EP20K200RC240-1X

IC FPGA 174 I/O 240RQFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 174 106496 8320 240-BFQFP Exposed Pad

Quantity 431 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O174Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200RC240-1X – APEX-20K FPGA, 240-BFQFP Exposed Pad

The EP20K200RC240-1X is an Intel APEX-20K® field programmable gate array supplied in a 240-BFQFP exposed pad package. Based on the APEX 20K MultiCore architecture, the device combines look-up table (LUT) logic and embedded system blocks (ESBs) to implement register‑intensive and memory‑centric functions.

With 8,320 logic elements, approximately 0.106 Mbits of embedded memory, and 174 user I/O pins, this commercial‑grade FPGA addresses configurable logic, embedded memory and flexible I/O requirements for a range of commercial applications while operating from a 2.375 V–2.625 V core supply and 0 °C to 85 °C ambient range.

Key Features

  • APEX 20K MultiCore architecture  Integrates LUT logic and embedded system blocks (ESBs) for a balance of register‑intensive and memory‑centric logic implementations.
  • Logic capacity  8,320 logic elements and a device gate count of 526,000 provide substantial configurable logic resources for medium‑complexity designs.
  • Embedded memory  Approximately 0.106 Mbits of on‑chip RAM (106,496 bits) available for FIFOs, dual‑port RAMs and CAM‑style functions via ESBs.
  • I/O and interface support  174 user I/O pins with MultiVolt I/O interface support documented in the APEX 20K family for interfacing with multiple signaling levels and high‑speed external memories.
  • Clock management  Family features include multiple PLLs, a built‑in low‑skew clock tree and multi‑global clock signals for deterministic clock distribution and phase control.
  • Power and supply  Designed for low‑power operation with a specified core supply range of 2.375 V to 2.625 V and ESB programmable power‑saving options described in the APEX 20K data.
  • Package and mounting  240‑lead BFQFP with exposed pad (supplier package 240‑RQFP, 32×32) for surface‑mount PCB assembly and thermal performance.
  • Commercial temperature grade  Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • SOPC and system integration  Implement system‑on‑a‑programmable‑chip designs that combine logic, on‑chip memory and peripheral interfaces using the APEX 20K MultiCore approach.
  • Memory controller and buffering  Use embedded memory and ESBs to build FIFOs, dual‑port RAMs and interface logic for DDR SDRAM or ZBT SRAM systems supported by the APEX family.
  • High‑speed peripheral interfaces  Leverage MultiVolt I/O and documented APEX 20K I/O features for PCI‑class and other high‑speed bus interfaces at appropriate I/O voltage levels.
  • Custom logic and glue logic  Deploy the device for glue logic, protocol bridging and custom datapath implementations in commercial products requiring configurable logic density and moderate I/O counts.

Unique Advantages

  • Balanced LUT and ESB integration: Combines look‑up table logic with embedded system blocks to address both register‑heavy and memory‑intensive functions without separate external components.
  • Substantial configurable capacity: 8,320 logic elements and a 526,000‑gate device density enable complex logic implementations within a single FPGA package.
  • On‑chip memory for buffering: Approximately 0.106 Mbits of embedded memory supports FIFOs and local data storage, reducing external memory dependence for many designs.
  • Flexible clocking: Multiple PLLs and a low‑skew clock tree provide design flexibility for multi‑domain clocking and phase control.
  • Compact package with thermal pad: The 240‑lead BFQFP exposed pad simplifies PCB routing while supporting thermal management for surface‑mount assemblies.
  • RoHS compliant and commercial grade: Meets RoHS requirements and is specified for 0 °C to 85 °C commercial operation.

Why Choose EP20K200RC240-1X?

The EP20K200RC240-1X delivers a practical combination of configurable logic, embedded memory and flexible I/O in a 240‑lead BFQFP exposed pad package. Its APEX 20K MultiCore architecture and sizable logic element count make it suitable for commercial designs that need integrated memory functions, deterministic clocking and adaptable interfacing without excessive BOM complexity.

This device fits design teams and OEMs seeking a commercially graded FPGA that balances logic capacity and on‑chip memory while offering the connectivity and clock management features documented for the APEX 20K family. Its RoHS compliance and defined supply/temperature ranges support predictable integration into commercial product lines.

Request a quote or submit a pricing and availability inquiry to evaluate the EP20K200RC240-1X for your next design.

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