EP20K300EFC672-1N

IC FPGA 408 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 408 147456 11520 672-BBGA

Quantity 873 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O408Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1152Number of Logic Elements/Cells11520
Number of Gates728000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of EP20K300EFC672-1N – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 408 I/O, approximately 147,456-bit embedded memory, 11,520 logic elements, 672-BBGA

The EP20K300EFC672-1N is a commercial-grade APEX-20KE series FPGA delivering a high-density, flexible programmable-logic platform. Built on the APEX MultiCore architecture, it combines look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to implement register-intensive logic, memory functions and combinatorial logic.

With 11,520 logic elements, approximately 147,456 bits of embedded memory, and 408 user I/O pins in a 672-BBGA package, this device targets complex embedded designs requiring high I/O density, multi-voltage interfacing and integrated clock management while operating over a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Architecture  MultiCore APEX-20K architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for diverse logic and memory implementations.
  • Logic Capacity  11,520 logic elements and approximately 728,000 maximum system gates support medium-to-high complexity logic designs.
  • On-chip Memory  Approximately 147,456 bits of embedded RAM provided by ESBs for FIFOs, dual-port RAM and CAM-like structures.
  • I/O Density & Flexibility  408 user I/O pins with MultiVolt I/O interface support to interface with 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling levels (series capability from datasheet).
  • Clock Management  Flexible clock circuitry with up to four PLLs, multiple global clock signals and programmable clock features for reduced skew and phase control.
  • Performance Interfaces  Series-level support for high-speed interfaces including LVDS and PCI (3.3 V operation) and direct connection to local interconnect for fast I/O timing.
  • Power & Supply  Internal supply for this part specified at 1.71 V to 1.89 V; designed with low-power operation modes in the APEX-20K family.
  • Package & Mounting  672-BBGA (supplier package 672-FBGA, 27 × 27 mm), surface-mount package for compact board layouts.
  • Commercial Grade & Compliance  Commercial operating range 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

  • Communications & Networking  Implement protocol bridging, packet processing and high-speed serial interfaces using the device’s high I/O count and LVDS-capable signaling.
  • Memory Interface & Buffering  Use embedded RAM and ESBs to build FIFOs, dual-port RAM and memory interface logic for DDR/SDRAM and other high-speed memory systems.
  • PCI-Based Systems  Leverage series support for PCI (3.3 V) to integrate programmable logic into PCI/PCI-X host or peripheral designs.
  • Embedded Control & Signal Processing  Implement control logic, signal path processing and custom peripherals where abundant logic elements and flexible clocking are required.

Unique Advantages

  • Highly integrated logic and memory: 11,520 logic elements combined with approximately 147,456 bits of embedded RAM reduce external component count and simplify board design.
  • Multi-voltage I/O support: Interfaces with a broad range of voltage domains (1.8 V–5.0 V series capability), enabling direct connectivity to mixed-voltage subsystems.
  • Advanced clocking toolkit: Multiple PLLs and programmable clock features enable low-skew clock distribution and on-chip clock multiplication/division for complex timing requirements.
  • High I/O density in a compact package: 408 user I/Os in a 672-BBGA surface-mount package offer high routing density while minimizing board footprint.
  • Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for mainstream embedded and communications products.

Why Choose EP20K300EFC672-1N?

The EP20K300EFC672-1N positions itself as a scalable, mid-to-high density FPGA solution for designers who need a balance of logic capacity, embedded memory and flexible I/O in a compact BGA package. Its APEX MultiCore architecture and series-provided clock and I/O features make it suitable for systems that integrate protocol handling, memory interfacing and custom processing blocks on a single programmable device.

Choose this device for commercial embedded projects where on-chip memory, a high count of I/Os, programmable clock management and RoHS compliance contribute to a streamlined BOM and a compact, maintainable design.

Request a quote or submit an inquiry to receive pricing and availability for EP20K300EFC672-1N. Our team can provide lead-time and ordering information to support your design timelines.

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