EP20K100EBC356-2
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA |
|---|---|
| Quantity | 1,335 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 246 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EBC356-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA
The EP20K100EBC356-2 is an APEX-20KE family FPGA in a 356-ball BGA package, offering a balance of logic capacity, embedded memory and flexible I/O for commercial-grade applications. It implements the APEX MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to support both register‑intensive and memory/combinatorial functions.
This device targets designers who need up to 4,160 logic elements, approximately 53,248 bits of on-chip RAM, and 246 user I/O pins in a compact 35×35 356-BGA package, with low-power operation at a 1.71–1.89 V internal supply and an ambient operating range of 0 °C to 85 °C.
Key Features
- Core Logic 4,160 logic elements and a maximum of 263,000 system gates provide programmable resources for combinational and sequential designs.
- Embedded Memory Approximately 53,248 bits of embedded RAM implemented in ESBs to build FIFOs, dual-port RAM and CAM structures.
- I/O Capacity & Flexibility 246 user I/O pins with MultiVolt I/O interface support for mixed-voltage systems and programmable output slew-rate and clamp options.
- Clock Management Integrated clock resources from the APEX family include up to four PLLs, a built-in low-skew clock tree, and features for programmable clock phase and delay shifting.
- Memory and Interface Support Family-level support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and advanced I/O standards useful for system-level interfaces.
- Power & Voltage Designed for low-power operation with an internal voltage supply range of 1.71 V to 1.89 V and MultiVolt I/O support for interfacing to 1.8 V, 2.5 V, 3.3 V and 5.0 V signals (family-level capability).
- Package & Mounting Surface-mount 356-LBGA package (356‑BGA, 35×35) optimized for compact board layouts.
- Commercial Temperature Grade Rated for 0 °C to 85 °C ambient operation to suit standard commercial electronics applications.
- Standards & System Integration Family feature set includes embedded JTAG boundary-scan and dedicated low-latency interconnect (FastTrack) for predictable timing.
Typical Applications
- Interface and Bridge Logic Implement protocol bridging, bus interfacing and custom I/O adaptation using the device’s 246 I/O pins and MultiVolt I/O capability.
- Memory Controllers and Buffers Use embedded RAM and ESBs to build FIFOs and dual-port memories for buffering and high-speed memory interfacing.
- Control and Timing Systems Leverage multiple PLLs and the low-skew clock tree for clock distribution, multiplication/division and phase shifting in timing-critical designs.
- Custom Logic and Glue Deploy the 4,160 logic elements to implement glue logic, state machines, and peripheral controllers in compact commercial products.
Unique Advantages
- Balanced Logic and Memory A combination of 4,160 logic elements and ~53,248 bits of embedded RAM enables mixed compute-and-buffer functions without external memory for many designs.
- Flexible I/O Integration 246 user I/Os with MultiVolt support simplify integration with a range of external devices and voltage domains.
- Integrated Clocking Up to four PLLs and programmable clock features reduce the need for external clock management components.
- Compact BGA Package The 356‑ball BGA (35×35) delivers a high-pin-count solution in a compact footprint for space-constrained assemblies.
- Commercial-Grade Reliability Rated for standard commercial temperature ranges (0 °C to 85 °C) and RoHS compliant construction for broad electronic product integration.
Why Choose EP20K100EBC356-2?
The EP20K100EBC356-2 provides a practical balance of logic density, embedded memory and flexible I/O in the APEX‑20KE family architecture. Its MultiCore approach, ESB memory structures and clock management features make it well suited to commercial designs that require integrated buffering, deterministic timing and mixed-voltage interfacing.
This device is a fit for development teams building compact, cost-sensitive systems that need on-chip RAM, multiple I/O domains and reliable clocking in a 356‑BGA package. Its commercial-grade rating and RoHS compliance support mainstream product deployments while leveraging the APEX family feature set.
Request a quote or submit your specifications to initiate a procurement inquiry for EP20K100EBC356-2.

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