EP20K200RC208-1

The EP20K200RC208-1 is an APEX-20K field programmable gate array (FPGA) supplied in a 208-pin BFQFP package with exposed pad. It provides 8,320 logic elements and approximately 0.11 Mbits of on-chip RAM in a surface-mount footprint, delivering configurable digital logic and memory resources for embedded and custom logic designs. Its combination of I/O density, on-chip memory, and commercial-grade operating range supports a wide range of programmable logic tasks where board-level integration and predictable supply and temperature limits are required.

Key Features

• Core Logic 8,320 logic elements provide the primary programmable fabric for implementing custom digital functions.
• Logic Array Blocks 832 CLB-like blocks (as reported) for structured logic partitioning and resource planning.
• Embedded Memory Approximately 0.11 Mbits of total on-chip RAM (106,496 bits) for buffering, small data structures, and state storage.
• I/O Capacity 144 general-purpose I/O pins support interfacing to peripherals and external logic in high-density designs.
• Power Supply Operates from a core supply range of 1.71 V to 1.89 V, enabling predictable power provisioning and system-level power planning.
• Package & Mounting 208-BFQFP with exposed pad (supplier package 208-RQFP 28×28) in a surface-mount configuration to simplify PCB assembly and thermal path to the board.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for regulatory alignment.
• Logic Scale Estimated equivalent of 526,000 gates for quick reference when mapping legacy gate-count requirements to this FPGA’s capacity.

Typical Applications

• Configurable Digital Control Implement custom state machines, glue logic, and control functions that benefit from reprogrammability and embedded RAM.
• Prototyping and Development Use the APEX-20K FPGA for board-level prototyping of digital designs where a mid-range logic count and dense I/O are required.
• I/O-Intensive Interfaces Leverage 144 I/O pins for interfacing multiple sensors, peripherals, or parallel buses in compact designs.

Unique Advantages

• Balanced Logic and Memory: 8,320 logic elements paired with 106,496 bits of embedded RAM provide a balanced resource set for control and buffering tasks without external memory for small-to-moderate designs.
• High I/O Density: 144 I/O pins enable consolidation of multiple external interfaces onto a single device, reducing component count.
• Package Thermal Path: Exposed pad on the 208-BFQFP package improves thermal conduction to the PCB for better heat dissipation in dense layouts.
• Predictable Power Requirements: A narrowly defined core voltage range (1.71 V to 1.89 V) simplifies power-supply design and margin analysis.
• Commercial-Grade Availability: Rated for 0 °C to 85 °C operation and RoHS compliant, supporting standard commercial and industrial supply-chain requirements.

Why Choose EP20K200RC208-1?

The EP20K200RC208-1 positions itself as a configurable, mid-density FPGA option offering a practical mix of logic capacity, embedded memory, and abundant I/O in a compact surface-mount package. It is well suited for designers who need reprogrammable digital fabric with on-chip RAM while maintaining clear supply and temperature specifications.

Its combination of 8,320 logic elements, 144 I/O, and a 208-BFQFP exposed-pad package provides a straightforward migration path for board-level implementations that demand predictable power, thermal routing, and RoHS compliance.

Request a quote today or submit your purchase inquiry to receive pricing, availability, and technical support information for the EP20K200RC208-1.