EP20K200RC240-3

IC FPGA 174 I/O 240RQFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 174 106496 8320 240-BFQFP Exposed Pad

Quantity 1,300 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O174Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200RC240-3 – APEX-20K FPGA, 8,320 Logic Elements, 240-BFQFP

The EP20K200RC240-3 is an APEX-20K field programmable gate array (FPGA) IC designed for system-on-programmable-chip integration. It leverages the APEX MultiCore architecture combining LUT logic, product-term logic and embedded system blocks (ESBs) to implement register-heavy functions, memory primitives and combinatorial logic.

With high logic density, embedded memory and flexible I/O and clock management, this commercial-grade FPGA targets embedded systems, high-speed interface logic, memory buffering and other designs that benefit from integrated programmable logic and on-chip resources.

Key Features

  • MultiCore architecture  Integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to support a mix of register-intensive and combinatorial functions.
  • Logic density  8,320 logic elements delivering up to 526,000 system gates for complex logic integration.
  • Embedded memory  Approximately 0.106 Mbits of on-chip RAM (106,496 bits) implemented in ESBs to support FIFOs, dual-port RAM and CAM-style functions; the family-level device includes 52 ESBs.
  • I/O and voltage support  174 user I/O pins with MultiVolt I/O interface support for interfacing to multiple voltage domains, enabling flexible system-level connectivity.
  • Flexible clock management  Advanced clock features from the APEX family including multiple PLLs, a low-skew clock tree and up to eight global clocks for deterministic timing and clock domain management.
  • High-speed interface support  Family-level features include support for high-speed memories and signaling standards (e.g., DDR SDRAM, LVDS) to enable memory interfaces and high-throughput links.
  • Package and mounting  240-BFQFP exposed pad package (240-RQFP, 32×32) designed for surface-mount assembly with an exposed pad for thermal performance.
  • Power and operating range  Specified voltage supply range 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 85 °C.
  • Low-power design  APEX 20K family devices are described for low-power operation with power-saving options available in embedded resources.

Typical Applications

  • Embedded system integration  Implement custom control, protocol offload or glue logic using on-chip LUTs and abundant logic elements to reduce external components.
  • Memory interface and buffering  Use ESBs to implement FIFOs, dual-port RAM and buffering for DDR/parallel memory interfaces and on-board data staging.
  • High-speed I/O bridging  Support for LVDS and high-speed signaling enables protocol bridging, SERDES front-ends and interface conversions where throughput and signal integrity matter.
  • Clocked data processing  Multiple PLLs and a low-skew clock tree make the device suitable for multi-clock-domain designs, data acquisition and deterministic timing tasks.

Unique Advantages

  • Highly integrated architecture:  Combines LUTs, product-term logic and ESBs to consolidate logic and memory functions on a single device, reducing BOM and board area.
  • Substantial on-chip memory:  Approximately 0.106 Mbits of embedded RAM supports FIFOs and dual-port memories, minimizing external RAM requirements for many designs.
  • Robust clock control:  Multiple PLLs and global clock resources simplify clock distribution and phase/ frequency management across complex designs.
  • Flexible I/O connectivity:  174 user I/O pins with MultiVolt support provide broad interfacing capability to a variety of peripherals and voltage domains.
  • Thermal-friendly package:  240-BFQFP with exposed pad supports surface-mount assembly while aiding thermal dissipation for sustained operation.
  • Commercial temperature rating:  Rated for 0 °C to 85 °C operation, suitable for standard commercial embedded and industrial-adjacent applications.

Why Choose EP20K200RC240-3?

The EP20K200RC240-3 provides a balanced combination of logic capacity, embedded memory and flexible I/O in the APEX-20K FPGA family. Its MultiCore architecture and ESB resources enable designers to consolidate logic and memory-intensive functions into a single programmable device, simplifying board design and accelerating development cycles.

This device is well suited for teams building mid-to-high complexity embedded designs, memory interfaces, protocol bridges and high-speed I/O subsystems that require deterministic clocking and integrated on-chip resources. Its commercial-grade rating and surface-mount 240-BFQFP package support standard production environments and assembly flows.

Request a quote or submit an inquiry to obtain pricing and availability for EP20K200RC240-3 and to discuss how this APEX-20K FPGA can fit into your next design.

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