EP20K300EFC672-3

The EP20K300EFC672-3 is an APEX 20KE family FPGA providing 11,520 logic elements and approximately 0.147 Mbits of embedded memory in a 672-ball BGA package. It implements the APEX MultiCore architecture with embedded system blocks (ESBs) for integrated LUT logic and on-chip memory functions.

Designed for commercial-grade systems, this device targets designs that require dense programmable logic, extensive I/O, and integrated clock and memory resources — for example, systems using high‑speed memory interfaces and PCI-compliant I/O.

Key Features

• Core Density — 11,520 logic elements supporting a maximum of 728,000 system gates for substantial on-chip logic integration.
• Embedded Memory — 147,456 total RAM bits (approximately 0.147 Mbits) provided by ESBs for FIFOs, dual-port RAM and CAM-style functions.
• I/O Capability — 408 user I/O pins with MultiVolt interface support enabling direct interfacing to a range of signaling levels.
• Clock Management — Flexible clock resources including support for up to four PLLs and up to eight global clock signals for multi‑domain timing control.
• High-speed Interfaces — Built-in support in the family for PCI Local Bus compliance and for connecting to high-speed external memories such as DDR SDRAM and ZBT SRAM.
• Power and Voltage — Internal supply operating from 1.71 V to 1.89 V, with MultiVolt I/O options for mixed-voltage system designs.
• Package and Mounting — 672-BBGA package (supplier device package: 672-FBGA, 27×27) optimized for surface-mount assembly.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• PCI and Bus-Based Systems — Implements PCI Local Bus interfaces and bus glue logic for 3.3 V systems at 33/66 MHz and 32/64 bit configurations.
• High-Speed Memory Controllers — Acts as controller or interface logic for DDR SDRAM and ZBT SRAM, leveraging on-chip ESBs and abundant logic resources.
• High-Bandwidth I/O — Supports high-speed I/O standards including LVDS and supports bidirectional I/O performance suited for data concentrators and interface bridging.

Unique Advantages

• Significant Logic Capacity: 11,520 logic elements and 728,000 maximum system gates enable complex, consolidated logic implementations.
• Integrated On-Chip Memory: Approximately 0.147 Mbits of embedded RAM (ESBs) reduces external memory requirements for buffering and FIFO functions.
• Extensive I/O Flexibility: 408 user I/O pins with MultiVolt support simplify interconnect to multiple voltage domains and peripheral devices.
• Comprehensive Clocking: Multiple PLLs and global clocks provide the timing flexibility needed for multi‑clock‑domain designs.
• Compact BGA Packaging: 672-ball BGA (27×27 supplier footprint) offers high pin count in a compact, surface-mount form factor.
• Commercial-Grade and RoHS Compliant: 0 °C to 85 °C operating range and RoHS compliance meet common commercial product requirements.

Why Choose EP20K300EFC672-3?

The EP20K300EFC672-3 delivers a balanced combination of logic density, embedded memory, and extensive I/O in the APEX 20KE architecture. Its MultiCore ESB-based design and programmable clocking make it well suited for applications requiring integrated memory structures, high-speed interfaces and flexible timing.

For commercial systems that need consolidated programmable logic and robust interfacing options in a compact BGA package, this FPGA offers predictable scaling within the APEX 20K family and RoHS compliance for modern assembly flows.

Request a quote or submit a pricing and availability inquiry to obtain configuration details and lead-time information for the EP20K300EFC672-3.