EP20K300EQC240-1

IC FPGA 152 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 152 147456 11520 240-BFQFP

Quantity 151 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O152Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1152Number of Logic Elements/Cells11520
Number of Gates728000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of EP20K300EQC240-1 – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 152 I/O, ~147,456-bit RAM, 11,520 logic elements, 240-BFQFP

The EP20K300EQC240-1 is an APEX-20KE family FPGA delivering high-density programmable logic with embedded memory and flexible I/O. It leverages the APEX MultiCore architecture that integrates lookup-table (LUT) logic, product-term logic and embedded system blocks for memory and combinatorial functions.

Targeted at designs that require substantial logic capacity, on-chip RAM, and multi‑voltage I/O support, this commercial-grade device provides system integration capabilities for applications such as SOPC-style embedded systems, high-speed memory interfaces, and bus bridging.

Key Features

  • Core Capacity — 11,520 logic elements and approximately 728,000 gates provide substantial programmable logic for complex digital designs.
  • Embedded Memory — Approximately 147,456 bits of on-chip RAM available for FIFOs, dual-port RAM and other memory functions.
  • I/O and Package — 152 user I/O pins in a 240-BFQFP (240-PQFP, 32×32) surface-mount package for dense board-level integration.
  • Power Supply — Internal voltage supply range of 1.71 V to 1.89 V consistent with APEX-20KE device internal VCCINT requirements.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to meet standard commercial applications.
  • Low-Power Design Features — Architecture and ESB options designed for lower-power operation and programmable power-saving modes.
  • Flexible Clocking — Family-level clock management features include multiple PLLs, a low-skew clock tree and programmable phase/delay controls.
  • Advanced I/O Standards Support — Family supports MultiVolt I/O interfaces and a range of high-speed standards for robust system interfacing.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Embedded System Integration — Implement SOPC-style embedded functions and custom peripherals using LUT logic and embedded system blocks for memory.
  • High-Speed Memory Interfaces — Use the device’s embedded RAM and I/O capabilities to support DDR and other high-speed external memory controllers.
  • Bus and Peripheral Bridging — Create PCI/PCI‑compatible interfaces and custom bus bridges leveraging the device’s flexible I/O standards and clock features.
  • Signal Processing and Data Aggregation — Implement wide combinatorial and register‑intensive functions using the LUT and product‑term resources.

Unique Advantages

  • Substantial Logic and Gate Count: 11,520 logic elements and ~728,000 gates enable implementation of complex, high‑density logic designs.
  • Significant On‑Chip Memory: Approximately 147,456 bits of embedded memory reduce external RAM dependence for FIFOs, buffers and local storage.
  • Multi‑Voltage I/O Flexibility: Designed to interface with a range of I/O voltage domains to simplify mixed‑voltage system designs.
  • Programmable Clock Management: Built-in PLL and clock-tree features provide low-skew distribution and programmable clock phase/delay for timing-critical applications.
  • Package Density: 240-BFQFP surface-mount package (240-PQFP, 32×32) balances I/O count and board-level density for compact designs.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP20K300EQC240-1?

The EP20K300EQC240-1 sits within the APEX-20KE family to offer a balance of high logic capacity, embedded memory and flexible I/O in a commercial-grade FPGA package. Its MultiCore architecture and on-chip resources make it suitable for designs that combine significant logic, memory buffering and complex I/O interfacing without immediate reliance on external components.

This device is well suited for engineers and procurement teams building embedded systems, memory interface controllers, and bus-interface logic that require a proven APEX-20K architecture with programmable clocking, power-saving options and a compact 240-BFQFP package.

Request a quote or submit an RFQ to receive pricing and availability information for the EP20K300EQC240-1. Our team can provide detailed ordering and lead-time support to help move your design forward.

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