EP20K300EBC652-2X

IC FPGA 408 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 408 147456 11520 652-BGA

Quantity 620 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O408Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1152Number of Logic Elements/Cells11520
Number of Gates728000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of EP20K300EBC652-2X – APEX-20KE® FPGA, 11,520 Logic Elements, 147,456-bit RAM, 652-BGA

The EP20K300EBC652-2X is a commercial-grade APEX 20K family field programmable gate array (FPGA) optimized for high-density, system-level integration. Built on the APEX 20K MultiCore architecture, the device combines LUT-based logic, product-term logic and embedded memory blocks to implement register‑intensive functions, FIFOs, dual-port RAM and other on-chip memory structures.

With 11,520 logic elements, approximately 147,456 bits of embedded memory and 408 user I/Os in a 652‑ball BGA package, this FPGA suits designs requiring a balance of logic density, memory and flexible I/O for embedded systems, memory interfaces and high-speed I/O bridging within commercial-temperature environments.

Key Features

  • Core Architecture — MultiCore architecture integrating LUT logic and product-term logic for register‑intensive and combinatorial functions.
  • Logic Density — 11,520 logic elements and approximately 728,000 system gates for mid-to-high density programmable logic implementations.
  • Embedded Memory — 147,456 total RAM bits (approximately 0.15 Mbits) for on‑chip FIFOs, dual‑port RAM and CAM-style implementations.
  • I/O Resources — 408 user I/Os with MultiVolt I/O support and programmable I/O features to interface with a variety of external devices and memory types.
  • Clock Management — Flexible clocking with built-in PLL capabilities, low‑skew clock tree and multiple global clock signals for synchronous system designs.
  • High‑Speed Interfaces — Family-level support for DDR SDRAM and ZBT SRAM interfaces, LVDS performance and compliance with common bus standards for 3.3‑V operation as documented in the APEX 20K family data.
  • Power and Supply — Internal/operating supply characteristics documented for APEX 20K devices; this part has a specified voltage supply range of 1.71 V to 1.89 V.
  • Package and Mounting — 652‑BGA package (45 × 45 mm ball array), surface‑mount mounting for compact board-level integration.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and supplied as a commercial-grade device.
  • Regulatory — RoHS compliant.

Typical Applications

  • Embedded Systems & SoC Integration — Implement on‑chip memory structures, glue logic and SOPC-style integrations where a mix of logic and embedded RAM are required.
  • Memory Interface and Buffering — Use the device’s embedded RAM and high‑speed I/O to implement FIFOs, DDR/ZBT interface logic and data buffering for external memory systems.
  • High-Speed I/O Bridging — Leverage MultiVolt I/O and family-level LVDS support to bridge between different voltage domains and high‑speed serial/parallel interfaces.
  • Custom Logic and Prototyping — Deploy for mid-to-high density custom logic, control logic, and prototyping where 11,520 logic elements and 408 I/Os meet system requirements.

Unique Advantages

  • High Logic and Gate Count: 11,520 logic elements and approximately 728,000 system gates provide the headroom for complex, multi-function designs.
  • Integrated Embedded Memory: 147,456 bits of on‑chip RAM enable efficient implementation of FIFOs, dual‑port RAM and small local data stores without external memory.
  • Flexible I/O and Standards Support: 408 user I/Os with MultiVolt capability and family-level support for LVDS and common memory interfaces simplify board-level integration.
  • Programmable Clocking: Built‑in PLLs and a low‑skew clock tree support robust clock distribution and frequency management for synchronous systems.
  • Compact Package: 652‑BGA (45×45) offers high pin count in a surface‑mount form factor suitable for space‑constrained PCBs.
  • Commercial-Grade Operating Range: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose EP20K300EBC652-2X?

The EP20K300EBC652-2X combines the APEX 20K family’s MultiCore programmable-logic architecture with a balance of logic density, embedded memory and extensive I/O in a single commercial-grade FPGA. Its combination of 11,520 logic elements, substantial on‑chip RAM and flexible clock and I/O capabilities makes it well suited to embedded systems, memory interface logic and mid-to-high density custom FPGA implementations.

For engineers looking to integrate memory-rich, high‑I/O logic into compact board designs, this device provides documented architecture-level features and the package and electrical characteristics appropriate for commercial applications. The APEX 20K family documentation outlines the architecture, clocking and I/O behaviors that support scalable, maintainable designs.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for EP20K300EBC652-2X. Our team can provide part availability and procurement details to support your project schedule.

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