EP20K300EFC672-2X

The EP20K300EFC672-2X is a field-programmable gate array (FPGA) from the APEX 20K family designed for commercial-grade system integration and high-density logic applications. It implements the family’s MultiCore™ architecture—integrating look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs)—to combine configurable logic with substantial on-chip memory and I/O resources.

With 11,520 logic elements, approximately 0.15 Mbits of embedded memory, up to 408 I/O pins and a 672-ball BGA package, this device targets applications that require dense logic, flexible I/O and on-chip buffering in a compact surface-mount package.

Key Features

• Core Architecture — MultiCore™ architecture combining LUT logic, product-term logic and embedded system blocks (ESBs) for register‑ and combinatorial‑intensive functions.
• Logic Capacity — 11,520 logic elements and approximately 728,000 system gates for high-density programmable logic integration.
• On-chip Memory — Approximately 147,456 bits of embedded RAM (≈0.15 Mbits) suitable for FIFOs, dual-port RAM and content-addressable memory implementations via ESBs.
• Macrocells — 1,152 macrocells for product-term based functions and legacy macrocell implementations.
• I/O and Interfaces — 408 user I/O pins in the 672-ball BGA package; family-level I/O features include support for DDR SDRAM and ZBT SRAM, PCI (3.3 V) operation, and high-speed differential signaling such as LVDS.
• Clock Management — Flexible clock resources including up to four PLLs, a built-in low-skew clock tree and multiple global clock signals for synchronous system designs.
• Power and Supply — Designed for low-power operation; device supply listed at 1.71 V to 1.89 V.
• Package & Mounting — 672-ball BGA surface-mount package (supplier device package: 672-FBGA, 27×27 mm) for compact PCB integration.
• Operating Range — Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High‑density logic integration — Implement glue logic, protocol bridging and custom state machines using the device’s 11,520 logic elements and macrocell resources.
• Memory buffering and interfaces — Use on‑chip ESBs and embedded RAM to implement FIFOs, SRAM/DDR interface logic and data buffering close to I/O.
• High‑speed I/O controllers — Deploy in systems requiring high pin count and differential signaling support for LVDS and other high-speed interfaces.
• Clocked system functions — Leverage multiple PLLs and global clock routing for designs that require multiple clock domains or clock disciplining.

Unique Advantages

• Integrated logic and memory: The MultiCore architecture and ESBs combine LUT-based logic with sizeable on-chip RAM, reducing the need for external memory in many buffering and control applications.
• High I/O density in a compact package: 408 user I/Os in a 672-ball BGA (27×27) enable complex system interconnects while minimizing PCB area.
• Robust clocking options: Up to four PLLs and a low-skew clock tree simplify clock distribution for multi-domain designs and reduce the need for external clock management ICs.
• Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide range of commercial and industrial-adjacent systems.
• Compact surface-mount mounting: The 672-BBGA surface-mount package supports high-density board layouts and automated assembly processes.

Why Choose EP20K300EFC672-2X?

The EP20K300EFC672-2X positions itself as a high-density, commercial‑grade FPGA option within the APEX 20K family, delivering a balance of logic capacity, embedded memory and extensive I/O in a compact 672‑ball BGA package. Its MultiCore architecture and ESB memory resources make it well suited for designers who need on‑chip buffering and a mix of register‑ and combinatorial‑intensive logic.

This device is appropriate for teams building systems that require scalable logic resources, flexible clock management and high pin counts, while maintaining commercial-temperature operation and RoHS compliance. It streamlines designs where integration of logic, memory and I/O can reduce board-level complexity and component count.

Request a quote or submit an RFQ to receive pricing, availability and lead-time information for the EP20K300EFC672-2X.