EP20K200FC484-4
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA |
|---|---|
| Quantity | 408 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 382 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200FC484-4 – APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA
The EP20K200FC484-4 is an APEX-20K family FPGA from Intel designed for system-level programmable logic integration. It combines MultiCore architecture with LUT logic, product-term logic and embedded memory to support control, interfacing and moderate-density logic functions.
This device delivers 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 382 user I/Os in a 484-ball BGA package, making it suitable for applications requiring dense on-chip logic, flexible I/O and integrated memory blocks.
Key Features
- Core and Logic — 8,320 logic elements and up to 526,000 system gates provide the programmable logic resources for combinatorial and register-intensive functions.
- Embedded Memory — Total on-chip RAM of 106,496 bits (approximately 0.106 Mbits) supports FIFOs, dual-port RAM and CAM-style implementations using embedded system blocks (ESBs).
- I/O and Interface Flexibility — 382 user I/Os with MultiVolt I/O interface support for interoperability with 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling; series documentation also describes support for LVDS and PCI 3.3-V operation (PCI Local Bus Spec Rev. 2.2).
- Clock and Timing — Flexible clock management with up to four PLLs, a built-in low-skew clock tree and features for clock phase/delay control (ClockLock, ClockBoost, ClockShift) to simplify timing distribution.
- Advanced Interconnect — Four-level FastTrack interconnect structure and a dedicated carry chain for predictable routing delays and efficient arithmetic implementations.
- Packaging & Mounting — 484-ball BGA package (supplier device package: 484-FBGA, 23 × 23) designed for surface-mount assembly.
- Power & Environmental — Specified voltage supply range of 2.375 V to 2.625 V, commercial grade operating temperature 0 °C to 85 °C, and RoHS compliant.
Typical Applications
- High‑speed memory interfaces — Implement DDR SDRAM and ZBT SRAM controllers or memory bridging using the device’s embedded memory and flexible I/O support.
- PCI-based subsystems — Use in 3.3-V PCI Local Bus implementations for bus bridging, peripheral logic or protocol adaptation.
- Embedded system integration — Integrate FIFOs, dual-port RAM and CAM functions in system-on-programmable-chip (SOPC) designs leveraging ESBs and LUT logic.
- High-throughput I/O aggregation — Aggregate and condition parallel and differential I/O streams (including LVDS-capable channels) for communications or data-acquisition front ends.
Unique Advantages
- Highly integrated logic and memory: 8,320 logic elements combined with approximately 0.106 Mbits of embedded RAM reduce external component count for mid-density designs.
- Broad I/O flexibility: 382 user I/Os and MultiVolt support enable direct interfacing to a wide range of system voltages and peripherals.
- Robust clock management: Up to four PLLs and multiple clock-control features simplify multi-domain clocking and timing closure.
- Predictable routing and arithmetic: FastTrack interconnect and a dedicated carry chain speed design implementation for arithmetic-heavy logic.
- Compact surface-mount package: 484-ball BGA (23 × 23) provides a dense mounting footprint for space-constrained PCBs.
- Commercial-grade and compliant: Specified for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.
Why Choose EP20K200FC484-4?
The EP20K200FC484-4 positions itself as a mid-to-high density FPGA option within the APEX-20K family, delivering a balanced combination of logic capacity, embedded memory and a large I/O count in a compact BGA package. Its MultiCore architecture and ESB capabilities make it well suited for applications that require integrated memory functions alongside programmable logic.
This device is a strong match for designers who need a commercially graded, RoHS-compliant FPGA with flexible I/O, on-chip memory resources and advanced clocking features for system-level integration and interface control.
Request a quote or submit a procurement inquiry to receive pricing and availability for EP20K200FC484-4.

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