EP20K300EQC240-2

IC FPGA 152 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 152 147456 11520 240-BFQFP

Quantity 99 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O152Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1152Number of Logic Elements/Cells11520
Number of Gates728000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of EP20K300EQC240-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 152 147456 11520 240-BFQFP

The EP20K300EQC240-2 is an APEX 20K family FPGA offered by Intel, delivering a MultiCore™ architecture that integrates lookup-table (LUT) logic, product-term logic and embedded memory blocks. This commercial-grade, surface-mount FPGA targets applications that require dense logic, embedded RAM and flexible I/O in a 240-BFQFP (240-PQFP 32×32) package.

Key value comes from the device’s combination of logic capacity, on-chip memory and built-in clock and I/O features, enabling configurable system-on-a-programmable-chip designs where integration, predictable timing and multi-voltage I/O support are important.

Key Features

  • Logic Capacity — 11,520 logic elements providing the combinational and sequential resources for register‑intensive and control logic implementations.
  • On‑chip Memory — Approximately 0.147 Mbits (147,456 bits) of embedded RAM suitable for FIFOs, dual-port RAM and CAM-style functions via the device’s embedded system blocks (ESBs).
  • System Gates — Device-level capacity up to 728,000 system gates with typical device utilization around 300,000 gates, as defined for the EP20K300E family member.
  • I/O Count and Flexibility — 152 user I/O pins on the packaged device, with MultiVolt™ I/O interface support described for the APEX 20K family to interface across multiple I/O voltage domains.
  • Clock and Timing Features — Family-level clock capabilities include up to four PLLs, a built-in low‑skew clock tree and multiple global clock resources to support complex timing domains.
  • Package and Mounting — 240‑pin BFQFP (240‑PQFP 32×32) surface-mount package for compact board-level integration.
  • Power and Supply — Internal supply and operating characteristics in the 1.71 V to 1.89 V range per the product specification, designed for low‑power operation modes available in the family.
  • Commercial Temperature Range — Rated for operation from 0 °C to 85 °C, suitable for a wide range of commercial applications.
  • Standards and Compliance — RoHS‑compliant device for environmental regulatory requirements.

Typical Applications

  • Embedded Memory and Buffering — Use the ESB-based embedded RAM to implement FIFOs, dual-port RAM or CAM functions for data buffering and packet handling.
  • High‑performance Glue Logic — Implement custom datapaths, protocol adapters and control logic leveraging 11,520 logic elements for system integration and feature consolidation.
  • PCI and Peripheral Interfaces — Leverage family-level support for PCI 3.3‑V operation to implement host/peripheral bridging and bus interface logic (as described for the APEX 20K family).
  • Clocked Systems and Timing Control — Use on-chip PLLs and global clock resources to manage multiple clock domains, clock multiplication/division and phase shifting in complex digital systems.

Unique Advantages

  • High Logic Density: 11,520 logic elements and up to 728,000 system gates enable substantial on-chip integration to reduce external logic and BOM.
  • Embedded Memory Resources: Approximately 0.147 Mbits of RAM in ESBs supports on‑chip buffering and memory functions without consuming logic element resources.
  • Flexible I/O in a Compact Package: 152 user I/Os in a 240‑pin BFQFP package provide a balance of connectivity and board‑space efficiency for commercial designs.
  • Built‑in Clock Management: Family features such as multiple PLLs, low‑skew clock tree and programmable clock shift/multiply functions simplify multi‑domain timing architectures.
  • Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS‑compliant for mainstream, environmentally conscious products.

Why Choose EP20K300EQC240-2?

The EP20K300EQC240-2 positions itself as a capable, commercially graded FPGA for designs that demand a mix of moderate-to-high logic capacity, embedded memory and robust clock/I/O features in a compact surface‑mount package. Its APEX 20K family architecture supports register-intensive LUT logic and ESB‑based memory and product‑term functions, enabling designers to consolidate functionality and reduce external components.

This part is well suited to engineering teams developing commercial electronics that require predictable timing, multi‑voltage I/O interfacing and on‑chip buffering—delivering a scalable platform within the APEX 20K family and backed by the family’s documented feature set.

Request a quote or submit a pricing inquiry for EP20K300EQC240-2 to discuss availability and volume options for your design needs.

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