EP20K300EQI240-3

IC FPGA 152 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 152 147456 11520 240-BFQFP

Quantity 181 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O152Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1152Number of Logic Elements/Cells11520
Number of Gates728000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits147456

Overview of EP20K300EQI240-3 – APEX-20KE® FPGA, 11,520 logic elements, 152 I/O, 240-BFQFP

The EP20K300EQI240-3 is an APEX-20KE® field programmable gate array (FPGA) in a 240-pin BFQFP surface-mount package. It implements the APEX 20K family MultiCore architecture combining LUT-based logic and embedded system blocks (ESBs) to support register-intensive and memory-intensive functions on a single device.

With 11,520 logic elements, approximately 147,456 bits of on-chip RAM, up to 728,000 gates of logic capacity and 152 user I/O pins, this device targets high-density, I/O-rich embedded and industrial applications that require integrated memory, flexible clocking and robust I/O support.

Key Features

  • Core architecture — APEX-20KE MultiCore architecture integrating LUT logic and product-term logic for a mix of register- and combinatorial-intensive functions.
  • Logic resources — 11,520 logic elements (LEs) and a stated capacity of 728,000 gates for medium-to-high density logic implementation.
  • Embedded memory — Approximately 0.15 Mbits of on-chip RAM (147,456 bits) with ESB structures usable for FIFO, dual-port RAM and CAM-style memory functions.
  • I/O and interface flexibility — 152 user I/O pins; family-level support for MultiVolt I/O levels (1.8 V, 2.5 V, 3.3 V and 5.0 V) to interface with a range of external devices, and support for high-speed I/O standards per the APEX 20K family data.
  • Clock management — Family features include up to four phase-locked loops (PLLs), a low-skew clock tree and programmable clock phase/delay features for tight timing control.
  • Package and mounting — Surface-mount device in a 240-BFQFP package (supplier device package: 240-PQFP, 32 × 32 mm footprint) for production-ready PCB assembly.
  • Power and supply — Device internal supply specified at 1.71 V to 1.89 V; family-level low-power design options and programmable ESB power-saving modes.
  • Operational range and compliance — Industrial grade with an operating temperature range of −40 °C to 100 °C; RoHS compliant.

Typical Applications

  • Embedded systems and SOPC integration — Use the APEX-20KE MultiCore architecture and ESBs to consolidate logic and on-chip memory for system-on-programmable-chip designs.
  • High-speed memory interfaces — Implement DDR/parallel memory controllers and FIFO buffering using embedded RAM and ESBs for memory-intensive applications.
  • Bus and I/O bridging (PCI and high-speed interfaces) — Family-level support for PCI and high-speed I/O standards enables implementation of protocol bridges and I/O-intensive subsystems.
  • Industrial control and automation — Industrial-grade temperature range and flexible I/O make the device suitable for control logic, motor drives and sensor aggregation in harsh environments.

Unique Advantages

  • Integrated memory and logic — ESBs provide embedded RAM and product-term logic, enabling on-chip FIFOs and dual-port memories to reduce external component count.
  • Substantial logic capacity — 11,520 logic elements and 728,000 gates allow consolidation of complex logic into a single FPGA, simplifying board-level designs.
  • Flexible I/O interfacing — 152 user I/Os and family-level MultiVolt I/O support enable direct interfacing with a wide range of peripherals and voltage domains.
  • Robust clocking features — Multiple PLLs, global clocks and programmable phase/delay controls help meet demanding timing and multi-clock-domain requirements.
  • Industrial operating range — −40 °C to 100 °C specification supports deployment in temperature-challenging environments.
  • Compact production package — 240-BFQFP surface-mount packaging provides a production-ready form factor for space-constrained PCBs.

Why Choose EP20K300EQI240-3?

The EP20K300EQI240-3 brings APEX-20KE family integration to mid-to-high density designs that require a balance of logic, embedded memory and flexible I/O. Its MultiCore architecture and ESB-based memory primitives let designers implement complex buffering, dual-port RAM and CAM structures on-chip, reducing external BOM and simplifying board layout.

With industrial temperature rating, a compact 240-pin BFQFP package and family-proven clocking and interface features, this device is suited to engineers building embedded systems, industrial controllers and I/O-intensive subsystems that demand integrated memory, predictable clocking and flexible voltage interfacing.

Request a quote or submit a procurement request to evaluate the EP20K300EQI240-3 for your next design.

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