EP20K200FC484-2V
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA |
|---|---|
| Quantity | 762 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 382 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200FC484-2V – APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA
The EP20K200FC484-2V is an Intel APEX-20K family FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory for system-on-a-programmable-chip (SOPC) designs. This device targets applications that require a balance of logic density, embedded RAM and extensive I/O connectivity.
With 8,320 logic elements, approximately 0.106 Mbits of embedded memory, up to 526,000 system gates and 382 user I/Os in a 484-BBGA surface-mount package, the device is suited to commercial-grade embedded systems, high-speed I/O bridging and memory interface applications within the APEX 20K family feature set.
Key Features
- Core Architecture MultiCore architecture combining LUT logic and product-term logic for register-intensive and combinatorial functions; family-level SOPC integration is supported.
- Logic Density 8,320 logic elements and up to 526,000 system gates provide significant implementation capacity for mid-range FPGA designs.
- Embedded Memory Approximately 0.106 Mbits of on-chip RAM (106,496 total RAM bits) available for FIFOs, dual-port RAM and CAM implementations via embedded system blocks (ESBs).
- I/O and Interface Flexibility 382 user I/Os with MultiVolt I/O interface support to connect with 1.8 V, 2.5 V, 3.3 V and 5.0 V devices; I/O features in the family include support for LVDS and high-speed memory interfaces.
- Clock Management Family-level support for flexible clocking including multiple PLLs, a low-skew clock tree and programmable clock phase/delay features for deterministic timing.
- Package and Mounting Surface-mount 484-BBGA package (supplier package: 484-FBGA, 23×23) suitable for compact board layouts.
- Power and Supply Device supply range specified at 2.375 V to 2.625 V for the internal core; family features include low-power operation modes and programmable ESB power-saving options.
- Commercial Grade and Compliance Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Embedded systems and control Use the device’s 8,320 logic elements and embedded RAM to implement control logic, state machines and on-chip buffering for mid-range embedded platforms.
- Memory interface and buffering ESB-based RAM and product-term logic are well suited for implementing FIFOs, DDR/SDRAM interface glue and ZBT-style memory controllers.
- I/O bridging and protocol conversion With 382 I/Os and MultiVolt support, the FPGA can act as a protocol bridge between mixed-voltage subsystems and connect to LVDS or other high-speed links.
- Peripheral and bus interfacing Family-level support includes compliance with PCI 3.3 V operation, enabling implementation of peripheral logic and bus adapters in commercial systems.
Unique Advantages
- Highly integrated MultiCore architecture: Combines LUT, product-term logic and embedded memory to reduce external components and simplify system-level design.
- Substantial mid-range logic capacity: 8,320 logic elements and up to 526,000 gates enable complex logic and control implementations without oversizing the BOM.
- On-chip RAM for buffering and CAM: 106,496 RAM bits implemented in ESBs provide on-device storage for FIFOs, dual-port RAM and content-addressable memory functions.
- Flexible I/O connectivity: 382 user I/Os with MultiVolt interfacing allow direct connection to a wide range of voltage domains and high-speed peripherals.
- Compact, surface-mount package: 484-BBGA (484-FBGA, 23×23) enables high I/O count in a compact footprint for space-constrained boards.
- Commercial-grade and RoHS compliant: Rated 0 °C to 85 °C and RoHS-compliant to meet common commercial product requirements.
Why Choose EP20K200FC484-2V?
The EP20K200FC484-2V delivers a balanced combination of logic capacity, embedded memory and extensive I/O in Intel’s APEX-20K family architecture. Its MultiCore design and ESB capabilities make it suitable for designs that require on-chip FIFOs, memory buffering and mixed logic functions while maintaining a compact 484-BBGA footprint.
Targeted at commercial embedded systems and I/O-intensive applications, this device is appropriate for engineers who need a mid-range FPGA with flexible voltage interfacing, significant on-chip RAM and deterministic clock management features within a RoHS-compliant package.
Request a quote or submit an RFQ for EP20K200FC484-2V to receive pricing and availability information.

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