EP20K200FC484-3V

IC FPGA 382 I/O 484FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

Quantity 1,633 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O382Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200FC484-3V – APEX-20K® Field Programmable Gate Array (FPGA), 8,320 logic elements

The EP20K200FC484-3V is an APEX-20K family FPGA from Intel (Altera) designed for mid-density programmable logic applications. It combines a MultiCore architecture of LUT logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive functions and a variety of memory structures such as FIFOs, dual-port RAM and CAM.

With 8,320 logic elements, approximately 106,496 bits of embedded memory and 382 I/O, this surface-mount 484-BBGA device targets commercial designs requiring on-chip memory, flexible I/O and integrated clock management within a 0 °C to 85 °C operating range and a nominal supply window of 2.375 V–2.625 V.

Key Features

  • Core architecture (MultiCore) Integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for mixed register- and memory-intensive functions.
  • Logic capacity 8,320 logic elements (LEs) and a maximum of 526,000 system gates for mid-range programmable logic integration.
  • Embedded memory Approximately 106,496 bits of on-chip RAM available for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations.
  • I/O and interface flexibility 382 user I/O pins with MultiVolt support and advanced I/O options documented in the APEX-20K family for high-speed and diverse signaling requirements.
  • Clock management Family-level support for flexible clocking including multiple PLLs, low-skew clock tree and global clock resources to support synchronous system designs.
  • Low-power design features Architecture and ESB options include provisions for reduced power operation and programmable power-saving modes.
  • Package and mounting 484-ball BGA (484-BBGA) surface-mount package, supplier device package listed as 484-FBGA (23 × 23).
  • Commercial grade and compliance Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • Memory interface controllers Use the device’s embedded memory and I/O capabilities to implement DDR SDRAM and other high-speed memory interfaces.
  • PCI and bus-based peripherals Leverage documented support for PCI-level signaling to build add-in or bridge logic for PCI-compliant systems.
  • Embedded system integration Implement SOPC-style system functions on-chip using LUTs and ESBs for functions such as FIFOs, dual-port RAM and CAM.
  • High-speed I/O and communications Utilize advanced I/O signaling options and abundant user I/O for lane aggregation, SERDES-adjacent logic or parallel high-speed interfaces.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUTs, product-term logic and embedded memory to reduce external component count and simplify system partitioning.
  • Balanced capacity: 8,320 logic elements with ~106 kbits of embedded RAM provides a mid-range density suited for complex control and memory-centric logic.
  • Flexible I/O resources: 382 user I/O pins and MultiVolt interface support enable interfacing across a range of signaling standards and voltage domains.
  • Robust clocking features: Built-in PLLs and low-skew clock distribution support synchronized multi-clock designs and timing-critical functions.
  • Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS-compliant for broad commercial deployments.
  • Space-efficient package: 484-BBGA surface-mount package optimizes board area while providing a high pin count for system integration.

Why Choose EP20K200FC484-3V?

The EP20K200FC484-3V offers a practical balance of logic density, embedded memory and I/O capacity for commercial embedded designs that require on-chip memory structures and flexible interfacing. Its MultiCore architecture and ESB-based memory options make it well suited to projects that combine register-heavy logic with substantial FIFO or RAM requirements.

Engineers and procurement teams looking for a mid-density FPGA in a compact 484-BBGA package will find this device appropriate for system-level integration where a 2.375 V–2.625 V supply and 0 °C to 85 °C operating range meet design constraints, while RoHS compliance supports modern manufacturing requirements.

Request a quote or submit a procurement inquiry to receive pricing, availability and technical support information for EP20K200FC484-3V.

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