EP20K160EFC484-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 316 81920 6400 484-BBGA |
|---|---|
| Quantity | 615 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 316 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 640 | Number of Logic Elements/Cells | 6400 | ||
| Number of Gates | 404000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of EP20K160EFC484-3 – APEX-20KE FPGA, 6,400 Logic Elements, 81,920‑bit RAM, 316 I/O, 484‑BBGA
The EP20K160EFC484-3 is an Intel APEX-20KE field programmable gate array (FPGA) provided in a 484‑BBGA package for surface-mount applications. It implements a MultiCore architecture combining LUT-based logic and embedded system blocks to address register‑intensive and memory‑intensive functions. Typical use cases include mid-density programmable logic tasks requiring a balance of logic resources, on‑chip RAM, and flexible I/O in commercial temperature environments.
Key Features
- Core Capacity — Up to 404,000 system gates and 6,400 logic elements, enabling complex combinatorial and sequential logic implementations.
- Embedded Memory — 81,920 total RAM bits of on‑chip memory for FIFOs, dual‑port RAM and other embedded memory functions.
- I/O Resources — 316 user I/O pins with MultiVolt I/O support allowing interface with 1.8 V, 2.5 V, 3.3 V and 5.0 V devices.
- Clock and Timing — Flexible clock management with support for up to four PLLs, multiple global clocks, and built‑in low‑skew clock tree functionality.
- Power — Internal voltage supply specified at 1.71 V to 1.89 V; designed for low‑power operation and offering programmable power‑saving modes in embedded blocks.
- Package and Mounting — 484‑BBGA package (supplier device package listed as 484‑FBGA, 23×23) for surface‑mount assembly.
- Operating Conditions — Commercial grade operation with specified ambient range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Embedded Control — Implement control logic and state machines in consumer and industrial equipment using the device’s LUTs and logic elements.
- Memory Interfaces — Use embedded RAM blocks for FIFO buffering and interface logic in systems requiring on‑chip temporary storage.
- Custom I/O and Protocol Bridging — Leverage 316 I/O pins and MultiVolt I/O capability to bridge different voltage domains and custom peripheral interfaces.
- Clock‑Rich Designs — Systems that require multiple clock domains or clock multiplication/division benefit from the integrated PLL and clock management features.
Unique Advantages
- Balanced Logic-to-Memory Ratio: 6,400 logic elements paired with 81,920 bits of embedded RAM provide a balanced resource set for mixed logic and buffering tasks.
- Flexible I/O Voltage Support: MultiVolt I/O compatibility enables direct interfacing to a wide range of peripheral voltage levels without added level‑shifters.
- Integrated Clock Management: On‑chip PLLs and a low‑skew clock tree simplify multi‑clock designs and reduce external clocking components.
- Compact Surface‑Mount Package: The 484‑BBGA footprint provides a high pin count in a compact package suitable for PCB space‑constrained assemblies.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with general commercial application requirements.
- Standards‑Oriented I/O: I/O features support a variety of signaling needs for common bus and peripheral standards through programmable I/O options.
Why Choose EP20K160EFC484-3?
The EP20K160EFC484-3 offers a practical combination of mid‑density logic resources, substantial on‑chip RAM, and extensive I/O in a compact 484‑BBGA package. Its MultiCore architecture and embedded system blocks provide designers with flexible building blocks for register‑intensive and memory‑centric functions while integrated clock management helps streamline multi‑domain timing. This part is well suited to teams designing commercial‑grade embedded systems that require a balanced FPGA resource set and MultiVolt I/O support.
Long‑term value is supported by the APEX‑20K family architecture and the device’s programmable features, making it a viable choice for applications where integration, configurable logic, and embedded memory reduce board‑level complexity.
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