EP20K200FC484-4

IC FPGA 382 I/O 484FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

Quantity 408 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O382Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200FC484-4 – APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

The EP20K200FC484-4 is an APEX-20K family FPGA from Intel designed for system-level programmable logic integration. It combines MultiCore architecture with LUT logic, product-term logic and embedded memory to support control, interfacing and moderate-density logic functions.

This device delivers 8,320 logic elements, approximately 0.106 Mbits of embedded memory and 382 user I/Os in a 484-ball BGA package, making it suitable for applications requiring dense on-chip logic, flexible I/O and integrated memory blocks.

Key Features

  • Core and Logic — 8,320 logic elements and up to 526,000 system gates provide the programmable logic resources for combinatorial and register-intensive functions.
  • Embedded Memory — Total on-chip RAM of 106,496 bits (approximately 0.106 Mbits) supports FIFOs, dual-port RAM and CAM-style implementations using embedded system blocks (ESBs).
  • I/O and Interface Flexibility — 382 user I/Os with MultiVolt I/O interface support for interoperability with 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling; series documentation also describes support for LVDS and PCI 3.3-V operation (PCI Local Bus Spec Rev. 2.2).
  • Clock and Timing — Flexible clock management with up to four PLLs, a built-in low-skew clock tree and features for clock phase/delay control (ClockLock, ClockBoost, ClockShift) to simplify timing distribution.
  • Advanced Interconnect — Four-level FastTrack interconnect structure and a dedicated carry chain for predictable routing delays and efficient arithmetic implementations.
  • Packaging & Mounting — 484-ball BGA package (supplier device package: 484-FBGA, 23 × 23) designed for surface-mount assembly.
  • Power & Environmental — Specified voltage supply range of 2.375 V to 2.625 V, commercial grade operating temperature 0 °C to 85 °C, and RoHS compliant.

Typical Applications

  • High‑speed memory interfaces — Implement DDR SDRAM and ZBT SRAM controllers or memory bridging using the device’s embedded memory and flexible I/O support.
  • PCI-based subsystems — Use in 3.3-V PCI Local Bus implementations for bus bridging, peripheral logic or protocol adaptation.
  • Embedded system integration — Integrate FIFOs, dual-port RAM and CAM functions in system-on-programmable-chip (SOPC) designs leveraging ESBs and LUT logic.
  • High-throughput I/O aggregation — Aggregate and condition parallel and differential I/O streams (including LVDS-capable channels) for communications or data-acquisition front ends.

Unique Advantages

  • Highly integrated logic and memory: 8,320 logic elements combined with approximately 0.106 Mbits of embedded RAM reduce external component count for mid-density designs.
  • Broad I/O flexibility: 382 user I/Os and MultiVolt support enable direct interfacing to a wide range of system voltages and peripherals.
  • Robust clock management: Up to four PLLs and multiple clock-control features simplify multi-domain clocking and timing closure.
  • Predictable routing and arithmetic: FastTrack interconnect and a dedicated carry chain speed design implementation for arithmetic-heavy logic.
  • Compact surface-mount package: 484-ball BGA (23 × 23) provides a dense mounting footprint for space-constrained PCBs.
  • Commercial-grade and compliant: Specified for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.

Why Choose EP20K200FC484-4?

The EP20K200FC484-4 positions itself as a mid-to-high density FPGA option within the APEX-20K family, delivering a balanced combination of logic capacity, embedded memory and a large I/O count in a compact BGA package. Its MultiCore architecture and ESB capabilities make it well suited for applications that require integrated memory functions alongside programmable logic.

This device is a strong match for designers who need a commercially graded, RoHS-compliant FPGA with flexible I/O, on-chip memory resources and advanced clocking features for system-level integration and interface control.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP20K200FC484-4.

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