EP20K200FI484-3

IC FPGA 382 I/O 484FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

Quantity 1,351 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O382Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200FI484-3 – APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

The EP20K200FI484-3 is an APEX 20K family FPGA manufactured by Intel, delivering a balance of logic density, embedded memory, and flexible I/O in a compact 484-BBGA package. It implements the APEX 20K MultiCore architecture with LUT logic, product-term logic, and embedded system blocks (ESBs) to support both register‑intensive and memory‑centric functions.

With 8,320 logic elements, approximately 0.106 Mbits of embedded RAM, up to 382 user I/Os and a rated operating range of -40°C to 100°C, this device targets industrial designs requiring moderate gate counts, substantial I/O and integrated memory resources.

Key Features

  • Core Architecture  MultiCore APEX 20K architecture combining LUT logic, product-term logic and embedded system blocks (ESBs) to support a mix of register‑intensive and memory functions.
  • Logic Density  8,320 logic elements and a maximum of 526,000 system gates provide capacity for mid‑range programmable logic designs.
  • Embedded Memory  Approximately 106,496 bits of on‑chip RAM enabling FIFOs, dual‑port RAM and CAM implementations within the device.
  • I/O Capability  Up to 382 user I/Os to support broad peripheral and external-memory interfacing requirements.
  • Clock and Timing  Flexible clock management inherited from the APEX 20K family, including support for multiple PLLs and multiple global clock signals for deterministic clock distribution.
  • Package  484‑BBGA package (supplier device package: 484‑FBGA, 23×23) for compact board integration and high pin count in a small footprint.
  • Voltage and Power  Specified supply range of 2.375 V to 2.625 V; APEX 20K devices are documented with low‑power design considerations.
  • Industrial Temperature Range  Rated for operation from -40°C to 100°C, suitable for a wide set of industrial environments.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Implement motor control logic, sensor aggregation, and deterministic I/O handling using the device’s logic elements and extensive I/O count at industrial temperature ratings.
  • Communications Equipment  Use for protocol bridging, interface conditioning and moderate‑density packet processing where embedded RAM and flexible clocking are beneficial.
  • Memory Interface and Buffering  Implement DDR/ZBT interface logic and FIFO buffers leveraging the device’s embedded RAM and fast I/O paths.
  • Custom Logic and Prototyping  Deploy as a replaceable hardware block for prototype systems or custom IP integration requiring up to 8,320 logic elements and hundreds of I/Os.

Unique Advantages

  • Balanced Logic and Memory: 8,320 logic elements combined with approximately 0.106 Mbits of embedded RAM let you implement mixed logic-and-memory functions without external components.
  • High I/O Count in a Compact Package: Up to 382 user I/Os in a 484‑BBGA (484‑FBGA 23×23) footprint reduces board area while maintaining connectivity for peripherals and memory interfaces.
  • Industrial Reliability: Rated operation from -40°C to 100°C supports deployment in demanding industrial environments.
  • Flexible Clock Management: Family-level clock features, including multiple PLLs and global clock signals, simplify timing architectures for synchronous systems.
  • Low‑Power Design Considerations: Device supply range and APEX 20K family low‑power characteristics help manage system power in embedded applications.
  • RoHS Compliant: Conforms to lead‑free and restricted substances requirements for modern electronics manufacturing.

Why Choose EP20K200FI484-3?

The EP20K200FI484-3 delivers a practical combination of logic capacity, embedded memory and extensive I/O in the APEX 20K family architecture, making it a strong option for industrial and communications designs that require mid‑range programmable logic with on‑chip RAM. Its industrial temperature rating and compact 484‑BBGA package enable reliable deployment in space‑constrained, harsh environments.

Designers and teams seeking a scalable, well‑documented FPGA option will find the EP20K200FI484-3 suitable for replacing discrete glue logic, implementing custom controllers, and integrating memory buffering and interface logic into a single device footprint.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time details for the EP20K200FI484-3.

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