EP20K200RC240-2

IC FPGA 174 I/O 240RQFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 174 106496 8320 240-BFQFP Exposed Pad

Quantity 366 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O174Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200RC240-2 – APEX-20K Field Programmable Gate Array (FPGA) IC

The EP20K200RC240-2 is a surface-mount APEX-20K FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory for system- level integration. It targets designs that require a balance of logic density, embedded RAM and flexible I/O for register-intensive and memory-centric functions.

Built with 8,320 logic elements and approximately 0.106 Mbits of embedded memory, this commercial-grade device delivers substantial gate capacity and on-chip resources in a 240-BFQFP exposed-pad package for compact board-level implementations.

Key Features

  • Core Architecture  MultiCore architecture combining LUT logic and product-term logic to support register-intensive and combinatorial functions as described in the APEX-20K family documentation.
  • Logic Capacity  8,320 logic elements (LEs) and up to 526,000 system gates provide capacity for mid-density programmable designs.
  • Embedded Memory  Approximately 106,496 bits of on-chip RAM usable for FIFOs, dual-port RAM and other memory functions.
  • I/O and Interface Flexibility  174 user I/Os with MultiVolt interface support in the APEX-20K family and programmable I/O features to simplify interfacing with external devices.
  • Clock and Timing  Family-level clock management features include up to four PLLs, a built-in low-skew clock tree and multiple global clock signals for deterministic timing control.
  • Power and Supply  Documented device-level voltage supply range of 2.375 V to 2.625 V; APEX-20K family documentation also references internal supply conventions. The device supports power-saving ESB modes as part of the family feature set.
  • Package and Mounting  240-BFQFP exposed-pad package (supplier device package 240-RQFP 32×32); surface-mount mounting type facilitates compact PCB layouts and thermal conduction via the exposed pad.
  • Operating Range & Compliance  Commercial operating temperature range 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

  • System Integration and SOPC  Use the embedded memory and MultiCore architecture to implement system-on-a-programmable-chip (SOPC) functions, including on-chip FIFOs and memory blocks for tightly integrated subsystems.
  • Memory Interface Logic  Implement DDR/SDRAM interface logic and buffering using on-chip RAM and dedicated memory resources described in the APEX-20K family documentation.
  • High-Speed I/O Subsystems  Leverage flexible I/O and family-level support for differential and high-speed signaling to build PCI/PCI-like interfaces and high-bandwidth data paths.
  • Control and Processing  Deploy as the programmable control element for mid-density embedded applications that require configurable logic, local memory, and deterministic clocking.

Unique Advantages

  • Highly Integrated MultiCore Architecture: Combines LUTs, product-term logic and embedded memory to reduce external components for many control and buffering functions.
  • Substantial Logic and Gate Count: 8,320 logic elements and up to 526,000 system gates enable mid-density designs without immediate escalation to larger families.
  • On-Chip Memory for Data Path Efficiency: Approximately 106,496 bits of embedded RAM support FIFOs, dual-port RAM and other memory-critical functions, simplifying board-level memory design.
  • Flexible Clocking: Family-level support for multiple PLLs and a low-skew clock tree provides deterministic timing and flexible clock management for complex designs.
  • Compact, Thermally-Conscious Package: 240-BFQFP with exposed pad supports surface-mount assembly and offers a thermal conduction path for PCB-level thermal management.
  • RoHS Compliant: Environmentally compliant construction aligns with common regulatory requirements for commercial electronics.

Why Choose EP20K200RC240-2?

The EP20K200RC240-2 combines a proven APEX-20K family architecture with mid-level logic density, embedded memory and flexible I/O in a compact 240-BFQFP exposed-pad package. It is well-suited for designers who need integrated memory resources, deterministic clocking and a programmable fabric for system-level integration in commercial-temperature applications.

This device is a practical choice for teams building memory-centric controllers, high-speed I/O interfaces and consolidated programmable logic subsystems where board space, on-chip RAM and predictable timing are important. Its RoHS compliance and surface-mount package make it straightforward to incorporate into volume production processes.

Request a quote or submit an inquiry to get pricing and availability for the EP20K200RC240-2 and to discuss how it fits your next programmable-logic design.

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