EP20K200FC484-2V

IC FPGA 382 I/O 484FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

Quantity 762 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O382Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200FC484-2V – APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

The EP20K200FC484-2V is an Intel APEX-20K family FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory for system-on-a-programmable-chip (SOPC) designs. This device targets applications that require a balance of logic density, embedded RAM and extensive I/O connectivity.

With 8,320 logic elements, approximately 0.106 Mbits of embedded memory, up to 526,000 system gates and 382 user I/Os in a 484-BBGA surface-mount package, the device is suited to commercial-grade embedded systems, high-speed I/O bridging and memory interface applications within the APEX 20K family feature set.

Key Features

  • Core Architecture  MultiCore architecture combining LUT logic and product-term logic for register-intensive and combinatorial functions; family-level SOPC integration is supported.
  • Logic Density  8,320 logic elements and up to 526,000 system gates provide significant implementation capacity for mid-range FPGA designs.
  • Embedded Memory  Approximately 0.106 Mbits of on-chip RAM (106,496 total RAM bits) available for FIFOs, dual-port RAM and CAM implementations via embedded system blocks (ESBs).
  • I/O and Interface Flexibility  382 user I/Os with MultiVolt I/O interface support to connect with 1.8 V, 2.5 V, 3.3 V and 5.0 V devices; I/O features in the family include support for LVDS and high-speed memory interfaces.
  • Clock Management  Family-level support for flexible clocking including multiple PLLs, a low-skew clock tree and programmable clock phase/delay features for deterministic timing.
  • Package and Mounting  Surface-mount 484-BBGA package (supplier package: 484-FBGA, 23×23) suitable for compact board layouts.
  • Power and Supply  Device supply range specified at 2.375 V to 2.625 V for the internal core; family features include low-power operation modes and programmable ESB power-saving options.
  • Commercial Grade and Compliance  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded systems and control  Use the device’s 8,320 logic elements and embedded RAM to implement control logic, state machines and on-chip buffering for mid-range embedded platforms.
  • Memory interface and buffering  ESB-based RAM and product-term logic are well suited for implementing FIFOs, DDR/SDRAM interface glue and ZBT-style memory controllers.
  • I/O bridging and protocol conversion  With 382 I/Os and MultiVolt support, the FPGA can act as a protocol bridge between mixed-voltage subsystems and connect to LVDS or other high-speed links.
  • Peripheral and bus interfacing  Family-level support includes compliance with PCI 3.3 V operation, enabling implementation of peripheral logic and bus adapters in commercial systems.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUT, product-term logic and embedded memory to reduce external components and simplify system-level design.
  • Substantial mid-range logic capacity: 8,320 logic elements and up to 526,000 gates enable complex logic and control implementations without oversizing the BOM.
  • On-chip RAM for buffering and CAM: 106,496 RAM bits implemented in ESBs provide on-device storage for FIFOs, dual-port RAM and content-addressable memory functions.
  • Flexible I/O connectivity: 382 user I/Os with MultiVolt interfacing allow direct connection to a wide range of voltage domains and high-speed peripherals.
  • Compact, surface-mount package: 484-BBGA (484-FBGA, 23×23) enables high I/O count in a compact footprint for space-constrained boards.
  • Commercial-grade and RoHS compliant: Rated 0 °C to 85 °C and RoHS-compliant to meet common commercial product requirements.

Why Choose EP20K200FC484-2V?

The EP20K200FC484-2V delivers a balanced combination of logic capacity, embedded memory and extensive I/O in Intel’s APEX-20K family architecture. Its MultiCore design and ESB capabilities make it suitable for designs that require on-chip FIFOs, memory buffering and mixed logic functions while maintaining a compact 484-BBGA footprint.

Targeted at commercial embedded systems and I/O-intensive applications, this device is appropriate for engineers who need a mid-range FPGA with flexible voltage interfacing, significant on-chip RAM and deterministic clock management features within a RoHS-compliant package.

Request a quote or submit an RFQ for EP20K200FC484-2V to receive pricing and availability information.

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