EP20K100EBI356-2X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA |
|---|---|
| Quantity | 171 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 246 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EBI356-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 356-LBGA
The EP20K100EBI356-2X is an APEX 20K family FPGA offering a mid-range logic density targeted for industrial applications. It combines MultiCore architecture with embedded memory and a comprehensive I/O set to support system-level programmable logic implementations.
With 4,160 logic elements, approximately 53,248 bits of on-chip RAM, and 246 user I/O pins in a 356-LBGA (35×35) package, this device is suited for designs that require moderate logic capacity, substantial local memory, and flexible high-speed interfacing within an industrial temperature range.
Key Features
- MultiCore FPGA Architecture APEX 20K family architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory for mixed register- and memory-intensive functions.
- Logic Density 4,160 logic elements and up to 263,000 system gates provide mid-range capacity for complex glue logic and control functions.
- Embedded Memory Total on-chip RAM: 53,248 bits (approximately 0.053 Mbits) to implement FIFOs, dual-port RAMs, and other memory functions.
- I/O Capability 246 user I/O pins support high pin-count designs and multiple interface standards as supported by the APEX 20K family.
- Clock Management Family-level support for flexible clock management including multiple phase-locked loops (PLLs), low-skew clock tree, and multiple global clock signals for synchronous system design.
- High-speed Interface Support APEX 20K family features include support for high-speed external memories and industry interfaces suitable for bridging and memory controller applications.
- Package and Mounting 356-LBGA (356-BGA, 35×35) surface-mount package provides a compact footprint for board-level integration.
- Power and Environmental Voltage supply range 1.71 V to 1.89 V and industrial operating temperature range from −40 °C to 100 °C. RoHS compliant.
Typical Applications
- High-speed Interface Bridging Use the device’s I/O density and family-level support for high-speed memory and peripheral interfaces to implement protocol bridges and interface controllers.
- Embedded Memory and Buffering Implement FIFOs, small RAM buffers, and shared memory structures using the on-chip embedded memory for data flow and buffering tasks.
- Industrial Control and I/O Aggregation Leverage 246 I/Os and industrial temperature rating to aggregate sensors, actuators, and control logic in harsh environments.
- System Glue Logic and Custom Logic Deploy the 4,160 logic elements to consolidate glue logic, timing-critical state machines, and custom processing in compact systems.
Unique Advantages
- Balanced Logic and Memory Capacity: 4,160 logic elements paired with approximately 53,248 bits of embedded RAM deliver a balanced resource mix for control-and-data applications.
- High I/O Count: 246 user I/Os allow flexible connection to peripherals, memory devices, and board-level buses without external multiplexing.
- Compact BGA Packaging: 356-LBGA (35×35) package reduces board area while supporting high pin density for space-constrained designs.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to meet temperature requirements for industrial deployments.
- Family-Level Clock and Interface Features: APEX 20K family capabilities—such as PLL-based clock management and support for high-speed memory interfaces—enable robust timing and data-path implementations.
- Regulatory-Friendly Supply Chain: RoHS compliance supports use in assemblies requiring lead-free components.
Why Choose EP20K100EBI356-2X?
The EP20K100EBI356-2X positions itself as a reliable mid-density FPGA for industrial applications that need a combination of logic, embedded memory, and extensive I/O in a compact BGA package. Its APEX 20K family architecture provides the system-level features required for memory buffering, interface bridging, and control logic while meeting industrial temperature and RoHS requirements.
Designers seeking a field-programmable solution with balanced resources and family-level clock and high-speed interface support will find this device suitable for scalable, robust designs that demand both integration and predictable board-level performance.
Request a quote or submit a materials inquiry to obtain pricing, availability, and lead-time information for the EP20K100EBI356-2X.

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