EP20K100EBC356-2

IC FPGA 246 I/O 356BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA

Quantity 1,335 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case356-LBGANumber of I/O246Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EBC356-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA

The EP20K100EBC356-2 is an APEX-20KE family FPGA in a 356-ball BGA package, offering a balance of logic capacity, embedded memory and flexible I/O for commercial-grade applications. It implements the APEX MultiCore architecture with look-up table (LUT) logic and embedded system blocks (ESBs) to support both register‑intensive and memory/combinatorial functions.

This device targets designers who need up to 4,160 logic elements, approximately 53,248 bits of on-chip RAM, and 246 user I/O pins in a compact 35×35 356-BGA package, with low-power operation at a 1.71–1.89 V internal supply and an ambient operating range of 0 °C to 85 °C.

Key Features

  • Core Logic  4,160 logic elements and a maximum of 263,000 system gates provide programmable resources for combinational and sequential designs.
  • Embedded Memory  Approximately 53,248 bits of embedded RAM implemented in ESBs to build FIFOs, dual-port RAM and CAM structures.
  • I/O Capacity & Flexibility  246 user I/O pins with MultiVolt I/O interface support for mixed-voltage systems and programmable output slew-rate and clamp options.
  • Clock Management  Integrated clock resources from the APEX family include up to four PLLs, a built-in low-skew clock tree, and features for programmable clock phase and delay shifting.
  • Memory and Interface Support  Family-level support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and advanced I/O standards useful for system-level interfaces.
  • Power & Voltage  Designed for low-power operation with an internal voltage supply range of 1.71 V to 1.89 V and MultiVolt I/O support for interfacing to 1.8 V, 2.5 V, 3.3 V and 5.0 V signals (family-level capability).
  • Package & Mounting  Surface-mount 356-LBGA package (356‑BGA, 35×35) optimized for compact board layouts.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C ambient operation to suit standard commercial electronics applications.
  • Standards & System Integration  Family feature set includes embedded JTAG boundary-scan and dedicated low-latency interconnect (FastTrack) for predictable timing.

Typical Applications

  • Interface and Bridge Logic  Implement protocol bridging, bus interfacing and custom I/O adaptation using the device’s 246 I/O pins and MultiVolt I/O capability.
  • Memory Controllers and Buffers  Use embedded RAM and ESBs to build FIFOs and dual-port memories for buffering and high-speed memory interfacing.
  • Control and Timing Systems  Leverage multiple PLLs and the low-skew clock tree for clock distribution, multiplication/division and phase shifting in timing-critical designs.
  • Custom Logic and Glue  Deploy the 4,160 logic elements to implement glue logic, state machines, and peripheral controllers in compact commercial products.

Unique Advantages

  • Balanced Logic and Memory  A combination of 4,160 logic elements and ~53,248 bits of embedded RAM enables mixed compute-and-buffer functions without external memory for many designs.
  • Flexible I/O Integration  246 user I/Os with MultiVolt support simplify integration with a range of external devices and voltage domains.
  • Integrated Clocking  Up to four PLLs and programmable clock features reduce the need for external clock management components.
  • Compact BGA Package  The 356‑ball BGA (35×35) delivers a high-pin-count solution in a compact footprint for space-constrained assemblies.
  • Commercial-Grade Reliability  Rated for standard commercial temperature ranges (0 °C to 85 °C) and RoHS compliant construction for broad electronic product integration.

Why Choose EP20K100EBC356-2?

The EP20K100EBC356-2 provides a practical balance of logic density, embedded memory and flexible I/O in the APEX‑20KE family architecture. Its MultiCore approach, ESB memory structures and clock management features make it well suited to commercial designs that require integrated buffering, deterministic timing and mixed-voltage interfacing.

This device is a fit for development teams building compact, cost-sensitive systems that need on-chip RAM, multiple I/O domains and reliable clocking in a 356‑BGA package. Its commercial-grade rating and RoHS compliance support mainstream product deployments while leveraging the APEX family feature set.

Request a quote or submit your specifications to initiate a procurement inquiry for EP20K100EBC356-2.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up