EP20K200FI484-2V

The EP20K200FI484-2V is an APEX-20K series field programmable gate array (FPGA) offered in a 484-BBGA package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory blocks for on-chip system integration.

With 8,320 logic elements, approximately 0.11 Mbits of embedded RAM, 382 user I/O pins and a broad operating range, this industrial-grade FPGA is targeted at embedded and industrial designs that require flexible I/O, on-chip memory and configurable logic in a compact surface-mount package.

Key Features

• MultiCore Architecture  Integrates LUT logic, product-term logic and embedded system blocks (ESBs) to support both register-intensive and memory-intensive functions.
• Logic Capacity  8,320 logic elements and approximately 526,000 gates provide programmable logic resources for mid-density implementations.
• Embedded Memory  Approximately 106,496 bits (≈0.11 Mbits) of on-chip RAM for FIFOs, dual-port RAM and other memory functions.
• I/O and Interface Support  382 user I/O pins with MultiVolt I/O interface support and programmable clamp/slew-rate control for interfacing with a range of external devices and standards.
• Clocking and Timing  Flexible clock management including support for multiple PLLs, low-skew clock tree and up to eight global clock signals for synchronous system designs.
• Package and Mounting  484-BBGA surface-mount package (supplier device package: 484-FBGA, 23×23) for compact board-level integration.
• Power and Voltage  Device supply range of 2.375 V to 2.625 V with architecture- level low-power design options and programmable ESB power-saving modes.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial environments.
• Standards and High-Speed I/O  Series-level features include support for high-speed memory interfaces and differential signaling capabilities appropriate for demanding I/O applications.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement motor control logic, deterministic I/O handling and custom control algorithms using on-chip logic and embedded memory.
• Memory Interfacing  Act as a bridge or controller between system logic and external high-speed memories using the device’s dedicated I/O capabilities and embedded RAM.
• Communications and Interface Bridging  Support protocol conversion, data buffering and custom I/O standards leveraging multi-voltage I/O and differential signaling support.
• Embedded Systems  Provide configurable processing and glue logic for embedded platforms that need moderate logic density and on-chip RAM in a compact package.

Unique Advantages

• Integrated Logic and Memory: The combination of 8,320 logic elements with embedded system blocks enables consolidation of logic and memory functions on-chip.
• Flexible I/O Options: 382 user I/O pins and MultiVolt interface support facilitate direct interfacing to a wide range of external devices and voltage domains.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
• Compact Board-Level Package: 484-BBGA (23×23) surface-mount package provides a high-pin-count solution in a space-efficient form factor.
• Configurable Clocking: Built-in clock management features and multiple PLLs support complex timing requirements and multi-clock systems.
• Low-Power Design Features: Architecture-level low-power and ESB programmable power-saving modes help manage system power within the specified supply range.

Why Choose EP20K200FI484-2V?

The EP20K200FI484-2V positions itself as a mid-density, industrial-grade FPGA offering a balanced mix of logic, embedded memory and flexible I/O in a compact 484-BBGA package. Its MultiCore architecture and on-chip memory blocks enable integration of both register- and memory-intensive functions, while configurable clocking and I/O options support a variety of embedded and industrial system requirements.

This FPGA is suited to engineers and designers building industrial control systems, embedded platforms, or interface and memory-oriented applications who need verifiable logic capacity, on-chip RAM and an extended operating temperature range with RoHS compliance.

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