EP20K300ERC240-1X

The EP20K300ERC240-1X is an Intel APEX-20KE family field programmable gate array (FPGA) in a 240-BFQFP exposed-pad surface-mount package. It combines a MultiCore architecture with embedded system blocks to deliver a balance of logic capacity, on-chip memory, and flexible I/O for mid-density programmable logic designs.

Targeted at commercial applications, this device supports designs that require up to 11,520 logic elements, approximately 147,456 bits of embedded memory, and 152 user I/O pins, while operating from a 1.71 V to 1.89 V internal supply and a 0 °C to 85 °C operating range.

Key Features

• Core & Logic  Approximately 11,520 logic elements and up to 728,000 system gates provide mid-range programmable logic capacity for control, glue-logic, and embedded processing functions.
• Embedded Memory  Approximately 147,456 bits of on-chip RAM (embedded system blocks) for FIFOs, dual-port RAM, and CAM implementations.
• I/O & Interfaces  152 user I/O pins with MultiVolt I/O interface support (series-level capability) and features for high-speed interfaces and LVDS signaling as documented in the APEX-20K family.
• Clocking & Timing  Series-level clock management features include multiple PLLs, a low-skew clock tree, and programmable phase/delay shifting for precise timing control.
• Power & Voltage  Internal supply range 1.71 V to 1.89 V; designed for low-power operation within the APEX-20K family architecture.
• Package & Mounting  240-BFQFP with exposed pad (supplier package 240-RQFP, 32×32), surface-mount mounting suitable for compact PCB layouts.
• Commercial Grade  Rated for commercial temperature operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Memory Interface Controllers  Implement DDR SDRAM or ZBT SRAM controllers using the device’s embedded memory and high-speed I/O capabilities.
• PCI/Bus Bridging  Use for peripheral or bus interface logic that requires PCI-compliant signaling and flexible I/O levels.
• Data Acquisition and Processing  On-chip RAM and a dense logic fabric make the device suitable for buffering, preprocessing, and aggregation tasks in data acquisition systems.
• High-speed Serial Links  Leverage LVDS-capable I/O and clock management features for multi-channel serial data transport and aggregation.

Unique Advantages

• Integrated MultiCore Architecture: Combines LUT-based logic and embedded system blocks so register-intensive and memory-intensive functions can coexist on-chip, reducing external components.
• Balanced Logic and Memory Capacity: ~11,520 logic elements paired with ~147,456 bits of embedded RAM supports mixed-control and buffering designs without compromising logic availability.
• Flexible I/O Support: Series-level MultiVolt I/O and advanced signaling support enable straightforward interfacing with a range of external devices and memory technologies.
• Compact, Serviceable Package: 240-BFQFP exposed-pad package offers a compact footprint with thermal pad for improved board-level thermal performance.
• Commercial Suitability: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics and embedded applications.

Why Choose EP20K300ERC240-1X?

The EP20K300ERC240-1X positions itself as a mid-density APEX-20KE FPGA option that blends substantial logic resources with meaningful on-chip memory and flexible I/O in a compact surface-mount package. Its architecture supports a range of control, interface, and buffering tasks, making it suitable for engineers building memory controllers, bus bridges, data concentrators, and other embedded designs that require integrated logic and RAM.

For teams seeking a commercially rated programmable device with established family-level features—such as multiple PLLs, MultiVolt I/O support, and embedded system blocks—this part provides a practical combination of capacity, integration, and package density to simplify board-level design and reduce external BOM count.

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