EP20K200RC240-3
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 174 106496 8320 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,300 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 174 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200RC240-3 – APEX-20K FPGA, 8,320 Logic Elements, 240-BFQFP
The EP20K200RC240-3 is an APEX-20K field programmable gate array (FPGA) IC designed for system-on-programmable-chip integration. It leverages the APEX MultiCore architecture combining LUT logic, product-term logic and embedded system blocks (ESBs) to implement register-heavy functions, memory primitives and combinatorial logic.
With high logic density, embedded memory and flexible I/O and clock management, this commercial-grade FPGA targets embedded systems, high-speed interface logic, memory buffering and other designs that benefit from integrated programmable logic and on-chip resources.
Key Features
- MultiCore architecture Integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to support a mix of register-intensive and combinatorial functions.
- Logic density 8,320 logic elements delivering up to 526,000 system gates for complex logic integration.
- Embedded memory Approximately 0.106 Mbits of on-chip RAM (106,496 bits) implemented in ESBs to support FIFOs, dual-port RAM and CAM-style functions; the family-level device includes 52 ESBs.
- I/O and voltage support 174 user I/O pins with MultiVolt I/O interface support for interfacing to multiple voltage domains, enabling flexible system-level connectivity.
- Flexible clock management Advanced clock features from the APEX family including multiple PLLs, a low-skew clock tree and up to eight global clocks for deterministic timing and clock domain management.
- High-speed interface support Family-level features include support for high-speed memories and signaling standards (e.g., DDR SDRAM, LVDS) to enable memory interfaces and high-throughput links.
- Package and mounting 240-BFQFP exposed pad package (240-RQFP, 32×32) designed for surface-mount assembly with an exposed pad for thermal performance.
- Power and operating range Specified voltage supply range 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 85 °C.
- Low-power design APEX 20K family devices are described for low-power operation with power-saving options available in embedded resources.
Typical Applications
- Embedded system integration Implement custom control, protocol offload or glue logic using on-chip LUTs and abundant logic elements to reduce external components.
- Memory interface and buffering Use ESBs to implement FIFOs, dual-port RAM and buffering for DDR/parallel memory interfaces and on-board data staging.
- High-speed I/O bridging Support for LVDS and high-speed signaling enables protocol bridging, SERDES front-ends and interface conversions where throughput and signal integrity matter.
- Clocked data processing Multiple PLLs and a low-skew clock tree make the device suitable for multi-clock-domain designs, data acquisition and deterministic timing tasks.
Unique Advantages
- Highly integrated architecture: Combines LUTs, product-term logic and ESBs to consolidate logic and memory functions on a single device, reducing BOM and board area.
- Substantial on-chip memory: Approximately 0.106 Mbits of embedded RAM supports FIFOs and dual-port memories, minimizing external RAM requirements for many designs.
- Robust clock control: Multiple PLLs and global clock resources simplify clock distribution and phase/ frequency management across complex designs.
- Flexible I/O connectivity: 174 user I/O pins with MultiVolt support provide broad interfacing capability to a variety of peripherals and voltage domains.
- Thermal-friendly package: 240-BFQFP with exposed pad supports surface-mount assembly while aiding thermal dissipation for sustained operation.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation, suitable for standard commercial embedded and industrial-adjacent applications.
Why Choose EP20K200RC240-3?
The EP20K200RC240-3 provides a balanced combination of logic capacity, embedded memory and flexible I/O in the APEX-20K FPGA family. Its MultiCore architecture and ESB resources enable designers to consolidate logic and memory-intensive functions into a single programmable device, simplifying board design and accelerating development cycles.
This device is well suited for teams building mid-to-high complexity embedded designs, memory interfaces, protocol bridges and high-speed I/O subsystems that require deterministic clocking and integrated on-chip resources. Its commercial-grade rating and surface-mount 240-BFQFP package support standard production environments and assembly flows.
Request a quote or submit an inquiry to obtain pricing and availability for EP20K200RC240-3 and to discuss how this APEX-20K FPGA can fit into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018