EP20K300EQC240-3

The EP20K300EQC240-3 is an APEX-20KE family FPGA offered in a 240-BFQFP surface-mount package. It combines a high gate count and dense logic with embedded memory and flexible I/O to address programmable-logic tasks across commercial embedded systems and complex digital designs. This device targets applications that require substantial on-chip logic resources, integrated memory, and configurable interfacing while operating within a commercial temperature range.

Key Features

• Core logic density — Provides 11,520 logic elements and approximately 728,000 system gates to implement substantial combinational and sequential logic.
• Embedded memory — Includes 147,456 total RAM bits (approximately 0.147 Mbits) suitable for FIFOs, dual-port RAM, and other on-chip storage needs.
• I/O capability — 152 user I/O pins support flexible interfacing for peripherals and external devices.
• Clock and timing — Family-level documentation describes integrated clock management features such as multiple PLLs and a low-skew clock tree for predictable timing (feature present in the APEX-20K family).
• Power and supply — Internal supply and operating range tied to a VCCINT of approximately 1.8 V with a specified device supply range of 1.71 V to 1.89 V for this part.
• Package and mounting — Supplied in a 240-BFQFP (240-PQFP, 32×32) surface-mount package for board-level assembly and compact system integration.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• Environmental compliance — RoHS-compliant manufacturing status.

Typical Applications

• Embedded controllers — Use the device to implement custom control logic, state machines, and peripheral bridging in commercial embedded systems.
• Data buffering and packet handling — On-chip RAM and dense logic enable FIFO and buffering functions for stream processing and modest packet-handling tasks.
• Interface and protocol conversion — Flexible I/O pin count supports building protocol adapters and glue logic between different voltage domains and external peripherals.
• Prototyping and development — Suitable for prototype systems requiring significant programmable logic and memory in a compact BFQFP package.

Unique Advantages

• High on-chip integration: 11,520 logic elements combined with 147,456 bits of embedded RAM reduce dependence on external components and lower system BOM complexity.
• Substantial gate capacity: Approximately 728,000 gates enables implementation of complex digital functions within a single device.
• Flexible interfacing: 152 user I/O pins provide the pin count needed to connect multiple peripherals without large external glue logic.
• Commercial temperature suitability: Rated 0 °C to 85 °C to match common commercial deployment and testing profiles.
• Standard surface-mount packaging: The 240-BFQFP (32×32) package simplifies PCB design and assembly for compact boards.
• RoHS compliant: Meets lead-free manufacturing requirements for environmentally conscious designs.

Why Choose EP20K300EQC240-3?

The EP20K300EQC240-3 positions itself as a high-density, commercially rated FPGA that balances abundant logic resources and embedded memory with a compact BFQFP package. It is well suited for designers who need substantial on-chip capacity for complex logic, buffering, and protocol interfacing while maintaining a standard commercial operating range.

Choosing this device supports design scalability within the APEX-20K family, enabling reuse of architecture-level features such as embedded memory and family-provided clocking resources while keeping board-level BOM and footprint considerations in check.

Request a quote or submit an inquiry to receive pricing, availability, and delivery information for the EP20K300EQC240-3. Our team can assist with lead times and volume requirements to support your design or production planning.