EP20K160EFI484-2X

IC FPGA 316 I/O 484FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 316 81920 6400 484-BBGA

Quantity 894 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs640Number of Logic Elements/Cells6400
Number of Gates404000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of EP20K160EFI484-2X – APEX-20KE® FPGA IC, 6,400 logic elements, 81,920 bits RAM, 316 I/O, 484-BBGA

The EP20K160EFI484-2X is an APEX-20KE® field programmable gate array (FPGA) offered in a 484-BBGA surface-mount package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory to deliver a balanced combination of configurable logic, on-chip RAM and flexible I/O.

Targeted at designs requiring moderate-density programmable logic with industrial-temperature operation, this device supports system-level integration for interfaces, memory controllers and clock-rich applications while providing low-voltage internal operation.

Key Features

  • Core architecture: MultiCore architecture combining LUT logic, product-term logic and embedded system blocks (ESBs) for register-intensive and combinatorial functions.
  • Logic capacity: 6,400 logic elements, corresponding to approximately 404,000 system gates for moderate-density logic implementation.
  • Embedded memory: Approximately 0.08 Mbits of embedded memory (81,920 bits) for FIFOs, dual-port RAM and CAM-style functions.
  • I/O and interfacing: 316 user I/O pins with MultiVolt I/O interface support across typical APEX 20KE device levels; supports high-speed interfaces such as PCI (3.3 V operation) and LVDS capability described for the family.
  • Clock management: Family features include multiple PLLs, a low-skew clock tree and programmable clock phase/delay features to support complex timing and clock distribution requirements.
  • Power and supply: Designed for low-power operation; internal voltage supply specified at 1.71 V to 1.89 V for the device.
  • Package and thermal: Surface-mount 484-BBGA (supplier package: 484-FBGA, 23 × 23) with operating temperature range of −40 °C to 100 °C for industrial deployment.
  • On-board test and reliability: Family documentation describes integrated JTAG boundary-scan and programmable ESB features that support in-system test and configuration flows.

Typical Applications

  • High-speed memory interfaces: Implement memory controllers and logic for DDR SDRAM or ZBT SRAM interfaces using on-chip memory and flexible I/O.
  • PCI and bus bridging: Use the device for PCI-compliant 3.3 V bus functions and interface bridging in expansion or mezzanine card designs.
  • Industrial control and automation: Deploy in industrial systems requiring programmable logic, on-chip RAM buffers and an extended −40 °C to 100 °C operating range.
  • High-speed serial and differential signaling: Support LVDS channels and other high-speed I/O standards for signal conditioning and data aggregation.

Unique Advantages

  • Integrated MultiCore architecture: Combines LUTs, product-term logic and ESBs to reduce external component count for memory and combinatorial functions.
  • Balanced capacity for moderate-density designs: 6,400 logic elements and ~404,000 gates enable complex logic implementation without overspecifying resources.
  • Flexible I/O with broad interface support: 316 user I/Os and family-level MultiVolt support enable interfacing with a wide range of voltage domains and peripheral standards.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments where extended temperature range is required.
  • Compact BGA footprint: 484-BBGA (23 × 23) provides a space-efficient package for board-level integration while maintaining high I/O density.
  • On-chip clock management: Multiple PLLs and programmable clock features simplify timing architectures for synchronous systems.

Why Choose EP20K160EFI484-2X?

The EP20K160EFI484-2X positions itself as a practical choice for engineers needing a mid-density FPGA with embedded memory, plentiful I/O and robust clock management in a compact BGA package. Its APEX-20KE family heritage provides a coherent feature set for integrating memory functions, interface logic and timing control on-chip.

With industrial temperature support and a specified internal supply range, this device suits designs that require reliable operation across temperature extremes and low-voltage internal operation while keeping system BOM and board area under control.

Request a quote or submit an inquiry to receive pricing and availability information for EP20K160EFI484-2X.

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