EP20K300EFI672-2N

The EP20K300EFI672-2N is an APEX-20KE family FPGA from Intel, delivered in a 672-ball BGA package. This device integrates the APEX 20K MultiCore architecture — combining LUT logic, product-term logic and embedded memory — to support high-density, configurable logic implementations for industrial applications.

With 11,520 logic elements, up to 728,000 system gates, approximately 0.14 Mbits of embedded memory, and 408 user I/Os, the EP20K300EFI672-2N targets designs that require significant on-chip logic, rich I/O connectivity and robust clock management while operating across an industrial temperature range.

Key Features

• Core Architecture APEX 20K MultiCore architecture integrating look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) for flexible register- and combinatorial-intensive implementations.
• Logic Density 11,520 logic elements and a maximum of 728,000 system gates to accommodate medium-to-high complexity designs.
• Embedded Memory 147,456 RAM bits of on-chip memory (approximately 0.14 Mbits) provided by ESBs for FIFOs, dual-port RAM and content-addressable memory use cases.
• I/O Capacity & Standards 408 user I/O pins with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V, 5.0 V), PCI 3.3-V operation support, and advanced I/O standard support including LVDS and other high-speed interfaces.
• Clock Management Up to four phase-locked loops (PLLs), up to eight global clocks, low-skew clock tree and programmable features such as ClockLock, ClockBoost and ClockShift for fine-grained clock control.
• High-Speed Interfaces Support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and per-channel LVDS performance capabilities suited to demanding data paths.
• Power and Packaging Internal supply range 1.71 V to 1.89 V, surface-mount 672-BBGA package (supplier package: 672-FBGA, 27 × 27 mm), and RoHS-compliant construction.
• Industrial Temperature Range Rated for operation from –40 °C to 100 °C to meet industrial environment requirements.

Typical Applications

• Industrial Automation Use for control and signal-processing tasks that benefit from on-chip memory, extensive I/O and operation across an industrial temperature range.
• High-Speed Memory Interfaces Implementation of DDR SDRAM and ZBT SRAM controllers where embedded memory and configurable logic are required.
• PCI and Peripheral Bridging Designs requiring PCI-compliant 3.3-V interfaces or custom bridging between system buses and peripheral devices.
• High-Speed Serial Links LVDS and other high-speed I/O use cases for board-level data transport and channelized serial communications.

Unique Advantages

• High Logic Capacity: 11,520 logic elements and 728,000 gates enable implementation of complex digital systems within a single device.
• Substantial Embedded Memory: Approximately 0.14 Mbits of RAM bits in ESBs reduce external memory dependence for FIFOs, buffers and on-chip data structures.
• Flexible I/O and Standards Support: 408 I/Os with MultiVolt capability and support for LVDS, PCI and other high-speed standards simplify system integration across voltage domains.
• Robust Clocking Capabilities: Multiple PLLs and programmable clock features provide precise timing control for latency-sensitive and synchronized designs.
• Industrial Reliability: Surface-mount 672-BBGA packaging and an operating range of –40 °C to 100 °C make the device suitable for industrial deployments.
• RoHS Compliant: Environmentally compliant manufacturing reduces regulatory and supply-chain complexity.

Why Choose EP20K300EFI672-2N?

The EP20K300EFI672-2N positions itself as a versatile, mid-to-high density FPGA solution within the APEX 20KE family, combining a MultiCore programmable architecture with substantial logic, embedded memory and broad I/O capability. It is suited to engineers designing industrial systems, high-speed interfaces and memory-centric controllers who require deterministic clocking, flexible I/O and an industrial temperature rating.

Choosing this device delivers a compact, surface-mount FPGA in a 672-BBGA package with vendor-backed family features—enabling scalable designs that leverage on-chip RAM, plentiful logic elements and advanced clock management to minimize external components and simplify board-level integration.

If you would like pricing, availability, or to request a quote for EP20K300EFI672-2N, submit an inquiry or request a quote through your normal procurement channels. Our team can provide the details you need to move your design forward.