EP20K160EQC208-2X

IC FPGA 143 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 143 81920 6400 208-BFQFP

Quantity 550 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O143Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs640Number of Logic Elements/Cells6400
Number of Gates404000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of EP20K160EQC208-2X – APEX-20KE Field Programmable Gate Array (FPGA), 208-BFQFP

The EP20K160EQC208-2X is an APEX-20KE family FPGA in a 208-BFQFP package offering a balanced mix of programmable logic, on-chip embedded memory, and flexible I/O. Built on the APEX 20K MultiCore architecture, the device integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to support combinatorial and memory-intensive functions.

This commercial-grade FPGA targets designs that require mid-density logic integration, embedded memory resources, and a rich set of I/O and clock-management features while operating within a 0 °C to 85 °C range and a 1.71 V to 1.89 V supply window.

Key Features

  • Logic Capacity — Provides 6,400 logic elements (LEs) and approximately 404,000 system gates for mid-density programmable logic integration.
  • Embedded Memory — Includes approximately 0.082 Mbits (81,920 bits) of on-chip RAM implemented via Embedded System Blocks (ESBs) for FIFOs, dual-port RAM and CAM-like functions.
  • I/O Count & Flexibility — 143 general-purpose I/O pins with MultiVolt I/O interface support and programmable clamp/slew options for interfacing across multiple voltage domains.
  • Clock Management — APEX 20K family features flexible clock circuitry including up to four PLLs, a built-in low-skew clock tree and support for up to eight global clock signals.
  • High-speed I/O Capabilities — Series-level support includes bidirectional I/O performance up to 250 MHz and LVDS performance up to 840 Mbits/channel for high-bandwidth signaling.
  • Power & Voltage — Device-specific supply range: 1.71 V to 1.89 V; APEX 20K family designed with low-power features and ESB programmable power-saving modes.
  • Package & Mounting — Surface-mount 208-BFQFP package; supplier device package listed as 208-PQFP (28×28).
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Design Integration — MultiCore architecture combining LUTs, product-term logic and ESBs to enable mixed register- and memory-intensive functions.

Typical Applications

  • Embedded System Integration — Implement SOPC-style functions and on-chip memory buffers for control and data-path logic in embedded designs.
  • Memory Interface and Buffering — Use ESBs to build FIFOs and dual-port RAM for DDR SDRAM and ZBT SRAM front-end buffering and memory controllers.
  • High-speed I/O and Bus Bridging — Support for high-speed I/O standards and PCI Local Bus interfaces enables bridging and peripheral connectivity in data-path applications.
  • Signal Processing and Prototyping — Combine LUT logic and ESB resources for register-intensive and combinatorial processing tasks during algorithm development and prototyping.

Unique Advantages

  • Integrated Logic and Memory: Co-located LUT logic and ESB memory reduce external component count and simplify board-level memory buffering.
  • Flexible I/O Connectivity: 143 I/O pins with MultiVolt support and programmable I/O behavior help interface directly with diverse peripheral voltages and standards.
  • Deterministic Clocking: Multiple PLLs and a low-skew clock tree enable controlled timing distribution for synchronous designs.
  • Mid-density Capacity: 6,400 logic elements and ~404k gates provide a practical balance of capacity for control, interface, and data-path logic without overprovisioning.
  • Commercial-ready Thermal Range: Rated for 0 °C to 85 °C operation to meet standard commercial application environments.

Why Choose EP20K160EQC208-2X?

The EP20K160EQC208-2X delivers a practical, mid-density FPGA solution within the APEX 20K family, combining 6,400 logic elements, substantial on-chip RAM, and a high count of flexible I/Os in a compact 208-BFQFP package. Its MultiCore architecture and ESB-based memory enable designers to consolidate logic and buffering, simplifying system architecture and reducing external BOM.

This device is well-suited for engineers building commercial embedded systems, high-speed I/O interfaces, memory front ends, or prototyping environments where integrated memory and deterministic clocking are required. Documentation and family-level features from the APEX 20K series support development and integration efforts.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for EP20K160EQC208-2X.

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