EP20K200FC484-3V
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA |
|---|---|
| Quantity | 1,633 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 382 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200FC484-3V – APEX-20K® Field Programmable Gate Array (FPGA), 8,320 logic elements
The EP20K200FC484-3V is an APEX-20K family FPGA from Intel (Altera) designed for mid-density programmable logic applications. It combines a MultiCore architecture of LUT logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive functions and a variety of memory structures such as FIFOs, dual-port RAM and CAM.
With 8,320 logic elements, approximately 106,496 bits of embedded memory and 382 I/O, this surface-mount 484-BBGA device targets commercial designs requiring on-chip memory, flexible I/O and integrated clock management within a 0 °C to 85 °C operating range and a nominal supply window of 2.375 V–2.625 V.
Key Features
- Core architecture (MultiCore) Integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for mixed register- and memory-intensive functions.
- Logic capacity 8,320 logic elements (LEs) and a maximum of 526,000 system gates for mid-range programmable logic integration.
- Embedded memory Approximately 106,496 bits of on-chip RAM available for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations.
- I/O and interface flexibility 382 user I/O pins with MultiVolt support and advanced I/O options documented in the APEX-20K family for high-speed and diverse signaling requirements.
- Clock management Family-level support for flexible clocking including multiple PLLs, low-skew clock tree and global clock resources to support synchronous system designs.
- Low-power design features Architecture and ESB options include provisions for reduced power operation and programmable power-saving modes.
- Package and mounting 484-ball BGA (484-BBGA) surface-mount package, supplier device package listed as 484-FBGA (23 × 23).
- Commercial grade and compliance Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- Memory interface controllers Use the device’s embedded memory and I/O capabilities to implement DDR SDRAM and other high-speed memory interfaces.
- PCI and bus-based peripherals Leverage documented support for PCI-level signaling to build add-in or bridge logic for PCI-compliant systems.
- Embedded system integration Implement SOPC-style system functions on-chip using LUTs and ESBs for functions such as FIFOs, dual-port RAM and CAM.
- High-speed I/O and communications Utilize advanced I/O signaling options and abundant user I/O for lane aggregation, SERDES-adjacent logic or parallel high-speed interfaces.
Unique Advantages
- Highly integrated MultiCore architecture: Combines LUTs, product-term logic and embedded memory to reduce external component count and simplify system partitioning.
- Balanced capacity: 8,320 logic elements with ~106 kbits of embedded RAM provides a mid-range density suited for complex control and memory-centric logic.
- Flexible I/O resources: 382 user I/O pins and MultiVolt interface support enable interfacing across a range of signaling standards and voltage domains.
- Robust clocking features: Built-in PLLs and low-skew clock distribution support synchronized multi-clock designs and timing-critical functions.
- Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS-compliant for broad commercial deployments.
- Space-efficient package: 484-BBGA surface-mount package optimizes board area while providing a high pin count for system integration.
Why Choose EP20K200FC484-3V?
The EP20K200FC484-3V offers a practical balance of logic density, embedded memory and I/O capacity for commercial embedded designs that require on-chip memory structures and flexible interfacing. Its MultiCore architecture and ESB-based memory options make it well suited to projects that combine register-heavy logic with substantial FIFO or RAM requirements.
Engineers and procurement teams looking for a mid-density FPGA in a compact 484-BBGA package will find this device appropriate for system-level integration where a 2.375 V–2.625 V supply and 0 °C to 85 °C operating range meet design constraints, while RoHS compliance supports modern manufacturing requirements.
Request a quote or submit a procurement inquiry to receive pricing, availability and technical support information for EP20K200FC484-3V.

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