EP20K200EQC240-2
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 168 106496 8320 240-BFQFP |
|---|---|
| Quantity | 85 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 168 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EQC240-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 240-BFQFP
The EP20K200EQC240-2 is an APEX-20KE family FPGA from Intel, delivered in a 240-BFQFP package for surface-mount assembly. It combines a MultiCore architecture of LUT logic, product-term logic and embedded memory to support system-on-a-programmable-chip designs.
This device targets applications that require moderate logic density, on-chip RAM, and flexible I/O while operating from a 1.71 V–1.89 V core supply and within a commercial temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 8,320 logic elements (LEs) and approximately 526,000 system gates for implementing combinatorial and sequential logic.
- Embedded Memory Approximately 106,496 bits of on-chip RAM suitable for FIFOs, dual-port RAM and other embedded memory functions.
- I/O Resources 168 user I/O pins provided in the 240-BFQFP package with MultiVolt I/O interface support noted for the APEX 20K family.
- MultiCore Architecture Family-level MultiCore integration of LUT logic, product-term logic and embedded system blocks (ESBs) for a mix of register-intensive and memory-intensive functions.
- Clock Management Family features include flexible clock management with up to four PLLs, a low-skew clock tree and support for multiple global clocks (family-level specification).
- I/O Standards Support (Family) APEX 20K family-level I/O capabilities include support for high-speed memory interfaces and advanced I/O standards and differential signaling options.
- Power and Supply Core supply range specified at 1.71 V to 1.89 V; device is designed for low-power operation per family characteristics.
- Package & Mounting 240-BFQFP (supplier device package: 240-PQFP, 32 × 32 mm) configured for surface-mount assembly.
- Commercial Grade & Environmental Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- Embedded System Integration Implement control logic, state machines and on-chip memory structures using the device’s combination of LUTs and embedded RAM.
- Memory Interface Control Support for high-speed external memories at the family level makes the device suitable for memory controller and buffer functions.
- Bus and Peripheral Bridging Use the FPGA’s I/O flexibility and family-level PCI compliance options to implement bridging, protocol conversion and peripheral interfaces.
- Data Path and FIFO Management Leverage embedded system blocks (ESBs) to implement FIFOs and dual-port RAM for streaming and buffering applications.
Unique Advantages
- Balanced Logic and Memory: 8,320 logic elements paired with approximately 106,496 bits of embedded RAM allow mixed logic-and-memory designs without external FPGA resources.
- System Integration via MultiCore Architecture: Family-level MultiCore integration consolidates LUT logic, product-term logic and ESBs to streamline implementation of register- and memory-intensive functions.
- Flexible Clocking: Family clock-management features—including multiple PLLs and a low-skew clock tree—help manage complex timing domains within a design.
- Compact Surface-Mount Package: The 240-BFQFP package (240-PQFP, 32 × 32) provides a compact, surface-mount footprint for space-constrained PCBs.
- Commercial-Grade Operating Range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial and embedded applications.
- RoHS Compliant: Conforms to RoHS environmental requirements for lead-free assembly processes.
Why Choose EP20K200EQC240-2?
The EP20K200EQC240-2 offers a practical balance of logic capacity, embedded memory and I/O in a compact 240-BFQFP surface-mount package. Its MultiCore APEX-20KE architecture and family-level clock and I/O capabilities make it well suited for designs that need integrated memory and flexible interfacing while operating on a 1.71 V–1.89 V core supply.
This device is appropriate for engineers and procurement teams developing commercial-grade embedded systems, memory interface logic, and peripheral bridging solutions who require verifiable device specifications and vendor-backed documentation from Intel.
Request a quote or submit a purchase inquiry for EP20K200EQC240-2 to receive pricing and availability details.

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