EP20K200FC484-1X
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA |
|---|---|
| Quantity | 643 Available (as of May 26, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 382 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200FC484-1X – APEX-20K Field Programmable Gate Array, 8,320 logic elements
The EP20K200FC484-1X is an APEX-20K series Field Programmable Gate Array (FPGA) from Intel, offering a MultiCore architecture with Look-Up Table (LUT) logic and embedded system blocks (ESBs) for on-chip memory and product-term logic. Designed for commercial-grade embedded and interface applications, this device delivers a balance of logic capacity, embedded RAM, and flexible I/O in a 484-ball BGA package.
With 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 382 user I/O, the device targets designs requiring mid-range gate density, multi-voltage I/O support and integrated clock management features to simplify system integration.
Key Features
- Core Architecture MultiCore architecture integrating LUT logic and product-term logic for register- and combinatorial-intensive functions.
- Logic Capacity 8,320 logic elements providing a total gate count of 526,000 for mid-range programmable logic implementations.
- Embedded Memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM implemented via Embedded System Blocks (ESBs) for FIFOs, dual-port RAM and content-addressable memory (CAM) use.
- I/O and Interface Support 382 user I/O pins with MultiVolt I/O interface support and programmable I/O features suitable for direct connection to 1.8 V, 2.5 V, 3.3 V and 5.0 V levels and a range of signaling standards referenced by the APEX 20K family.
- Clock Management Built-in clock management including up to four PLLs, a low-skew clock tree and support for up to eight global clock signals, plus family-level features such as ClockLock, ClockBoost and ClockShift.
- Memory and External Interface Family-level support for high-speed external memories, including DDR SDRAM and ZBT SRAM, and compliance with PCI Local Bus Specification (3.3 V operation) as described for the APEX 20K family.
- Power and Voltage Specified internal voltage supply range of 2.375 V to 2.625 V; device-level low-power design features are part of the APEX 20K architecture.
- Package and Mounting 484-ball BGA package (supplier device package 484-FBGA, 23×23) for surface-mount applications.
- Commercial Grade & Environmental Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Communications and Networking Protocol bridging and packet processing where mid-range logic density and flexible I/O support are required for interfacing with diverse voltage domains and memory subsystems.
- Memory Interface and Buffering Implementing DDR SDRAM or ZBT SRAM controllers and FIFO buffers using embedded system blocks for efficient on-chip memory handling.
- High-speed I/O Aggregation Concentrating multiple signaling standards and differential interfaces into a single FPGA for aggregation, pre-processing or format conversion.
- Test & Measurement and Prototyping Custom logic, timing-critical glue logic, and mid-density prototyping where deterministic clocking and configurable I/O simplify board-level design.
Unique Advantages
- Balanced Logic and Memory Combines 8,320 logic elements with approximately 0.106 Mbits of embedded RAM to implement both control logic and on-chip data storage without excessive external memory.
- Integrated Clock Capabilities Multiple PLLs, a low-skew clock tree and global clock distribution reduce external clocking complexity and help manage timing across large or timing-sensitive designs.
- Flexible I/O Support MultiVolt I/O compatibility and a high pin count (382) enable direct interfacing to a wide range of external devices and voltage domains.
- Compact BGA Package 484-ball BGA (23×23) offers a compact surface-mount form factor suitable for space-constrained boards while providing ample I/O.
- Commercial-grade Reliability Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
Why Choose EP20K200FC484-1X?
The EP20K200FC484-1X sits within the APEX 20K family as a mid-density FPGA option that pairs a MultiCore logic architecture with embedded memory blocks and rich clock and I/O capabilities. Its combination of 8,320 logic elements, ~106 Kbits of embedded RAM and 382 user I/O makes it well suited to commercial embedded designs that require integrated memory buffering, protocol bridging and flexible voltage interfacing.
For designers seeking a commercially rated, RoHS-compliant FPGA in a compact 484-BBGA package, this device provides a usable balance of logic capacity, on-chip memory and programmable clock/I/O resources drawn from the APEX 20K architecture.
If you need pricing, availability or a quote for EP20K200FC484-1X, submit a request for a quote or contact sales to receive detailed pricing and lead-time information.

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