EP20K200FC484-3N

The EP20K200FC484-3N is an APEX-20K family FPGA from Intel (Altera) that combines LUT-based logic, product-term logic and embedded memory in a MultiCore architecture. Designed for designs that require dense logic, substantial on-chip memory, and extensive I/O, this device targets system integration tasks such as high-speed memory interfaces, protocol bridging and custom logic acceleration.

With 8,320 logic elements, approximately 106,496 bits of embedded RAM and up to 382 user I/O pins in a 484-BBGA package, the device delivers a balance of integration and I/O capability in a commercial-grade part (0 °C to 85 °C) with a 2.375 V–2.625 V supply range.

Key Features

• Core architecture MultiCore architecture integrating look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for memory and combinatorial functions.
• Logic capacity 8,320 logic elements (LEs) and approximately 526,000 system gates of capacity for medium-density FPGA applications.
• Embedded memory Approximately 0.106 Mbits (106,496 bits) of on-chip RAM usable for FIFOs, dual-port RAM and CAM-style functions via ESBs.
• I/O and interface support Up to 382 user I/O pins with MultiVolt I/O interface capability and support for advanced interfaces such as LVDS and PCI-level signaling as described in the APEX 20K family documentation.
• Clock management Flexible clock resources including multiple PLLs, a low-skew clock tree and features for clock phase/delay adjustment to support complex timing requirements.
• Power and supply Designed for low-power operation with internal power-saving modes and an operating supply range of 2.375 V to 2.625 V.
• Package and mounting Surface-mount 484-BBGA package (supplier device package listed as 484-FBGA, 23×23) for board-level integration.
• Commercial operating range Specified for 0 °C to 85 °C operation (commercial grade).

Typical Applications

• Memory interface and buffering Implement DDR SDRAM, ZBT SRAM interface logic and FIFO buffering using the embedded memory blocks and high I/O count.
• Protocol bridging and system glue Use the combination of LUT logic, product-term functions and MultiVolt I/O to implement bus bridging, protocol translation and peripheral interfaces.
• High-speed I/O and serial links Leverage LVDS and high-performance I/O timing to support point-to-point high-speed signaling and data lanes.

Unique Advantages

• Integrated MultiCore architecture: Combines LUT logic, product-term logic and embedded system blocks to consolidate logic and memory functions on a single device.
• Balanced logic and memory resources: 8,320 logic elements paired with approximately 106,496 bits of embedded RAM enable implementation of moderate-complexity designs with on-chip storage.
• Extensive I/O capability: Up to 382 user I/O pins and MultiVolt I/O support provide flexibility to interface with a wide range of external devices and voltage domains.
• Robust clock features: Multiple PLLs, global clocks and programmable clock-shift features facilitate complex timing architectures and low-skew distribution.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and surface-mount 484-BBGA packaging for standard production environments.

Why Choose EP20K200FC484-3N?

The EP20K200FC484-3N delivers a practical combination of logic density, embedded memory and flexible I/O in the APEX-20K family architecture, making it well suited for designs that need integrated memory functions, sophisticated clock management and multi-voltage interfacing. Its feature set supports implementation of memory controllers, protocol bridges and high-speed interface logic while remaining within commercial temperature and supply margins.

This part is appropriate for teams building medium-density FPGA solutions that require a balance of on-chip RAM, logic elements and I/O capacity in a surface-mount 484-BBGA package.

If you would like pricing or availability information, request a quote or submit a pricing inquiry for the EP20K200FC484-3N.