EP20K300EFC672-3N

The EP20K300EFC672-3N is an APEX 20K family field programmable gate array (FPGA) manufactured by Intel. It implements the MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory to support system-on-a-programmable-chip (SOPC) integration and mixed logic/memory functions.

With 11,520 logic elements, approximately 147,456 bits of embedded memory, and up to 408 user I/Os in a 672-ball BGA package, this device targets applications requiring on-chip memory, dense logic integration, and flexible I/O and clock management while operating from a low-voltage core supply.

Key Features

• Core architecture  MultiCore architecture combining LUT logic, product-term logic, and embedded system blocks (ESBs) for implementing register-intensive and memory-intensive functions including FIFOs and CAMs.
• Logic capacity  11,520 logic elements and approximately 728,000 system gates provide mid-range programmable logic density for complex glue logic and subsystem integration.
• Embedded memory  Approximately 147,456 bits of on-chip RAM available for data buffers, FIFOs, and small RAM structures without reducing logic availability.
• I/O and interfaces  Up to 408 user I/Os with MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V, and 5.0 V levels) and support for high-speed interfaces including LVDS and PCI (3.3 V operation).
• Clock management  Flexible clock resources with up to four phase-locked loops (PLLs), a low-skew clock tree, and programmable clock phase/delay features for precise timing control.
• Power and voltage  Designed for low-power operation with an internal supply around 1.8 V and supported operating supply range of 1.71 V to 1.89 V for the core.
• Package and thermal  672-ball BGA package (supplier package 672-FBGA, 27×27) in a commercial-grade temperature range of 0 °C to 85 °C and surface-mount mounting type.
• Standards and compliance  RoHS-compliant device that includes JTAG boundary-scan support for test access.

Typical Applications

• Memory interface controllers  Use the on-chip ESBs and I/O performance to implement DDR SDRAM and ZBT SRAM controllers and buffering logic where embedded RAM and deterministic timing are required.
• High-speed I/O and protocol bridging  Leverage MultiVolt I/O and LVDS capability for protocol conversion, PCI interfaces, and high-speed serial or parallel links.
• Embedded system integration  Implement SOPC-style subsystems that combine logic, FIFOs, and dual-port RAM for compact, single-chip subsystem implementations.
• Clocked datapath and signal processing  Use the device’s dedicated carry chains, multiple global clocks, and PLLs to build arithmetic datapaths and timing-critical signal processing blocks.

Unique Advantages

• MultiCore integration:  Combines LUT logic, product-term logic, and embedded memory to reduce external component count and simplify board-level design.
• Mid-range density with substantial RAM:  11,520 logic elements alongside approximately 147,456 bits of RAM enable compact implementation of logic plus buffering or small memories on-chip.
• Flexible I/O signaling:  MultiVolt I/O support and high-speed interface compatibility allow direct interfacing to a wide range of peripheral voltages and protocols.
• Advanced clocking:  Up to four PLLs and programmable clock features provide precise timing control for synchronous designs and multi-clock domains.
• Commercial temperature and RoHS compliance:  Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance support standard embedded and enterprise applications.

Why Choose EP20K300EFC672-3N?

The EP20K300EFC672-3N positions itself as a versatile mid-density FPGA option within the APEX 20K family, offering a balanced combination of logic capacity, embedded memory, and flexible I/O in a 672-BBGA package. Its MultiCore architecture and on-chip ESBs make it suitable for designs that require integrated memory functions alongside LUT-based logic.

This device is well suited to teams building embedded controllers, memory interfaces, and protocol bridges who need a commercially graded, RoHS-compliant FPGA with advanced clock management and MultiVolt I/O support. Its feature set supports scalable subsystem integration while keeping board-level complexity and BOM count lower.

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