EP20K160EQI240-3

IC FPGA 175 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 175 81920 6400 240-BFQFP

Quantity 1,416 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O175Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs640Number of Logic Elements/Cells6400
Number of Gates404000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits81920

Overview of EP20K160EQI240-3 – APEX-20KE FPGA, 240-BFQFP

The EP20K160EQI240-3 is an APEX-20KE family Field Programmable Gate Array (FPGA) offered in a 240-BFQFP surface-mount package. It combines a MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) to deliver reconfigurable logic, on-chip memory, and extensive I/O for industrial applications.

With 6,400 logic elements, approximately 0.082 Mbits of embedded RAM, 175 I/O pins and an industrial temperature range, this device addresses mid-density designs that require flexible I/O, memory interfaces and reliable operation between −40°C and 100°C.

Key Features

  • MultiCore architecture Integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for partitioning register‑intensive and memory functions.
  • Logic capacity 6,400 logic elements and approximately 404,000 system gates provide mid-range programmable logic resources suitable for moderate-complexity designs.
  • Embedded memory Approximately 81,920 bits (≈0.082 Mbits) of on-chip RAM implemented via ESBs for FIFOs, dual-port RAM and CAM-style functions.
  • I/O and interface support 175 user I/O pins with MultiVolt I/O interface support and series-level features for high-speed interfaces, including PCI (3.3 V), DDR SDRAM and LVDS capabilities noted in the APEX-20K family documentation.
  • Clock management Series-level clock features include flexible clock management with up to four PLLs, a built-in low-skew clock tree and up to eight global clock signals for synchronous system designs.
  • Power and voltage Internal supply operation around 1.8 V (specified supply range 1.71 V to 1.89 V) and family-level MultiVolt I/O support for interfacing across common logic levels.
  • Package and mounting 240-BFQFP (240‑PQFP, 32 × 32) surface-mount package for compact board-level integration.
  • Industrial grade reliability Specified operating temperature range of −40°C to 100°C and RoHS compliance for deployment in industrial environments.

Typical Applications

  • Industrial control and automation Use the FPGA for control logic, custom I/O handling and deterministic interfaces operating across industrial temperature ranges.
  • Embedded systems and SOPC integration Implement embedded system blocks and LUT logic to build compact system-on-programmable-chip functionality for mid-density designs.
  • Memory interface and buffering Leverage on-chip ESB memory for FIFO buffering and dual-port RAM in designs that interface with external DDR SDRAM or ZBT memories.
  • High-speed I/O and protocol bridging Deploy the device where MultiVolt I/O, LVDS channels and PCI-signature compatibility (3.3 V operation) are required for board-level protocol bridging.

Unique Advantages

  • System-level integration: MultiCore architecture with embedded system blocks reduces external memory and logic requirements by supporting FIFOs, dual-port RAM and CAM functions on-chip.
  • Balanced mid-range resources: 6,400 logic elements and ~404k gates provide a balance of capacity and efficiency for designs that need more than small CPLDs but less than high-end FPGAs.
  • Flexible clocking: Series-level PLLs and global clock resources simplify clock distribution and phase/ frequency management for synchronous subsystems.
  • Broad I/O interoperability: MultiVolt I/O and documented support for common high-speed interfaces ease integration with 1.8 V–5.0 V logic domains and external memory interfaces.
  • Industrial readiness: Specified −40°C to 100°C operation and surface-mount 240‑BFQFP packaging support robust deployment in industrial applications.

Why Choose EP20K160EQI240-3?

The EP20K160EQI240-3 positions itself as a mid-density, industrial-grade FPGA option within the APEX-20KE family, offering a practical mix of logic elements, embedded memory and flexible I/O in a compact 240-BFQFP package. It is suited to engineering teams building embedded systems, protocol bridges and memory-interfacing designs that require reliable operation across industrial temperatures.

Choosing this device provides a route to reduce external components through on-chip ESBs and to manage complex clocking and I/O needs without overspecifying capacity, making it a pragmatic option for cost- and board-space-conscious designs.

Request a quote or submit an inquiry to receive pricing and availability information for EP20K160EQI240-3.

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