EP20K200EQC208-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 136 106496 8320 208-BFQFP |
|---|---|
| Quantity | 331 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EQC208-3 – APEX-20KE FPGA, 8,320 logic elements, ~106,496-bit embedded memory, 208-BFQFP
The EP20K200EQC208-3 is an APEX-20KE family field programmable gate array (FPGA) from Intel. It combines a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory to deliver a programmable logic device suited for designs that require on-chip memory and flexible I/O.
This commercial-grade device targets applications that benefit from moderate logic density, embedded memory functions (FIFOs, dual-port RAM, CAM), and flexible clock and I/O management while using a compact 208-BFQFP surface-mount package.
Key Features
- Core Logic Capacity — Approximately 8,320 logic elements and a device gate count of 526,000 provide the logic density to implement moderate-complexity designs.
- Embedded Memory — Approximately 106,496 bits (≈0.10 Mbits) of on-chip RAM suitable for implementing FIFOs, dual-port RAM and CAM-style functions using the APEX ESB resources.
- MultiCore Architecture — Family-level MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for mixed combinatorial and memory-centric functions.
- Flexible I/O — 136 user I/O pins in a MultiVolt-capable architecture (family feature) to interface with a range of external voltage domains and common memory/host interfaces.
- Clock Management — Family-level clock features include multiple PLLs, a low-skew clock tree and support for multiple global clock signals to simplify timing distribution.
- Power and Voltage — Internal supply operation specified from 1.71 V to 1.89 V, enabling low-voltage core operation consistent with the APEX 20K family’s low-power design emphasis.
- Package and Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) surface-mount package; commercial operating temperature range 0 °C to 85 °C.
- Family-Level System Features — APEX 20K family capability includes SOPC integration, support for external memories such as DDR SDRAM and ZBT SRAM, and advanced I/O standards (as defined for the APEX 20K family).
Typical Applications
- Embedded System Integration — Implement SOPC-style integration and custom logic alongside on-chip memory for control and glue logic in embedded platforms.
- Memory Interface and Buffering — Use the device’s ESBs and embedded RAM to implement FIFOs and dual-port RAM for buffering and interface bridging with external memories.
- Bus and Peripheral Interfacing — Leverage the APEX 20K family I/O flexibility for interfacing to standard host and peripheral buses where programmable logic is required.
- Custom Logic and Glue — Implement application-specific combinatorial and register-intensive logic in a compact surface-mount package for space-constrained PCBs.
Unique Advantages
- Balanced logic and memory resources: 8,320 logic elements paired with ~106,496 bits of embedded memory provide a balanced platform for mixed logic-and-memory designs.
- Integrated memory-function support: ESBs in the APEX family enable on-chip FIFOs, dual-port RAM and CAM-style functions without external components.
- Flexible clock and timing: Family clock-management features (multiple PLLs and low-skew clock tree) simplify timing distribution for synchronous designs.
- Low-voltage core operation: Internal supply range of 1.71–1.89 V supports low-power core operation consistent with modern design constraints.
- Compact surface-mount package: 208-BFQFP (28×28 PQFP supplier package) enables PCB density and automated assembly for commercial products.
- Commercial temperature grading: Rated for 0 °C to 85 °C for typical commercial deployments.
Why Choose EP20K200EQC208-3?
The EP20K200EQC208-3 positions itself as a practical, commercially graded FPGA option within the APEX 20K family for designs that require a mix of programmable logic and embedded memory. Its MultiCore family architecture and ESB resources make it well suited for applications needing on-chip FIFO and dual-port memory functions while keeping board-level BOM and complexity down.
This part is appropriate for customers building embedded systems, memory-interface controllers, or custom logic peripherals who need a compact, surface-mount FPGA with defined commercial temperature and low-voltage core operation.
Request a quote or submit an RFQ to get pricing and availability information for the EP20K200EQC208-3.

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