EP20K200EQI240-2N
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 168 106496 8320 240-BFQFP |
|---|---|
| Quantity | 855 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 168 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200EQI240-2N – APEX-20KE Field Programmable Gate Array (240‑BFQFP)
The EP20K200EQI240-2N is an Intel APEX-20KE family FPGA in a 240‑BFQFP package, designed for high-density programmable logic and embedded system integration. It implements the APEX MultiCore architecture with lookup-table (LUT) logic, product-term logic, and embedded system blocks (ESBs) to support memory and combinatorial functions.
This device targets applications that require substantial on-chip logic and embedded memory combined with flexible I/O and industrial-grade operating range. It delivers a balance of integration, memory capability, and configurable I/O for embedded systems, communications interfaces, and industrial control designs.
Key Features
- Architecture and Integration — APEX MultiCore architecture with LUT logic, product-term logic, and embedded system block (ESB) support for SOPC-style integration and on-chip implementation of FIFO, dual-port RAM, and CAM functions.
- Logic Capacity — 8,320 logic elements providing the equivalent of 526,000 system gates for medium to high-density logic implementations.
- Embedded Memory — Total on-chip RAM of 106,496 bits, approximately 0.106 Mbits of embedded memory for data buffering and local storage.
- I/O — 168 programmable I/O resources suitable for diverse interface requirements; family supports MultiVolt I/O interface levels.
- Clock Management — Family-level flexible clock management features including phase-locked loops (PLLs), low-skew clock tree and multiple global clocks for synchronous designs.
- Power and Voltage — Internal supply voltage in the 1.71 V to 1.89 V range (1.8 V-class device) with APEX family support for MultiVolt I/O interfaces.
- Package and Mounting — 240‑BFQFP surface-mount package (supplier device package: 240‑PQFP, 32×32) for compact board-level integration.
- Operating Range — Industrial-grade temperature range from −40 °C to 100 °C to meet demanding ambient environments.
- Standards and Compliance — RoHS compliant.
Typical Applications
- Embedded systems — Implement SOPC-style controllers, state machines, and custom accelerators using on-chip LUTs and ESBs for compact system integration.
- High‑speed memory interfaces — Use embedded memory and dedicated logic to interface with external memories such as SDRAM or SRAM and implement FIFOs or buffering.
- Data communications — Implement protocol processing, parallel/serial bridging, and custom I/O translations leveraging flexible I/O and clock management features.
- Industrial control — Drive control logic, sensor aggregation, and deterministic timing functions within the −40 °C to 100 °C industrial temperature window.
Unique Advantages
- Highly integrated MultiCore architecture: Combines LUT logic, product-term logic, and ESBs to reduce external component count and consolidate system functions on-chip.
- Substantial logic and gate capacity: 8,320 logic elements and 526,000 system-gate equivalency enable complex, mid- to high-density designs without escalating PCB complexity.
- On-chip embedded memory: Approximately 0.106 Mbits of RAM allows local buffering, FIFOs and dual-port RAM implementations to improve data throughput and latency.
- Flexible I/O and clocking: Family-level MultiVolt I/O support and advanced clock management features simplify multi-voltage system interfacing and synchronous design partitioning.
- Industrial temperature support: Rated for operation from −40 °C to 100 °C for reliable performance in challenging environments.
- Compact surface-mount package: 240‑BFQFP packaging supports high-density PCB layouts while keeping assembly compatible with standard SMT processes.
Why Choose EP20K200EQI240-2N?
The EP20K200EQI240-2N positions itself as a versatile, industrial-grade FPGA option within the APEX-20KE family, delivering a combination of substantial logic elements, embedded memory, and flexible I/O in a compact 240‑BFQFP package. Its architecture supports integration of memory-heavy and register-intensive functions, making it suitable for embedded systems, interface bridging, and industrial control applications that require robust operation across a wide temperature range.
Designers seeking on-chip memory, configurable I/O and proven family-level features such as MultiCore architecture and advanced clock management will find this device suitable for mid- to high-density programmable logic tasks while maintaining RoHS compliance and industrial temperature resilience.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP20K200EQI240-2N.

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