teams building mid-range programmable solutions that need mixed-voltage I/O capability, configurable clock management, and on-chip RAM for buffering and control logic. As a member of the APEX 20K family, it provides a clear path for scaling within related device options.

Request a quote or submit your requirements to receive pricing and availability for the EP20K100EBC356-3. Our team can provide a tailored quote to support your project timeline and volume needs.

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