EP20K160EFC484-2XB

The EP20K160EFC484-2XB is a commercial-grade APEX 20KE family FPGA in a 484-BBGA surface-mount package. It implements the family’s MultiCore architecture combining look-up table (LUT) logic, product-term logic and embedded memory to support system-on-programmable-chip integration.

With 6,400 logic elements, approximately 0.082 Mbits of embedded memory, 316 user I/O pins and roughly 404,000 system gates, this device is targeted at medium-density programmable logic applications requiring flexible I/O, on-chip memory and versatile clocking.

Key Features

• Core architecture — MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks for memory and combinatorial functions.
• Logic density — 6,400 logic elements and approximately 404,000 system gates suitable for mid-range FPGA designs.
• On-chip memory — Total RAM bits: 81,920 (approximately 0.082 Mbits) for FIFOs, dual-port RAM and CAM-style implementations.
• I/O and interface flexibility — 316 user I/O pins with MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling; programmable clamp and slew-rate control.
• Clock management — Flexible clocking with up to four PLLs, a built-in low-skew clock tree and support for up to eight global clock signals plus ClockLock, ClockBoost and ClockShift features.
• High-speed I/O support — Family-level support for DDR SDRAM and ZBT SRAM interfaces, PCI 3.3-V compliance (per family specification) and LVDS performance up to 840 Mbits per channel.
• Power and supply — Internal supply range 1.71 V to 1.89 V; designed for low-power operation with MultiVolt I/O capability (series-level characteristic).
• Package and mounting — 484-BBGA (supplier package 484-FBGA, 23×23) surface-mount package; RoHS compliant.
• Commercial operating range — Rated for 0 °C to 85 °C operating temperature.

Typical Applications

• Memory interface controllers — Implement DDR SDRAM and ZBT SRAM controllers using on-chip ESBs and the device’s high-speed I/O support.
• High-speed serial and parallel I/O — LVDS and multi-voltage I/O capability enable serial link and parallel bus implementations for communication equipment.
• Embedded system integration — SOPC-style integration using LUT logic and embedded memory for custom peripherals, FIFOs and CAM functions.
• PCI-based subsystem logic — Support for 3.3-V PCI operation at family level enables integration of bus logic and bridge functions.

Unique Advantages

• Integrated MultiCore architecture: Combines LUTs, product-term logic and embedded system blocks to simplify implementation of both register- and memory-intensive functions.
• Balanced mid-range resources: 6,400 logic elements and ~81.9kbits of on-chip RAM deliver a practical resource mix for medium-complexity designs.
• Flexible I/O strategy: 316 user I/O pins and MultiVolt support reduce the need for external level shifters and simplify multi-voltage system integration.
• Advanced clocking: Multiple PLLs, global clock signals and built-in skew control enable precise clock domain management and timing optimization.
• Compact, RoHS-compliant package: 484-BBGA surface-mount packaging provides a high-pin-count footprint while meeting RoHS requirements for modern assemblies.
• Commercial temperature rating: Specified 0 °C to 85 °C for designs targeting general-purpose electronics and embedded applications.

Why Choose EP20K160EFC484-2XB?

The EP20K160EFC484-2XB positions itself as a balanced, mid-density FPGA solution within the APEX 20KE family—offering a combination of 6,400 logic elements, roughly 0.082 Mbits of embedded memory and extensive I/O capability in a compact 484-BBGA package. Its MultiCore architecture and family-level clocking and I/O features enable designers to implement integrated logic, memory buffers and high-speed interfaces with fewer external components.

This device is suited for engineers developing medium-complexity programmable logic subsystems that require multi-voltage interfacing, flexible clock management and on-chip memory. Backed by APEX 20K family documentation from the manufacturer, it delivers a clear specification set for reliable procurement and integration into new or existing embedded designs.

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