EP20K200RC240-2
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 174 106496 8320 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 366 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 174 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200RC240-2 – APEX-20K Field Programmable Gate Array (FPGA) IC
The EP20K200RC240-2 is a surface-mount APEX-20K FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory for system- level integration. It targets designs that require a balance of logic density, embedded RAM and flexible I/O for register-intensive and memory-centric functions.
Built with 8,320 logic elements and approximately 0.106 Mbits of embedded memory, this commercial-grade device delivers substantial gate capacity and on-chip resources in a 240-BFQFP exposed-pad package for compact board-level implementations.
Key Features
- Core Architecture MultiCore architecture combining LUT logic and product-term logic to support register-intensive and combinatorial functions as described in the APEX-20K family documentation.
- Logic Capacity 8,320 logic elements (LEs) and up to 526,000 system gates provide capacity for mid-density programmable designs.
- Embedded Memory Approximately 106,496 bits of on-chip RAM usable for FIFOs, dual-port RAM and other memory functions.
- I/O and Interface Flexibility 174 user I/Os with MultiVolt interface support in the APEX-20K family and programmable I/O features to simplify interfacing with external devices.
- Clock and Timing Family-level clock management features include up to four PLLs, a built-in low-skew clock tree and multiple global clock signals for deterministic timing control.
- Power and Supply Documented device-level voltage supply range of 2.375 V to 2.625 V; APEX-20K family documentation also references internal supply conventions. The device supports power-saving ESB modes as part of the family feature set.
- Package and Mounting 240-BFQFP exposed-pad package (supplier device package 240-RQFP 32×32); surface-mount mounting type facilitates compact PCB layouts and thermal conduction via the exposed pad.
- Operating Range & Compliance Commercial operating temperature range 0 °C to 85 °C and RoHS-compliant construction.
Typical Applications
- System Integration and SOPC Use the embedded memory and MultiCore architecture to implement system-on-a-programmable-chip (SOPC) functions, including on-chip FIFOs and memory blocks for tightly integrated subsystems.
- Memory Interface Logic Implement DDR/SDRAM interface logic and buffering using on-chip RAM and dedicated memory resources described in the APEX-20K family documentation.
- High-Speed I/O Subsystems Leverage flexible I/O and family-level support for differential and high-speed signaling to build PCI/PCI-like interfaces and high-bandwidth data paths.
- Control and Processing Deploy as the programmable control element for mid-density embedded applications that require configurable logic, local memory, and deterministic clocking.
Unique Advantages
- Highly Integrated MultiCore Architecture: Combines LUTs, product-term logic and embedded memory to reduce external components for many control and buffering functions.
- Substantial Logic and Gate Count: 8,320 logic elements and up to 526,000 system gates enable mid-density designs without immediate escalation to larger families.
- On-Chip Memory for Data Path Efficiency: Approximately 106,496 bits of embedded RAM support FIFOs, dual-port RAM and other memory-critical functions, simplifying board-level memory design.
- Flexible Clocking: Family-level support for multiple PLLs and a low-skew clock tree provides deterministic timing and flexible clock management for complex designs.
- Compact, Thermally-Conscious Package: 240-BFQFP with exposed pad supports surface-mount assembly and offers a thermal conduction path for PCB-level thermal management.
- RoHS Compliant: Environmentally compliant construction aligns with common regulatory requirements for commercial electronics.
Why Choose EP20K200RC240-2?
The EP20K200RC240-2 combines a proven APEX-20K family architecture with mid-level logic density, embedded memory and flexible I/O in a compact 240-BFQFP exposed-pad package. It is well-suited for designers who need integrated memory resources, deterministic clocking and a programmable fabric for system-level integration in commercial-temperature applications.
This device is a practical choice for teams building memory-centric controllers, high-speed I/O interfaces and consolidated programmable logic subsystems where board space, on-chip RAM and predictable timing are important. Its RoHS compliance and surface-mount package make it straightforward to incorporate into volume production processes.
Request a quote or submit an inquiry to get pricing and availability for the EP20K200RC240-2 and to discuss how it fits your next programmable-logic design.

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