EP20K300EFI672-2X

The EP20K300EFI672-2X is an APEX-20KE family field-programmable gate array (FPGA) optimized for high-density system integration. Built on the APEX MultiCore architecture, this device combines look-up table (LUT) logic, product-term logic and embedded system blocks to implement register‑intensive and memory functions on-chip.

Targeted for industrial applications that require dense logic, abundant I/O and robust clocking, the device delivers a compact, RoHS-compliant solution that supports complex interfaces and embedded memory while operating across a wide industrial temperature range.

Key Features

• Core Density — 11,520 logic elements and approximately 728,000 system gates provide a high-density foundation for complex logic and control functions.
• Embedded Memory — Approximately 0.147 Mbits of on-chip RAM (147,456 bits) implemented via embedded system blocks for FIFOs, dual-port RAM and CAM-style functions.
• I/O Capability — 408 user I/O pins to support multi‑interface designs and direct connections to external devices and memory.
• Clock and Timing — Family-level features include up to four PLLs, a low-skew clock tree and multiple global clocks for disciplined clock distribution and phase control.
• Flexible I/O Standards — Series-level support for high-speed interfaces and differential signalling, enabling connections to DDR SDRAM, LVDS and PCI-compliant I/O environments.
• Power and Voltage — Internal operation at low-voltage supply; device supply range specified at 1.71 V to 1.89 V for the internal core.
• Package and Mounting — 672-ball BBGA package (supplier 672-FBGA, 27 × 27) designed for surface-mount assembly.
• Industrial Temperature Rating — Specified to operate from −40°C to 100°C for demanding industrial environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implements motor-control logic, I/O aggregation and deterministic control paths where industrial temperature range and dense logic are required.
• High‑Performance Interfaces — Acts as a protocol bridge, memory controller or interface engine for DDR and high-speed serial connections using the device's flexible I/O and clocking resources.
• Embedded System Integration — Integrates multiple on-chip functions (LUT logic and embedded memory) to consolidate system functions and reduce board-level components.
• Communications and Networking — Enables packet processing, buffering and timing management leveraging abundant logic, embedded RAM and disciplined clock resources.

Unique Advantages

• High Logic Capacity: 11,520 logic elements provide the headroom to implement complex state machines, datapaths and control logic without external ASIC support.
• On‑Chip Memory Integration: Approximately 0.147 Mbits of embedded RAM reduces reliance on external memory for FIFOs and buffering, simplifying board design.
• Robust I/O Count: 408 I/O pins support multiple parallel interfaces and densely routed systems, minimizing the need for external IO expanders.
• Industrial Reliability: Rated for −40°C to 100°C operation, the device suits industrial deployments that require extended temperature endurance.
• Compact Package: 672-BBGA (27 × 27) saves PCB area while supporting a high pin count for I/O and power delivery.

Why Choose EP20K300EFI672-2X?

The EP20K300EFI672-2X positions itself as a high-density, integrated FPGA option within the APEX-20KE family, combining substantial logic resources, embedded memory and extensive I/O in a single surface-mount 672-ball package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded systems and industrial electronics.

Designers seeking to consolidate functionality, reduce BOM complexity and implement disciplined clocking and interface control will find the device well suited for mid- to high-complexity designs where on-chip memory and a high I/O count are important.

Request a quote or submit an inquiry to receive pricing and availability for the EP20K300EFI672-2X and to discuss how this device can fit your next design.