EP20K160EFC484-3N

The EP20K160EFC484-3N is an APEX-20KE family FPGA delivering a MultiCore architecture that integrates LUT-based logic, product-term logic and embedded system blocks (ESBs) for on-chip memory and combinatorial functions. With 6,400 logic elements, approximately 0.082 Mbits of embedded RAM and 316 user I/O pins, this commercial-grade device targets designs that require moderate logic density, on-chip memory and flexible I/O configuration.

Built for system-on-a-programmable-chip (SOPC) integration, the device supports clock management and advanced I/O standards to enable memory interfaces, high-speed I/O and mixed-voltage system integration while operating over a 1.71 V to 1.89 V supply range and a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Architecture  MultiCore architecture combining look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for register‑intensive and combinatorial functions.
• Logic Capacity  6,400 logic elements and up to 404,000 system gates for medium-density programmable logic implementations.
• Embedded Memory  Approximately 0.082 Mbits (81,920 bits) of on-chip RAM implemented via ESBs for FIFOs, dual-port RAM and CAM-style functions.
• I/O and Interfaces  316 user I/O pins with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V, 5.0 V noted in family data) and programmable I/O features such as clamp, tri-state enable and slew-rate control.
• Clock Management  Up to four phase-locked loops (PLLs), low-skew clock tree and multiple global clocks with ClockLock, ClockBoost and ClockShift features referenced in the family documentation.
• Memory and Bus Support  Family-level support for high-speed external memories including DDR SDRAM and ZBT SRAM, and PCI 3.3-V operation at 33/66 MHz as described in the device family documentation.
• Power  Internal supply operating in the 1.71 V to 1.89 V range; family data highlights low-power design options and programmable ESB power-saving mode.
• Package & Mounting  Surface-mount 484-BBGA package (supplier device package indicated as 484-FBGA, 23×23) for compact board implementation.
• Commercial Grade & Compliance  Commercial temperature range (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Embedded system integration  System-on-a-programmable-chip designs leveraging the MultiCore architecture and ESBs for on-chip memory and peripheral functions.
• Memory interface controllers  Implementing DDR SDRAM or ZBT SRAM interfaces where on-chip ESBs and flexible I/O support are required.
• PCI-based data paths  3.3-V PCI bus operation and programmable I/O features make the device suitable for PCI data-path logic and bridging functions.
• High-speed I/O designs  LVDS and other high-speed signaling standards supported at the family level for serial/parallel data transfer and interconnects.

Unique Advantages

• Integrated SOPC capabilities: MultiCore architecture and embedded system blocks enable compact implementation of memory-intensive and register-heavy functions on a single device.
• Balanced density and I/O: 6,400 logic elements paired with 316 user I/O pins provide a balance of logic capacity and external connectivity for mid-range designs.
• On-chip memory flexibility: Approximately 0.082 Mbits of embedded RAM implemented in ESBs supports FIFOs, dual-port RAM and CAM-style functions without reducing available logic.
• Comprehensive clock features: Multiple PLLs, low-skew clock tree and programmable clock-shifting features help manage complex timing and multi-clock domains.
• Compact package: 484-BBGA (484-FBGA, 23×23) surface-mount package enables high-density PCB layouts while supporting robust I/O counts.
• Commercial deployment ready: RoHS compliant with a 0 °C to 85 °C operating range for commercial applications.

Why Choose EP20K160EFC484-3N?

The EP20K160EFC484-3N delivers a practical combination of logic density, embedded memory and flexible I/O in the APEX 20KE family architecture. Its MultiCore approach and ESB resources let engineers consolidate memory and combinatorial functions on-chip, reducing external component count and simplifying board-level design.

This device is well suited to customers developing mid-range FPGA solutions that require SOPC-style integration, moderate gate density and extensive I/O, backed by family-level features such as advanced clock management and wide I/O standard support. The commercial-grade specifications and RoHS compliance provide predictable performance in standard temperature environments.

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