EP20K200FC484-1XN

IC FPGA 382 I/O 484FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

Quantity 1,152 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O382Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200FC484-1XN – APEX-20K® FPGA, 8,320 logic elements, 106,496-bit RAM, 382 I/O, 484-BBGA

The EP20K200FC484-1XN is an APEX-20K family field programmable gate array (FPGA) from Intel, delivering 8,320 logic elements, 106,496 total RAM bits and 382 user I/O pins in a 484-BBGA package. It implements the APEX 20K MultiCore architecture, combining lookup-table logic, product-term logic and embedded system blocks to enable system-on-a-programmable-chip integration.

Designed for commercial-grade embedded applications, the device supports flexible I/O and clocking features while operating from a 2.375–2.625 V supply and a 0 °C to 85 °C operating range. RoHS compliant and surface-mount packaged, it suits compact, board-mounted FPGA designs requiring moderate gate density and on-chip memory.

Key Features

  • Core Capacity – 8,320 logic elements and up to 526,000 system gates provide combinatorial and register resources for custom logic and control functions.
  • Embedded Memory – 106,496 total RAM bits of on-chip memory (approximately 0.106 Mbits) for FIFOs, dual-port RAM and other storage implemented in embedded system blocks.
  • I/O Density & Flexibility – 382 user I/O pins to drive parallel interfaces and board-level connectivity; supports programmable clamp and per-pin tri-state control as part of the APEX 20K family feature set.
  • Package & Mounting – 484-BBGA (supplier package 484-FBGA, 23×23) in a surface-mount form factor to support compact board layouts.
  • Power – Voltage supply 2.375 V to 2.625 V aligned with the device’s internal supply requirements; family-level design emphasizes low-power operation and programmable power-saving modes.
  • Clocking & Timing – APEX 20K family clock-management features include multiple PLLs, low-skew clock tree and up to eight global clock signals for predictable timing and flexible clock domain control.
  • Memory & Bus Support – Family-level support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and compliance options for PCI Local Bus 2.2 at 3.3 V operation (family specification).
  • Operating Range & Compliance – Commercial-grade operating temperature from 0 °C to 85 °C and RoHS compliance for global assembly requirements.

Typical Applications

  • System Integration / SOPC – Implement embedded controllers, glue logic and integrated subsystems using the MultiCore architecture and on-chip memory blocks to reduce external components.
  • Memory Interface Controllers – Build DDR SDRAM or ZBT SRAM controllers and buffering logic using the device’s embedded RAM resources and family-level memory support.
  • PCI / Bus Bridging – Deploy in PCI-compliant designs (3.3 V, 33/66 MHz, 32/64-bit modes supported at the family level) for custom bus logic and protocol conversion.
  • High-speed I/O & Data Paths – Use the 382 I/O pins and family-supported differential/parallel I/O standards for high-throughput data capture, aggregation and routing.

Unique Advantages

  • Highly integrated MultiCore architecture – Combines LUT logic, product-term logic and embedded system blocks to implement both logic and memory functions on-chip, reducing external BOM and board area.
  • Substantial embedded RAM – 106,496 total RAM bits enable local buffering and FIFO implementation without sacrificing logic resources.
  • Flexible clock management – Family-level PLLs and a low-skew clock tree support multiple clock domains and predictable timing for synchronous designs.
  • Versatile I/O capability – High I/O count and family-level MultiVolt interface support simplify interface to a wide range of external devices and voltage domains.
  • Commercial operating range with RoHS compliance – Suitable for commercial embedded products requiring standard temperature range operation and environmental compliance for lead-free assembly.

Why Choose EP20K200FC484-1XN?

The EP20K200FC484-1XN positions itself as a mid-density APEX-20K FPGA option, offering a balance of logic capacity (8,320 logic elements), meaningful on-chip memory (106,496 bits) and a high I/O count (382 pins) in a compact 484-BBGA package. Its APEX family architecture enables integrated logic and memory implementations useful for system-on-chip-style designs where reducing external components is important.

This device is well suited to commercial embedded designs that require moderate gate counts, on-board memory resources, flexible clocking and varied I/O, providing a platform that scales with APEX 20K family design methodologies and tool support.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the EP20K200FC484-1XN. Our team can assist with ordering details and supply options.

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