EP20K200EQI240-2N

IC FPGA 168 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 168 106496 8320 240-BFQFP

Quantity 855 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O168Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200EQI240-2N – APEX-20KE Field Programmable Gate Array (240‑BFQFP)

The EP20K200EQI240-2N is an Intel APEX-20KE family FPGA in a 240‑BFQFP package, designed for high-density programmable logic and embedded system integration. It implements the APEX MultiCore architecture with lookup-table (LUT) logic, product-term logic, and embedded system blocks (ESBs) to support memory and combinatorial functions.

This device targets applications that require substantial on-chip logic and embedded memory combined with flexible I/O and industrial-grade operating range. It delivers a balance of integration, memory capability, and configurable I/O for embedded systems, communications interfaces, and industrial control designs.

Key Features

  • Architecture and Integration — APEX MultiCore architecture with LUT logic, product-term logic, and embedded system block (ESB) support for SOPC-style integration and on-chip implementation of FIFO, dual-port RAM, and CAM functions.
  • Logic Capacity — 8,320 logic elements providing the equivalent of 526,000 system gates for medium to high-density logic implementations.
  • Embedded Memory — Total on-chip RAM of 106,496 bits, approximately 0.106 Mbits of embedded memory for data buffering and local storage.
  • I/O — 168 programmable I/O resources suitable for diverse interface requirements; family supports MultiVolt I/O interface levels.
  • Clock Management — Family-level flexible clock management features including phase-locked loops (PLLs), low-skew clock tree and multiple global clocks for synchronous designs.
  • Power and Voltage — Internal supply voltage in the 1.71 V to 1.89 V range (1.8 V-class device) with APEX family support for MultiVolt I/O interfaces.
  • Package and Mounting — 240‑BFQFP surface-mount package (supplier device package: 240‑PQFP, 32×32) for compact board-level integration.
  • Operating Range — Industrial-grade temperature range from −40 °C to 100 °C to meet demanding ambient environments.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Embedded systems — Implement SOPC-style controllers, state machines, and custom accelerators using on-chip LUTs and ESBs for compact system integration.
  • High‑speed memory interfaces — Use embedded memory and dedicated logic to interface with external memories such as SDRAM or SRAM and implement FIFOs or buffering.
  • Data communications — Implement protocol processing, parallel/serial bridging, and custom I/O translations leveraging flexible I/O and clock management features.
  • Industrial control — Drive control logic, sensor aggregation, and deterministic timing functions within the −40 °C to 100 °C industrial temperature window.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUT logic, product-term logic, and ESBs to reduce external component count and consolidate system functions on-chip.
  • Substantial logic and gate capacity: 8,320 logic elements and 526,000 system-gate equivalency enable complex, mid- to high-density designs without escalating PCB complexity.
  • On-chip embedded memory: Approximately 0.106 Mbits of RAM allows local buffering, FIFOs and dual-port RAM implementations to improve data throughput and latency.
  • Flexible I/O and clocking: Family-level MultiVolt I/O support and advanced clock management features simplify multi-voltage system interfacing and synchronous design partitioning.
  • Industrial temperature support: Rated for operation from −40 °C to 100 °C for reliable performance in challenging environments.
  • Compact surface-mount package: 240‑BFQFP packaging supports high-density PCB layouts while keeping assembly compatible with standard SMT processes.

Why Choose EP20K200EQI240-2N?

The EP20K200EQI240-2N positions itself as a versatile, industrial-grade FPGA option within the APEX-20KE family, delivering a combination of substantial logic elements, embedded memory, and flexible I/O in a compact 240‑BFQFP package. Its architecture supports integration of memory-heavy and register-intensive functions, making it suitable for embedded systems, interface bridging, and industrial control applications that require robust operation across a wide temperature range.

Designers seeking on-chip memory, configurable I/O and proven family-level features such as MultiCore architecture and advanced clock management will find this device suitable for mid- to high-density programmable logic tasks while maintaining RoHS compliance and industrial temperature resilience.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP20K200EQI240-2N.

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