EP20K200EQC208-3

IC FPGA 136 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 136 106496 8320 208-BFQFP

Quantity 331 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O136Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EQC208-3 – APEX-20KE FPGA, 8,320 logic elements, ~106,496-bit embedded memory, 208-BFQFP

The EP20K200EQC208-3 is an APEX-20KE family field programmable gate array (FPGA) from Intel. It combines a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory to deliver a programmable logic device suited for designs that require on-chip memory and flexible I/O.

This commercial-grade device targets applications that benefit from moderate logic density, embedded memory functions (FIFOs, dual-port RAM, CAM), and flexible clock and I/O management while using a compact 208-BFQFP surface-mount package.

Key Features

  • Core Logic Capacity — Approximately 8,320 logic elements and a device gate count of 526,000 provide the logic density to implement moderate-complexity designs.
  • Embedded Memory — Approximately 106,496 bits (≈0.10 Mbits) of on-chip RAM suitable for implementing FIFOs, dual-port RAM and CAM-style functions using the APEX ESB resources.
  • MultiCore Architecture — Family-level MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for mixed combinatorial and memory-centric functions.
  • Flexible I/O — 136 user I/O pins in a MultiVolt-capable architecture (family feature) to interface with a range of external voltage domains and common memory/host interfaces.
  • Clock Management — Family-level clock features include multiple PLLs, a low-skew clock tree and support for multiple global clock signals to simplify timing distribution.
  • Power and Voltage — Internal supply operation specified from 1.71 V to 1.89 V, enabling low-voltage core operation consistent with the APEX 20K family’s low-power design emphasis.
  • Package and Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) surface-mount package; commercial operating temperature range 0 °C to 85 °C.
  • Family-Level System Features — APEX 20K family capability includes SOPC integration, support for external memories such as DDR SDRAM and ZBT SRAM, and advanced I/O standards (as defined for the APEX 20K family).

Typical Applications

  • Embedded System Integration — Implement SOPC-style integration and custom logic alongside on-chip memory for control and glue logic in embedded platforms.
  • Memory Interface and Buffering — Use the device’s ESBs and embedded RAM to implement FIFOs and dual-port RAM for buffering and interface bridging with external memories.
  • Bus and Peripheral Interfacing — Leverage the APEX 20K family I/O flexibility for interfacing to standard host and peripheral buses where programmable logic is required.
  • Custom Logic and Glue — Implement application-specific combinatorial and register-intensive logic in a compact surface-mount package for space-constrained PCBs.

Unique Advantages

  • Balanced logic and memory resources: 8,320 logic elements paired with ~106,496 bits of embedded memory provide a balanced platform for mixed logic-and-memory designs.
  • Integrated memory-function support: ESBs in the APEX family enable on-chip FIFOs, dual-port RAM and CAM-style functions without external components.
  • Flexible clock and timing: Family clock-management features (multiple PLLs and low-skew clock tree) simplify timing distribution for synchronous designs.
  • Low-voltage core operation: Internal supply range of 1.71–1.89 V supports low-power core operation consistent with modern design constraints.
  • Compact surface-mount package: 208-BFQFP (28×28 PQFP supplier package) enables PCB density and automated assembly for commercial products.
  • Commercial temperature grading: Rated for 0 °C to 85 °C for typical commercial deployments.

Why Choose EP20K200EQC208-3?

The EP20K200EQC208-3 positions itself as a practical, commercially graded FPGA option within the APEX 20K family for designs that require a mix of programmable logic and embedded memory. Its MultiCore family architecture and ESB resources make it well suited for applications needing on-chip FIFO and dual-port memory functions while keeping board-level BOM and complexity down.

This part is appropriate for customers building embedded systems, memory-interface controllers, or custom logic peripherals who need a compact, surface-mount FPGA with defined commercial temperature and low-voltage core operation.

Request a quote or submit an RFQ to get pricing and availability information for the EP20K200EQC208-3.

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