EP20K200FC484-3AA
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA |
|---|---|
| Quantity | 226 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 382 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200FC484-3AA – APEX-20K Field Programmable Gate Array (FPGA) IC, 484‑BBGA
The Intel EP20K200FC484-3AA is an APEX-20K family FPGA delivered in a 484-BBGA surface-mount package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory to provide a flexible platform for programmable logic designs.
With 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 382 I/O pins, this device targets designs that require dense logic, integrated memory, and robust I/O capability—including PCI-compatible systems and high-speed memory interfaces as described in the APEX 20K device family documentation.
Key Features
- MultiCore architecture Combines LUT logic, product-term logic and embedded system blocks (ESBs) for register‑intensive and memory-centric functions.
- Logic capacity 8,320 logic elements and up to 526,000 system gates provide substantial programmable logic resources for mid-range designs.
- Embedded memory Approximately 0.106 Mbits (106,496 bits) of on‑chip RAM for FIFOs, dual-port RAM and other memory functions.
- Embedded system blocks (ESBs) Device family documentation lists ESB resources for implementing memory and product‑term logic functions; the EP20K200 device includes ESB support.
- I/O and interfacing 382 user I/O pins with MultiVolt I/O interface support (per APEX 20K documentation) for flexible interconnection and direct support for high‑speed memory and bus interfaces.
- Clock management Family features include flexible clock management with up to four phase‑locked loops (PLLs), a low‑skew clock tree and multiple global clock signals for synchronous design control.
- Low‑power design APEX 20K architecture includes power‑saving modes for ESBs and design considerations for reduced power consumption.
- Power and temperature Operational voltage supply specified at 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
- Package and mounting 484‑BBGA (supplier package listed as 484‑FBGA, 23×23) in a surface‑mount form factor suitable for compact board designs.
- Regulatory status RoHS compliant.
Typical Applications
- PCI and bus interfaces Implement PCI‑compatible logic and bus bridging for host interfaces, leveraging the APEX 20K family’s documented PCI support.
- High‑speed memory controllers Build DDR SDRAM or other high‑speed memory controllers using on‑chip RAM and the device’s I/O support for external memory interfaces.
- Embedded system control Use as a programmable logic backbone for embedded controllers that require integrated logic, memory and flexible clocking.
- Data path and protocol processing Implement mid‑range protocol engines, FIFO buffering and custom data‑path logic using ESBs and the dedicated carry chains described for the APEX 20K family.
Unique Advantages
- Integrated memory and logic: Combines LUT-based logic and ESB RAM resources to simplify designs that require both compute and on‑chip buffering.
- Substantial I/O density: 382 I/O pins allow complex board-level interfaces without external I/O expanders.
- Configurable clocking: Multiple PLLs and global clock resources enable precise clock distribution and phase control for synchronous systems.
- Commercial temperature support: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial embedded applications.
- Compact, surface‑mount package: 484‑BBGA (23×23 FBGA supplier package) delivers a high‑density solution for space‑constrained PCBs.
- Standards-oriented I/O: Family-level support for common I/O standards and high‑speed memory interfaces simplifies system integration.
Why Choose EP20K200FC484-3AA?
The EP20K200FC484-3AA provides a balanced combination of logic capacity, embedded memory and high I/O density within the APEX‑20K architecture. It is well suited for designs that require mid‑range programmable logic resources with integrated memory blocks and flexible clocking capabilities.
Engineers and procurement teams seeking a commercially graded FPGA in a compact 484‑BBGA surface‑mount package will find this part delivers the architecture and interface support documented for the APEX 20K family, along with RoHS compliance and straightforward power and thermal specifications for commercial applications.
Request a quote or submit an inquiry for the EP20K200FC484-3AA to receive pricing and availability information tailored to your project needs.

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